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D. Moya

Publications and source records attributed to D. Moya.

3 recordsLinked to original sources

First study of small-cell 3D Silicon Pixel Detectors for the High Luminosity LHC

A study of 3D pixel sensors of cell size 50 μm x 50 μm fabricated at IMB-CNM using double-sided n-on-p 3D technology is presented. Sensors were bump-bonded to the ROC4SENS readout chip. For the first time in such a small-pitch hybrid assembly, the sensor response to ionizing radiation in a test beam of 5.6 GeV electrons was studied. Results for non-irradiated sensors are presented, including efficiency, charge sharing, signal-to-noise, and resolution for different incidence angles.

physics.ins-det

Higgs Physics at the CLIC Electron-Positron Linear Collider

The Compact Linear Collider (CLIC) is an option for a future e+e- collider operating at centre-of-mass energies up to 3 TeV, providing sensitivity to a wide range of new physics phenomena and precision physics measurements at the energy frontier. This paper is the first comprehensive presentation of the Higgs physics reach of CLIC operating at three energy stages: sqrt(s) = 350 GeV, 1.4 TeV and 3 TeV. The initial stage of operation allows the study of Higgs boson production in Higgsstrahlung (e+e- -> ZH) and WW-fusion (e+e- -> Hnunu), resulting in precise measurements of the production cross sections, the Higgs total decay width Gamma_H, and model-independent determinations of the Higgs couplings. Operation at sqrt(s) > 1 TeV provides high-statistics samples of Higgs bosons produced through WW-fusion, enabling tight constraints on the Higgs boson couplings. Studies of the rarer processes e+e- -> ttH and e+e- -> HHnunu allow measurements of the top Yukawa coupling and the Higgs boson self-coupling. This paper presents detailed studies of the precision achievable with Higgs measurements at CLIC and describes the interpretation of these measurements in a global fit.

hep-ex

DEPFET active pixel detectors for a future linear $e^+e^-$ collider

The DEPFET collaboration develops highly granular, ultra-transparent active pixel detectors for high-performance vertex reconstruction at future collider experiments. The characterization of detector prototypes has proven that the key principle, the integration of a first amplification stage in a detector-grade sensor material, can provide a comfortable signal to noise ratio of over 40 for a sensor thickness of 50-75 $\mathrm{\mathbf{μm}}$. ASICs have been designed and produced to operate a DEPFET pixel detector with the required read-out speed. A complete detector concept is being developed, including solutions for mechanical support, cooling and services. In this paper the status of DEPFET R & D project is reviewed in the light of the requirements of the vertex detector at a future linear $\mathbf{e^+ e^-}$ collider.

physics.ins-det