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Debaleen Biswas

Publications and source records attributed to Debaleen Biswas.

2 recordsLinked to original sources

Size and density controlled metal nanocluster embedded metal-oxide-semiconductor structure for memory applications

Metal-nanoclusters (NC), deposited by magnetron-based nanocluster source coupled with quadrupole mass filter (QMF) assembly having independent control over its size and density, are used in fabricating NC-based non-volatile memory (NVM) devices. The effect of diameter and density on the NVM charge storage characteristics are presented where Ag is used as the metal NC. The Ag-NC, sandwiched between HfO$_2$ tunnel and control oxides, is deposited by using the combination of the above two instruments. No annealing is performed at any stage of the device fabrication. The largest hysteresis loop area in the capacitance-voltage ($C-V$) characteristics of metal-oxide-semiconductor (MOS) characteristics is observed for a cluster density of 1 $\times$ 10$^{11}$ cm$^{-2}$. Further, an NC size dependent hysteresis loop area is observed with the MOS devices where the NC diameter is varied from 3 to 1.5 nm keeping the NC density at 1 $\times$ 10$^{11}$ cm$^{-2}$. The device performance is found to be improved with a reduction of the NC size and shows its best with the NC diameter of 1.5 nm. The storage time of the NVM devices also increases with the decrease in the NC diameter and exhibits their best performances for the NCs with a diameter of 1.5 nm.

cond-mat.mtrl-sci

Identification of annealing temperature for high-$κ$-based gate oxides using differential scanning calorimetry

This article identifies the process of crystallization of thin high-$κ$ dielectric films and an optimal range of annealing temperature in the field of high-$κ$ dielectric-based metal-oxide-semiconductor (MOS) technology for its improved electrical performances. Differential Scanning Calorimetry (DSC) technique is employed to understand the thermal behaviour of thin high-$κ$ dielectric films of HfO$_2$, deposited by rf sputtering, on Si. The exothermic trends of the DSC signal and Grazing Incidence X-ray diffraction (GIXRD) data indicate an amorphous to crystalline transition in the high-$κ$ film at higher temperature. The enthalpy-temperature variation shows a glass temperature (T$_g$) at $\sim$ 590 $^o$C beyond which an amorphous to m-HfO$_2$ crystalline transition takes place. Further, the Hf-Silicate formation, observed in DSC measurement and corroborated by Fourier transformed Infrared Spectroscopy (FT-IR) studies, indicates that the process of formation of Hf-Silicate begins at $\sim$ 717 $^oC$. High-frequency (HF) capacitance-voltage $(C-V)$ and current density - voltage $(J-V)$ characteristics establish that the crystallization of the film is not the root cause of degradation of the electrical properties of the high-$κ$-based MOS devices, rather the device degrades due to formation of interfacial Hf-Silicate.

cond-mat.mtrl-sci