Searcharxiv⌕ Search

arXiv subjects

Eric Pop

Publications and source records attributed to Eric Pop.

At least 91 records · Page 5Linked to original sources

Thermal Transport Across Graphene Step Junctions

Step junctions are often present in layered materials, i.e. where single-layer regions meet multi-layer regions, yet their effect on thermal transport is not understood to date. Here, we measure heat flow across graphene junctions (GJs) from monolayer to bilayer graphene, as well as bilayer to four-layer graphene for the first time, in both heat flow directions. The thermal conductance of the monolayer-bilayer GJ device ranges from ~0.5 to 9.1x10^8 Wm-2K-1 between 50 K to 300 K. Atomistic simulations of such GJ device reveal that graphene layers are relatively decoupled, and the low thermal conductance of the device is determined by the resistance between the two dis-tinct graphene layers. In these conditions the junction plays a negligible effect. To prove that the decoupling between layers controls thermal transport in the junction, the heat flow in both directions was measured, showing no evidence of thermal asymmetry or rectification (within experimental error bars). For large-area graphene applications, this signifies that small bilayer (or multilayer) islands have little or no contribution to overall thermal transport.

cond-mat.mes-hall↗

Thermal Transport in MoS$_2$ from Molecular Dynamics using Different Empirical Potentials

Thermal properties of molybdenum disulfide (MoS$_2$) have recently attracted attention related to fundamentals of heat propagation in strongly anisotropic materials, and in the context of potential applications to optoelectronics and thermoelectrics. Multiple empirical potentials have been developed for classical molecular dynamics (MD) simulations of this material, but it has been unclear which provides the most realistic results. Here, we calculate lattice thermal conductivity of single- and multi-layer pristine MoS$_2$ by employing three different thermal transport MD methods: equilibrium, nonequilibrium, and homogeneous nonequilibrium ones. These methods allow us to verify the consistency of our results and also facilitate comparisons with previous works, where different schemes have been adopted. Our results using variants of the Stillinger-Weber potential are at odds with some previous ones and we analyze the possible origins of the discrepancies in detail. We show that, among the potentials considered here, the reactive empirical bond order (REBO) potential gives the most reasonable predictions of thermal transport properties as compared to experimental data. With the REBO potential, we further find that isotope scattering has only a small effect on thermal conduction in MoS$_2$ and the in-plane thermal conductivity decreases with increasing layer number and saturates beyond about three layers. We identify the REBO potential as a transferable empirical potential for MD simulations of MoS$_2$ which can be used to study thermal transport properties in more complicated situations such as in systems containing defects or engineered nanoscale features. This work establishes a firm foundation for understanding heat transport properties of MoS$_2$ using MD simulations.

cond-mat.mtrl-sci↗

The Heat Conduction Renaissance

Some of the most exciting recent advancements in heat conduction physics have been motivated, enabled, or achieved by the thermal management community that ITherm serves so effectively. In this paper we highlight the resulting renaissance in basic heat conduction research, which is linked to cooling challenges from power transistors to portables. Examples include phonon transport and scattering in nanotransistors, engineered high-conductivity composites, modulated conductivity through phase transitions, as well as the surprising transport properties of low-dimensional (1D and 2D) nanomaterials. This work benefits strongly from decades of collaboration and leadership from the semiconductor industry.

physics.app-ph↗

Tuning Electrical and Thermal Transport in AlGaN/GaN Heterostructures via Buffer Layer Engineering

Over the last decade, progress in wide bandgap, III-V materials systems based on gallium nitride (GaN) has been a major driver in the realization of high power and high frequency electronic devices. Since the highly conductive, two-dimensional electron gas (2DEG) at the AlGaN/GaN interface is based on built-in polarization fields (not doping) and is confined to very small thicknesses, its charge carriers exhibit much higher mobilities in comparison to their doped counterparts. In this study, we show that this heterostructured material also offers the unique ability to manipulate electrical transport separately from thermal transport through the examination of fully-suspended AlGaN/GaN diaphragms of varied GaN buffer layer thicknesses. Notably, we show that ~$100$ nm thin GaN layers can considerably impede heat flow without electrical transport degradation, and that a significant improvement (~$4$x) in the thermoelectric figure of merit ($\it zT$) over externally doped GaN is observed in 2DEG based heterostructures. We also observe state-of-the art thermoelectric power factors ($4-7\times$ $10^{-3}$$\,Wm^{-1}K^{-2}$) at room temperature) in the 2DEG of this material system. This remarkable tuning behavior and thermoelectric enhancement, elucidated here for the first time in a polarization-based heterostructure, is achieved since the electrons are at the heterostructured interface, while the phonons are within the material system. These results highlight the potential for using the 2DEG in III-V materials for on-chip thermal sensing and energy harvesting.

cond-mat.mtrl-sci↗

Size Dependence and Ballistic Limits of Thermal Transport in Anisotropic Layered Two-Dimensional Materials

Layered materials have uncommonly anisotropic thermal properties due to their strong in-plane covalent bonds and weak out-of-plane van der Waals interactions. Here we examine heat flow in graphene (graphite), h-BN, MoS2, and WS2 monolayers and bulk films, from diffusive to ballistic limits. We determine the ballistic thermal conductance limit (Gball) both in-plane and out-of-plane, based on full phonon dispersions from first-principles calculations. An overall phonon mean free path (λ) is expressed in terms of Gball and the diffusive thermal conductivity, consistent with kinetic theory if proper averaging of phonon group velocity is used. We obtain a size-dependent thermal conductivity k(L) in agreement with available experiments, and find that k(L) only converges to >90% of the diffusive thermal conductivity for sample sizes L > 16λ, which ranges from ~140 nm for MoS2 cross-plane to ~10 um for suspended graphene in-plane. These results provide a deeper understanding of microscopic thermal transport, revealing that device scales below which thermal size effects should be taken into account are generally larger than previously thought.

cond-mat.mes-hall↗

Bright visible light emission from graphene

Graphene and related two-dimensional materials are promising candidates for atomically thin, flexible, and transparent optoelectronics. In particular, the strong light-matter interaction in graphene has allowed for the development of state-of-the-art photodetectors, optical modulators, and plasmonic devices. In addition, electrically biased graphene on SiO2 substrates can be used as a low-efficiency emitter in the mid-infrared range. However, emission in the visible range has remained elusive. Here we report the observation of bright visible-light emission from electrically biased suspended graphenes. In these devices, heat transport is greatly minimised; thus hot electrons (~ 2800 K) become spatially localised at the centre of graphene layer, resulting in a 1000-fold enhancement in the thermal radiation efficiency. Moreover, strong optical interference between the suspended graphene and substrate can be utilized to tune the emission spectrum. We also demonstrate the scalability of this technique by realizing arrays of chemical-vapour-deposited graphene bright visible-light emitters. These results pave the way towards the realisation of commercially viable large-scale, atomically-thin, flexible and transparent light emitters and displays with low-operation voltage, and graphene-based, on-chip ultrafast optical communications.

cond-mat.mes-hall↗

Scalable Fabrication of Atomically Thin Monolayer MoS2 Photodetectors

Scalable fabrication of high quality photodetectors derived from synthetically grown monolayer transition metal dichalcogenides is highly desired and important for wide range of nanophotonics applications. We present here scalable fabrication of monolayer MoS2 photodetectors on sapphire substrates through an efficient process, which includes growing large scale monolayer MoS2 via chemical vapor deposition (CVD), and multi-step optical lithography for device patterning and high quality metal electrodes fabrication. In every measured device, we observed the following universal features: (i) negligible dark current $(I_{dark}\leqslant10 fA)$; (ii) sharp peaks in photocurrent at $\sim$1.9eV and $\sim$2.1eV attributable to the optical transitions due to band edge excitons; (iii) a rapid onset of photocurrent above $\sim$2.5eV peaked at $\sim$2.9eV due to an excitonic absorption originating from the van Hove singularity of MoS$_2$. We observe low ($\leqslant 300\%$) device-to-device variation of photoresponsivity. Furthermore, we observe very fast rise time $\sim$0.5 ms, which is three orders of magnitude faster than other reported CVD grown 1L-MoS$_2$ based photodetectors. The combination of scalable device fabrication, ultra-high sensitivity and high speed offer a great potential for applications in photonics.

physics.app-ph↗

Two-Dimensional h-BN and MoS2 as Diffusion Barriers for Ultra-Scaled Copper Interconnects

Copper interconnects in modern integrated circuits require ultra-thin barriers to prevent intermixing of Cu with surrounding dielectric materials. Conventional barriers rely on metals like TaN, however their finite thickness reduces the cross-sectional area and significantly increases the resistivity of nanoscale interconnects. In this study, a new class of two-dimensional (2D) Cu diffusion barriers, hexagonal boron nitride (h-BN) and molybdenum disulfide (MoS2), is demonstrated for the first time. Using time-dependent dielectric breakdown measurements and scanning transmission electron microscopy coupled with energy dispersive X-ray spectroscopy and electron energy loss spectroscopy, these 2D materials are shown to be promising barrier solutions for ultra-scaled interconnect technology. The predicted lifetime of devices with directly deposited 2D barriers can achieve three orders of magnitude improvement compared to control devices without barriers.

cond-mat.mtrl-sci↗

Spatially Resolved Thermometry of Resistive Memory Devices

The operation of resistive and phase-change memory (RRAM and PCM) is controlled by highly localized self-heating effects, yet detailed studies of their temperature are rare due to challenges of nanoscale thermometry. Here we show that the combination of Raman thermometry and scanning thermal microscopy (SThM) can enable such measurements with high spatial resolution. We report temperature-dependent Raman spectra of HfO$_2$, TiO$_2$ and Ge$_2$Sb$_2$Te$_5$ (GST) films, and demonstrate direct measurements of temperature profiles in lateral PCM devices. Our measurements reveal that electrical and thermal interfaces dominate the operation of such devices, uncovering a thermal boundary resistance of 30 m$^2$K$^{-1}$GW$^{-1}$ at GST-SiO$_2$ interfaces and an effective thermopower 350 $μ$V/K at GST-Pt interfaces. We also discuss possible pathways to apply Raman thermometry and SThM techniques to nanoscale and vertical resistive memory devices.

physics.app-ph↗

Reducing Graphene Device Variability with Yttrium Sacrificial Layers

Graphene technology has made great strides since the material was isolated more than a decade ago. However, despite improvements in growth quality and numerous 'hero' devices, challenges of uniformity remain, restricting large-scale development of graphene-based technologies. Here we investigate and reduce the variability of graphene transistors by studying the effects of contact metals (with and without Ti layer), resist, and yttrium (Y) sacrificial layers during the fabrication of hundreds of devices. We find that with optical photolithography, residual resist and process contamination is unavoidable, ultimately limiting device performance and yield. However, using Y sacrificial layers to isolate the graphene from processing conditions improves the yield (from 73% to 97%), average device performance (three-fold increase of mobility, 58% lower contact resistance), and the device-to-device variability (standard deviation of Dirac voltage reduced by 20%). In contrast to other sacrificial layer techniques, removal of the Y sacrificial layer with HCl does not harm surrounding materials, simplifying large-scale graphene fabrication.

physics.app-ph↗

Photoresponse of Natural van der Waals Heterostructures

Van der Waals (vdW) heterostructures consisting of two dimensional materials offer a platform to obtain material by design and are very attractive owing to novel electronic states. Research on 2D van der Waals heterostructures (vdWH) has so far been focused on fabricating individually stacked atomically thin unary or binary crystals. Such systems include graphene (Gr), hexagonal boron nitride (h-BN) and member of the transition metal dichalcogenides family. Here we present our experimental study of the opto-electronic properties of a naturally occurring vdWH, known as Franckeite, which is a complex layered crystal composed of lead, tin, antimony, iron and sulfur. We present here that thin film franckeite (60 nm < d < 100 nm) behave as narrow band gap semiconductor demonstrating a wide band photoresponse. We have observed the band-edge transition at ~ 1500 nm (~830 meV) and high external quantum efficiency (EQE~3%) at room temperature. Laser power resolved and temperature resolved photocurrent measurements reveal that the photo-carrier generation and recombination are dominated by continuously distributed trap states within the band gap. To understand wavelength resolved photocurrent, we also calculated the optical absorption properties via density functional theory. Finally, we have shown that the device has fast photoresponse with rise time as fast as ~ 1 ms. Our study provides a fundamental understanding of the optoelectronic behavior in a complex naturally occurring vdWH and can open up the possibilities of producing new type of nanoscale optoelectronic devices with tailored properties.

cond-mat.mes-hall↗

Energy Dissipation in Monolayer MoS$_2$ Electronics

The advancement of nanoscale electronics has been limited by energy dissipation challenges for over a decade. Such limitations could be particularly severe for two-dimensional (2D) semiconductors integrated with flexible substrates or multi-layered processors, both being critical thermal bottlenecks. To shed light into fundamental aspects of this problem, here we report the first direct measurement of spatially resolved temperature in functioning 2D monolayer MoS$_2$ transistors. Using Raman thermometry we simultaneously obtain temperature maps of the device channel and its substrate. This differential measurement reveals the thermal boundary conductance (TBC) of the MoS$_2$ interface (14 $\pm$ 4 MWm$^-$$^2$K$^-$$^1$) is an order magnitude larger than previously thought, yet near the low end of known solid-solid interfaces. Our study also reveals unexpected insight into non-uniformities of the MoS$_2$ transistors (small bilayer regions), which do not cause significant self-heating, suggesting that such semiconductors are less sensitive to inhomogeneity than expected. These results provide key insights into energy dissipation of 2D semiconductors and pave the way for the future design of energy-efficient 2D electronics.

physics.app-ph↗

S2DS: Physics-Based Compact Model for Circuit Simulation of Two-Dimensional Semiconductor Devices Including Non-Idealities

We present a physics-based compact model for two-dimensional (2D) field-effect transistors (FETs) based on monolayer semiconductors such as MoS2. A semi-classical transport approach is appropriate for the 2D channel, enabling simplified analytical expressions for the drain current. In addition to intrinsic FET behavior, the model includes contact resistance, traps and impurities, quantum capacitance, fringing fields, high-field velocity saturation and self-heating, the latter being found to play a strong role. The model is calibrated with state-of-the-art experimental data for n- and p-type 2D-FETs, and it can be used to analyze device properties for sub-100 nm gate lengths. Using the experimental fit, we demonstrate feasibility of circuit simulations using properly scaled devices. The complete model is implemented in SPICE-compatible Verilog-A, and a downloadable version is freely available on the nanoHUB.org.

cond-mat.mes-hall↗

Intrinsic Electrical Transport and Performance Projections of Synthetic Monolayer MoS2 Devices

We demonstrate monolayer MoS2 grown by chemical vapor deposition (CVD) with transport properties comparable to those of the best exfoliated devices over a wide range of carrier densities (up to ~10^13 1/cm^2) and temperatures (80-500 K). Transfer length measurements reveal monolayer mobility of ~20 cm2/V/s on SiO2 substrates at 300 K and practical carrier densities (>2x10^12 1/cm^2). We also demonstrate the highest current density reported to date (~270 uA/um or 44 MA/cm^2) at 300 K for an 80 nm device from CVD-grown monolayer MoS2. Using simulations, we discuss what improvements of monolayer MoS2 are still required to meet technology roadmap requirements for low power (LP) and high performance (HP) applications. Such results are an important step towards large-area electronics based on monolayer semiconductors.

cond-mat.mtrl-sci↗

Role of remote interfacial phonon (RIP) scattering in heat transport across graphene/SiO2 interfaces

Heat transfer across interfaces of graphene and polar dielectrics (e.g. SiO2) could be mediated by direct phonon coupling, as well as electronic coupling with remote interfacial phonons (RIPs). To understand the relative contribution of each component, we develop a new pump-probe technique, called voltage-modulated thermoreflectance (VMTR), to accurately measure the change of interfacial thermal conductance under an electrostatic field. We employed VMTR on top gates of graphene field-effect transistors and find that the thermal conductance of SiO2/graphene/SiO2 interfaces increases by up to ΔG=0.8 MW m-2 K-1 under electrostatic fields of <0.2 V nm-1 . We propose two possible explanations for the observed ΔG. First, since the applied electrostatic field induces charge carriers in graphene, our VMTR measurements could originate from heat transfer between the charge carriers in graphene and RIPs in SiO2. Second, the increase in heat conduction could be caused by better conformity of graphene interfaces un-der electrostatic pressure exerted by the induced charge carriers. Regardless of the origins of the observed ΔG, our VMTR measurements establish an upper limit for heat transfer from unbiased graphene to SiO2 substrates via RIP scattering; i.e., only <2 % of the interfacial heat transport is facilitated by RIP scattering even at a carrier concentration of 4x10^12 cm-2.

cond-mat.mes-hall↗

High Current Density and Low Thermal Conductivity of Atomically Thin Semimetallic WTe2

Two-dimensional (2D) semimetals beyond graphene have been relatively unexplored in the atomically-thin limit. Here we introduce a facile growth mechanism for semimetallic WTe2 crystals, then fabricate few-layer test structures while carefully avoiding degradation from exposure to air. Low-field electrical measurements of 80 nm to 2 um long devices allow us to separate intrinsic and contact resistance, revealing metallic response in the thinnest encapsulated and stable WTe2 devices studied to date (3 to 20 layers thick). High-field electrical measurements and electro-thermal modeling demonstrate that ultra-thin WTe2 can carry remarkably high current density (approaching 50 MA/cm2, higher than most common interconnect metals) despite a very low thermal conductivity (of the order ~3 W/m/K). These results suggest several pathways for air-stable technological viability of this layered semimetal.

cond-mat.mtrl-sci↗

Improved Contacts to MoS2 Transistors by Ultra-High Vacuum Metal Deposition

The scaling of transistors to sub-10 nm dimensions is strongly limited by their contact resistance (Rc). Here we present a systematic study of scaling MoS2 devices and contacts with varying electrode metals and controlled deposition conditions, over a wide range of temperatures (80 to 500 K), carrier densities (10^12 to 10^13 1/cm^2), and contact dimensions (20 to 500 nm). We uncover that Au deposited in ultra-high vacuum (~10^-9 Torr) yields three times lower Rc than under normal conditions, reaching 740 Ohm-um and specific contact resistivity 3x10^-7 Ohm.cm2, stable for over four months. Modeling reveals separate Rc contributions from the Schottky barrier and the series access resistance, providing key insights on how to further improve scaling of MoS2 contacts and transistor dimensions. The contact transfer length is ~35 nm at 300 K, which is verified experimentally using devices with 20 nm contacts and 70 nm contact pitch (CP), equivalent to the "14 nm" technology node.

cond-mat.mes-hall↗

SANTA: Self-Aligned Nanotrench Ablation via Joule Heating for Probing Sub-20 nm Devices

Manipulating materials at the nanometer scale is challenging, particularly if alignment with nanoscale electrodes is desired. Here we describe a lithography-free, self-aligned nanotrench ablation (SANTA) technique to create nanoscale trenches in a polymer like poly(methyl) methacrylate (PMMA). The nanotrenches are self-aligned with carbon nanotube (CNT) and graphene ribbon electrodes through a simple Joule heating process. Using simulations and experiments we investigate how the Joule power, ambient temperature, PMMA thickness, and substrate properties can improve the spatial resolution of this technique. We achieve sub-20 nm nanotrenches for the first time, by lowering the ambient temperature and reducing the PMMA thickness. We also demonstrate a functioning nanoscale resistive memory (RRAM) bit self-aligned with a CNT control device, achieved through the SANTA approach. This technique provides an elegant and inexpensive method to probe nanoscale devices using self-aligned electrodes, without the use of conventional alignment or lithography steps.

cond-mat.mes-hall↗