arXiv subjects

Kazuki Nomoto

Publications and source records attributed to Kazuki Nomoto.

15 recordsLinked to original sources

arXiv2025

Trapped by Their Own Light: Deployable and Stealth Retroreflective Patch Attacks on Traffic Sign Recognition Systems

Traffic sign recognition plays a critical role in ensuring safe and efficient transportation of autonomous vehicles but remain vulnerable to adversarial attacks using stickers or laser projections. While existing attack vectors demonstrate security concerns, they suffer from visual detectability or implementation constraints, suggesting unexplored vulnerability surfaces in TSR systems. We introduce the Adversarial Retroreflective Patch (ARP), a novel attack vector that combines the high deployability of patch attacks with the stealthiness of laser projections by utilizing retroreflective materials activated only under victim headlight illumination. We develop a retroreflection simulation method and employ black-box optimization to maximize attack effectiveness. ARP achieves $\geq$93.4\% success rate in dynamic scenarios at 35 meters and $\geq$60\% success rate against commercial TSR systems in real-world conditions. Our user study demonstrates that ARP attacks maintain near-identical stealthiness to benign signs while achieving $\geq$1.9\% higher stealthiness scores than previous patch attacks. We propose the DPR Shield defense, employing strategically placed polarized filters, which achieves $\geq$75\% defense success rates for stop signs and speed limit signs against micro-prism patches.

cs.CR↗

arXiv2025

Epitaxial high-K AlBN barrier GaN HEMTs

We report a polarization-induced 2D electron gas (2DEG) at an epitaxial AlBN/GaN heterojunction grown on a SiC substrate. Using this 2DEG in a long conducting channel, we realize ultra-thin barrier AlBN/GaN high electron mobility transistors that exhibit current densities of more than 0.25 A/mm, clean current saturation, a low pinch-off voltage of -0.43 V, and a peak transconductance of 0.14 S/mm. Transistor performance in this preliminary realization is limited by the contact resistance. Capacitance-voltage measurements reveal that introducing 7 % B in the epitaxial AlBN barrier on GaN boosts the relative dielectric constant of AlBN to 16, higher than the AlN dielectric constant of 9. Epitaxial high-K barrier AlBN/GaN HEMTs can thus extend performance beyond the capabilities of current GaN transistors.

physics.app-ph↗

arXiv2024

Ferroelectric AlBN Films by Molecular Beam Epitaxy

We report the properties of molecular beam epitaxy deposited AlBN thin films on a recently developed epitaxial nitride metal electrode Nb2N. While a control AlN thin film exhibits standard capacitive behavior, distinct ferroelectric switching is observed in the AlBN films with increasing Boron mole fraction. The measured remnant polarization Pr of 15 uC/cm2 and coercive field Ec of 1.45 MV/cm in these films are smaller than those recently reported on films deposited by sputtering, due to incomplete wake-up, limited by current leakage. Because AlBN preserves the ultrawide energy bandgap of AlN compared to other nitride hi-K dielectrics and ferroelectrics, and it can be epitaxially integrated with GaN and AlN semiconductors, its development will enable several opportunities for unique electronic, photonic, and memory devices.

cond-mat.mtrl-sci↗

arXiv2022

Molecular Beam Homoepitaxy of N-polar AlN on bulk AlN substrates

N-polar AlN epilayers were grown on the N-face of single crystal bulk AlN substrates by plasma assisted molecular beam epitaxy (PA-MBE). A combination of in situ thermal deoxidation and Al-assisted thermal desorption at high temperature helped in removing native surface oxides and impurities from the N-polar surface of the substrate enabling successful homoepitaxy. Subsequent epitaxial growth of AlN layer on the in situ cleaned substrates, grown in sufficiently high Al droplet regime, exhibited smooth surface morphologies with clean and wide atomic steps. KOH etch studies confirmed the N-polarity of the homoepitaxial films. Secondary ion mass spectrometry profiles show Si and H impurity concentrations below the noise levels, whereas O and C impurities concentrations of ~ 8x10^{17} atoms/cm^3 and ~ 2x10^{17} atoms/cm^3 are observed respectively. Though the structural defect densities are low, they interestingly appear as inversion domains of different dimensionalities.

cond-mat.mtrl-sci↗

arXiv2022

N-polar GaN p-n junction diodes with low ideality factors

High-quality N-polar GaN p-n diodes are realized on single-crystal N-polar GaN bulk substrate by plasma-assisted molecular beam epitaxy. The room-temperature current-voltage characteristics reveal a high on/off current ratio of 10^11 at 4 V and an ideality factor of 1.6. As the temperature increases to 200 C, the apparent ideality factor gradually approaches 2. At such high temperatures, Shockley-Read-Hall recombination times of 0.32-0.46 ns are estimated. The measured electroluminescence spectrum is dominated by a strong near-band edge emission, while deep level and acceptor-related luminescence is greatly suppressed. A relatively high reverse breakdown field of 2.4 MV/cm without field-plates is achieved. This work indicates that the quality of N-polar GaN diodes is now approaching to that of their state-of-the-art Ga-polar counterparts.

cond-mat.mtrl-sci↗

arXiv2021

Epitaxial Sc$_x$Al$_{1-x}$N on GaN is a High K Dielectric

Epitaxial Sc$_x$Al$_{1-x}$N thin films of ~100 nm thickness grown on metal polar GaN exhibit significantly enhanced relative dielectric permittivity ($ε_r$) values relative to AlN. $ε_r$ values of ~17 to 21 for Sc contents of 17 to 25% (x=0.17 to 0.25) measured electrically by capacitance-voltage (CV) measurements at 500 kHz frequency indicate Sc$_x$Al$_{1-x}$N has the largest relative dielectric permittivity of any existing nitride material. This points toward the usage of Sc$_x$Al$_{1-x}$N as potential epitaxial, single-crystalline dielectric material that can be deposited in situ on GaN and AlN electronic and photonic devices for enhanced performance.

physics.app-ph↗

arXiv2021

Ferroelectricity in Polar ScAlN/GaN Epitaxial Semiconductor Heterostructures

Room temperature ferroelectricity is observed in lattice-matched ~18% ScAlN/GaN heterostructures grown by molecular beam epitaxy on single-crystal GaN substrates. The epitaxial films have smooth surface morphologies and high crystallinity. Pulsed current-voltage measurements confirm stable and repeatable polarization switching in such ferroelectric/semiconductor structures at several measurement conditions, and in multiple samples. The measured coercive field values are Ec~0.7 MV/cm at room temperature, with remnant polarization Pr~10 μC/cm2 for ~100 nm thick ScAlN layers. These values are substantially lower than comparable ScAlN control layers deposited by sputtering. Importantly, the coercive field of MBE ScAlN is smaller than the critical breakdown field of GaN, offering the potential for low voltage ferroelectric switching. The low coercive field ferroelectricity of ScAlN on GaN heralds the possibility of new forms of electronic and photonic devices with epitaxially integrated ferroelectric/semiconductor heterostructures that take advantage of the GaN electronic and photonic semiconductor platform, where the underlying semiconductors themselves exhibit spontaneous and piezoelectric polarization.

cond-mat.mtrl-sci↗

arXiv2020

Thermionic emission or tunneling? The universal transition electric field for ideal Schottky reverse leakage current in $β$-Ga$_{2}$O$_{3}$

The reverse leakage current through a Schottky barrier transitions from a thermionic-emission dominated regime to a barrier-tunneling dominated regime as the surface electric field increases. In this study, we evaluate such transition electric field ($E_{\rm T}$) in $β$-Ga$_{2}$O$_{3}$ using a numerical reverse leakage model. $E_{\rm T}$ is found to have very weak dependence on the doping concentration and barrier height, thus a near-universal temperature dependence suffices and is given by a simple empirical expression in Ga$_{2}$O$_{3}$. With the help of a field-plate design, we observed experimentally in Ga$_{2}$O$_{3}$ Schottky barrier diodes a near-ideal bulk reverse leakage characteristics, which matches well with our numerical model and confirms the presence of the transition region. Near the transition electric field, both thermionic emission and barrier tunneling should be considered. The study provides important guidance toward accurate design and modeling of ideal reverse leakage characteristics in $β$-Ga$_{2}$O$_{3}$ Schottky barrier diodes.

physics.app-ph↗

arXiv2018

Blue (In,Ga)N Light-Emitting Diodes with Buried n+-p+ Tunnel Junctions by Plasma-Assisted Molecular Beam Epitaxy

Blue light-emitting diodes (LEDs) consisting of a buried n+-p+ GaN tunnel junction, (In,Ga)N multiple quantum wells (MQWs) and a n+-GaN top layer are grown on single-crystal Ga-polar n+-GaN bulk wafers by plasma-assisted molecular beam epitaxy. The (In,Ga)N MQW active regions overgrown on the p+-GaN show chemically abrupt and sharp interfaces in a wide range of compositions and are seen to have high structural and optical properties as verified by X-ray diffraction and spatially resolved cathodoluminescence measurements. The processed LEDs reveal clear rectifying behavior with a low contact and buried tunnel junction resistivity. By virtue of the top n+-GaN layer with a low resistance, excellent current spreading in the LEDs is observed at low currents in this device structure. A few of new device possibilities based on this unique design are discussed.

physics.app-ph↗

arXiv2018

Gate-recessed E-mode p-channel HFET with high on-current based on GaN/AlN 2D hole gas

High-performance p-channel transistors are crucial to implementing efficient complementary circuits in wide-bandgap electronics, but progress on such devices has lagged far behind their powerful electron-based counterparts due to the inherent challenges of manipulating holes in wide-gap semiconductors. Building on recent advances in materials growth, this work sets simultaneous records in both on-current (10 mA/mm) and on-off modulation (four orders) for the GaN/AlN wide-bandgap p-FET structure. A compact analytical pFET model is derived, and the results are benchmarked against the various alternatives in the literature, clarifying the heterostructure trade-offs to enable integrated wide-bandgap CMOS for next-generation compact high-power devices.

physics.app-ph↗

arXiv2017

Single-Crystal N-polar GaN p-n Diodes by Plasma-Assisted Molecular Beam Epitaxy

N-polar GaN p-n diodes are realized on single-crystal N-polar GaN bulk wafers by plasma-assisted molecular beam epitaxy growth. The current-voltage characteristics show high-quality rectification and electroluminescence characteristics with a high on/off current ratio and interband photon emission. The measured electroluminescence spectrum is dominated by strong near-band edge emission, while deep level luminescence is greatly suppressed. A very low dislocation density leads to a high reverse breakdown electric field. The low leakage current N-polar diodes open up several potential applications in polarization-engineered photonic and electronic devices.

cond-mat.mtrl-sci↗

arXiv2017

Electron Mobility in Polarization-doped Al$\mathrm{_{0-0.2}}$GaN with a Low Concentration Near 10$\mathrm{^{17}}$ cm$\mathrm{^{-3}}$

In this letter, carrier transport in graded Al$\mathrm{_x}$Ga$\mathrm{_{1-x}}$N with a polarization-induced n-type doping as low as ~ 10$\mathrm{^{17}}$ cm$\mathrm{^{-3}}$ is reported. The graded Al$\mathrm{_x}$Ga$\mathrm{_{1-x}}$N is grown by metal organic chemical vapor deposition on a sapphire substrate and a uniform n-type doping without any intentional doping is realized by linearly varying the Al composition from 0% to 20% over a thickness of 600 nm. A compensating center concentration of ~10$\mathrm{^{17}}$ cm$\mathrm{^{-3}}$ was also estimated. A peak mobility of 900 cm$\mathrm{^2}$/V$\mathrm \cdot$s at room temperature is extracted at an Al composition of ~ 7%, which represents the highest mobility achieved in n-Al$\mathrm{_{0.07}}$GaN with a carrier concentration ~10$\mathrm{^{17}}$ cm$\mathrm{^{-3}}$. Comparison between experimental data and theoretical models shows that, at this low doping concentration, both dislocation scattering and alloy scattering are significant in limiting electron mobility; and that a dislocation density of <10$\mathrm{^7}$ cm$\mathrm{^{-2}}$ is necessary to optimize mobility near 10$\mathrm{^{16}}$ cm$\mathrm{^{-3}}$. The findings in this study provide insight in key elements for achieving high mobility at low doping levels in GaN, a critical parameter in design of novel power electronics taking advantage of polarization doping.

cond-mat.mes-hall↗

arXiv2016

Strained GaN Quantum-Well FETs on Single Crystal Bulk AlN Substrates

We report the first realization of molecular beam epitaxy grown strained GaN quantum well field-effect transistors on single-crystal bulk AlN substrates. The fabricated double heterostructure FETs exhibit a two- dimensional electron gas (2DEG) density in excess of 2x10^13/cm2. Ohmic contacts to the 2DEG channel were formed by n+ GaN MBE regrowth process, with a contact resistance of 0.13 Ohm-mm. Raman spectroscopy using the quantum well as an optical marker reveals the strain in the quantum well, and strain relaxation in the regrown GaN contacts. A 65-nm-long rectangular-gate device showed a record high DC drain current drive of 2.0 A/mm and peak extrinsic transconductance of 250 mS/mm. Small-signal RF performance of the device achieved current gain cutoff frequency fT~120 GHz. The DC and RF performance demonstrate that bulk AlN substrates offer an attractive alternative platform for strained quantum well nitride transistors for future high-voltage and high-power microwave applications.

cond-mat.mtrl-sci↗

arXiv2016

Large Electron Concentration Modulation using Capacitance Enhancement in SrTiO3/SmTiO3 FinFETs

Solid-state modulation of 2-dimensional electron gases (2DEGs) with extreme (~3.3 x 1014 cm-2) densities corresponding to 1/2 electron per interface unit cell at complex oxide heterointerfaces (such as SrTiO3/GdTiO3 or SrTiO3/SmTiO3) is challenging because it requires enormous gate capacitances. One way to achieve large gate capacitances is by geometrical capacitance enhancement in fin structures. In this work, we fabricate both Au-gated planar field effect transistors (FETs) and Fin-FETs with varying fin-widths on 60nm SrTiO3/5nm SmTiO3 thin films grown by hybrid molecular beam epitaxy (hMBE). We find that the FinFETs exhibit higher gate capacitance compared to planar FETs. By scaling down the SrTiO3/SmTiO3 fin widths, we demonstrate further gate capacitance enhancement, almost twice compared to the planar FETs. In the FinFETs with narrowest fin-widths, we demonstrate a record 2DEG electron concentration modulation of ~2.4 x 1014 cm-2.

cond-mat.mes-hall↗

arXiv2015

Unique opportunity to harness polarization in GaN to override the conventional power electronics figure-of-merits

Owing to the large breakdown electric field, wide bandgap semiconductors such as SiC, GaN, Ga2O3 and diamond based power devices are the focus for next generation power switching applications. The unipolar trade-off relationship between the area specific-on resistance and breakdown voltage is often employed to compare the performance limitation among various materials. The GaN material system has a unique advantage due to its prominent spontaneous and piezoelectric polarization effects in GaN, AlN, InN, AlxInyGaN alloys and flexibility in inserting appropriate heterojunctions thus dramatically broaden the device design space.

cond-mat.mtrl-sci↗