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Mehdi B. Tahoori

Publications and source records attributed to Mehdi B. Tahoori.

At least 19 recordsLinked to original sources

Design and Optimization of Mixed-Kernel Mixed-Signal SVMs for Flexible Electronics

Flexible Electronics (FE) have emerged as a promising alternative to silicon-based technologies, offering on-demand low-cost fabrication, conformality, and sustainability. However, their large feature sizes severely limit integration density, imposing strict area and power constraints, thus prohibiting the realization of Machine Learning (ML) circuits, which can significantly enhance the capabilities of relevant near-sensor applications. Support Vector Machines (SVMs) offer high accuracy in such applications at relatively low computational complexity, satisfying FE technologies' constraints. Existing SVM designs rely solely on linear or Radial Basis Function (RBF) kernels, forcing a trade-off between hardware costs and accuracy. Linear kernels, implemented digitally, minimize overhead but sacrifice performance, while the more accurate RBF kernels are prohibitively large in digital, and their analog realization contains inherent functional approximation. In this work, we propose the first mixed-kernel and mixed-signal SVM design in FE, which unifies the advantages of both implementations and balances the cost/accuracy trade-off. To that end, we introduce a co-optimization approach that trains our mixed-kernel SVMs and maps binary SVM classifiers to the appropriate kernel (linear/RBF) and domain (digital/analog), aiming to maximize accuracy whilst reducing the number of costly RBF classifiers. Our designs deliver 7.7% higher accuracy than state-of-the-art single-kernel linear SVMs, and reduce area and power by 108x and 17x on average compared to digital RBF implementations.

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Bespoke Co-processor for Energy-Efficient Health Monitoring on RISC-V-based Flexible Wearables

Flexible electronics offer unique advantages for conformable, lightweight, and disposable healthcare wearables. However, their limited gate count, large feature sizes, and high static power consumption make on-body machine learning classification highly challenging. While existing bendable RISC-V systems provide compact solutions, they lack the energy efficiency required. We present a mechanically flexible RISC-V that integrates a bespoke multiply-accumulate co-processor with fixed coefficients to maximize energy efficiency and minimize latency. Our approach formulates a constrained programming problem to jointly determine co-processor constants and optimally map Multi-Layer Perceptron (MLP) inference operations, enabling compact, model-specific hardware by leveraging the low fabrication and non-recurring engineering costs of flexible technologies. Post-layout results demonstrate near-real-time performance across several healthcare datasets, with our circuits operating within the power budget of existing flexible batteries and occupying only 2.42 mm^2, offering a promising path toward accessible, sustainable, and conformable healthcare wearables. Our microprocessors achieve an average 2.35x speedup and 2.15x lower energy consumption compared to the state of the art.

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Arbitrary Precision Printed Ternary Neural Networks with Holistic Evolutionary Approximation

Printed electronics offer a promising alternative for applications beyond silicon-based systems, requiring properties like flexibility, stretchability, conformality, and ultra-low fabrication costs. Despite the large feature sizes in printed electronics, printed neural networks have attracted attention for meeting target application requirements, though realizing complex circuits remains challenging. This work bridges the gap between classification accuracy and area efficiency in printed neural networks, covering the entire processing-near-sensor system design and co-optimization from the analog-to-digital interface-a major area and power bottleneck-to the digital classifier. We propose an automated framework for designing printed Ternary Neural Networks with arbitrary input precision, utilizing multi-objective optimization and holistic approximation. Our circuits outperform existing approximate printed neural networks by 17x in area and 59x in power on average, being the first to enable printed-battery-powered operation with under 5% accuracy loss while accounting for analog-to-digital interfacing costs.

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Invited Paper: Feature-to-Classifier Co-Design for Mixed-Signal Smart Flexible Wearables for Healthcare at the Extreme Edge

Flexible Electronics (FE) offer a promising alternative to rigid silicon-based hardware for wearable healthcare devices, enabling lightweight, conformable, and low-cost systems. However, their limited integration density and large feature sizes impose strict area and power constraints, making ML-based healthcare systems-integrating analog frontend, feature extraction and classifier-particularly challenging. Existing FE solutions often neglect potential system-wide solutions and focus on the classifier, overlooking the substantial hardware cost of feature extraction and Analog-to-Digital Converters (ADCs)-both major contributors to area and power consumption. In this work, we present a holistic mixed-signal feature-to-classifier co-design framework for flexible smart wearable systems. To the best of our knowledge, we design the first analog feature extractors in FE, significantly reducing feature extraction cost. We further propose an hardware-aware NAS-inspired feature selection strategy within ML training, enabling efficient, application-specific designs. Our evaluation on healthcare benchmarks shows our approach delivers highly accurate, ultra-area-efficient flexible systems-ideal for disposable, low-power wearable monitoring.

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Exploration of Low-Power Flexible Stress Monitoring Classifiers for Conformal Wearables

Conventional stress monitoring relies on episodic, symptom-focused interventions, missing the need for continuous, accessible, and cost-efficient solutions. State-of-the-art approaches use rigid, silicon-based wearables, which, though capable of multitasking, are not optimized for lightweight, flexible wear, limiting their practicality for continuous monitoring. In contrast, flexible electronics (FE) offer flexibility and low manufacturing costs, enabling real-time stress monitoring circuits. However, implementing complex circuits like machine learning (ML) classifiers in FE is challenging due to integration and power constraints. Previous research has explored flexible biosensors and ADCs, but classifier design for stress detection remains underexplored. This work presents the first comprehensive design space exploration of low-power, flexible stress classifiers. We cover various ML classifiers, feature selection, and neural simplification algorithms, with over 1200 flexible classifiers. To optimize hardware efficiency, fully customized circuits with low-precision arithmetic are designed in each case. Our exploration provides insights into designing real-time stress classifiers that offer higher accuracy than current methods, while being low-cost, conformable, and ensuring low power and compact size.

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Computing with Printed and Flexible Electronics

Printed and flexible electronics (PFE) have emerged as the ubiquitous solution for application domains at the extreme edge, where the demands for low manufacturing and operational cost cannot be met by silicon-based computing. Built on mechanically flexible substrates, printed and flexible devices offer unparalleled advantages in terms of form factor, bio-compatibility and sustainability, making them ideal for emerging and uncharted applications, such as wearable healthcare products or fast-moving consumer goods. Their desirable attributes stem from specialized fabrication technologies, e.g., Pragmatic's FlexIC, where advancements like ultra-thin substrates and specialized printing methods expand their hardware efficiency, and enable penetration to previously unexplored application domains. In recent years, significant focus has been on machine learning (ML) circuits for resource-constrained on-sensor and near-sensor processing, both in the digital and analog domains, as they meet the requirements of target applications by PFE. Despite their advancements, challenges like reliability, device integration and efficient memory design are still prevalent in PFE, spawning several research efforts towards cross-layer optimization and co-design, whilst showing promise for advancing printed and flexible electronics to new domains.

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FLARE: Fault Attack Leveraging Address Reconfiguration Exploits in Multi-Tenant FPGAs

Modern FPGAs are increasingly supporting multi-tenancy to enable dynamic reconfiguration of user modules. While multi-tenant FPGAs improve utilization and flexibility, this paradigm introduces critical security threats. In this paper, we present FLARE, a fault attack that exploits vulnerabilities in the partial reconfiguration process, specifically while a user bitstream is being uploaded to the FPGA by a reconfiguration manager. Unlike traditional fault attacks that operate during module runtime, FLARE injects faults in the bitstream during its reconfiguration, altering the configuration address and redirecting it to unintended partial reconfigurable regions (PRRs). This enables the overwriting of pre-configured co-tenant modules, disrupting their functionality. FLARE leverages power-wasters that activate briefly during the reconfiguration process, making the attack stealthy and more challenging to detect with existing countermeasures. Experimental results on a Xilinx Pynq FPGA demonstrate the effectiveness of FLARE in compromising multiple user bitstreams during the reconfiguration process.

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Sequential Printed MLP Circuits for Super TinyML Multi-Sensory Applications

Super-TinyML aims to optimize machine learning models for deployment on ultra-low-power application domains such as wearable technologies and implants. Such domains also require conformality, flexibility, and non-toxicity which traditional silicon-based systems cannot fulfill. Printed Electronics (PE) offers not only these characteristics, but also cost-effective and on-demand fabrication. However, Neural Networks (NN) with hundreds of features -- often necessary for target applications -- have not been feasible in PE because of its restrictions such as limited device count due to its large feature sizes. In contrast to the state of the art using fully parallel architectures and limited to smaller classifiers, in this work we implement a super-TinyML architecture for bespoke (application-specific) NNs that surpasses the previous limits of state of the art and enables NNs with large number of parameters. With the introduction of super-TinyML into PE technology, we address the area and power limitations through resource sharing with multi-cycle operation and neuron approximation. This enables, for the first time, the implementation of NNs with up to $35.9\times$ more features and $65.4\times$ more coefficients than the state of the art solutions.

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Reducing ADC Front-end Costs During Training of On-sensor Printed Multilayer Perceptrons

Printed electronics technology offers a cost-effectiveand fully-customizable solution to computational needs beyondthe capabilities of traditional silicon technologies, offering ad-vantages such as on-demand manufacturing and conformal, low-cost hardware. However, the low-resolution fabrication of printedelectronics, which results in large feature sizes, poses a challengefor integrating complex designs like those of machine learn-ing (ML) classification systems. Current literature optimizes onlythe Multilayer Perceptron (MLP) circuit within the classificationsystem, while the cost of analog-to-digital converters (ADCs)is overlooked. Printed applications frequently require on-sensorprocessing, yet while the digital classifier has been extensivelyoptimized, the analog-to-digital interfacing, specifically the ADCs,dominates the total area and energy consumption. In this work,we target digital printed MLP classifiers and we propose thedesign of customized ADCs per MLP's input which involvesminimizing the distinct represented numbers for each input,simplifying thus the ADC's circuitry. Incorporating this ADCoptimization in the MLP training, enables eliminating ADC levelsand the respective comparators, while still maintaining highclassification accuracy. Our approach achieves 11.2x lower ADCarea for less than 5% accuracy drop across varying MLPs.

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Design and In-training Optimization of Binary Search ADC for Flexible Classifiers

Flexible Electronics (FE) offer distinct advantages, including mechanical flexibility and low process temperatures, enabling extremely low-cost production. To address the demands of applications such as smart sensors and wearables, flexible devices must be small and operate at low supply voltages. Additionally, target applications often require classifiers to operate directly on analog sensory input, necessitating the use of Analog to Digital Converters (ADCs) to process the sensory data. However, ADCs present serious challenges, particularly in terms of high area and power consumption, especially when considering stringent area and energy budget. In this work, we target common classifiers in this domain such as MLPs and SVMs and present a holistic approach to mitigate the elevated overhead of analog to digital interfacing in FE. First, we propose a novel design for Binary Search ADC that reduces area overhead 2X compared with the state-of-the-art Binary design and up to 5.4X compared with Flash ADC. Next, we present an in-training ADC optimization in which we keep the bare-minimum representations required and simplifying ADCs by removing unnecessary components. Our in-training optimization further reduces on average the area in terms of transistor count of the required ADCs by 5X for less than 1% accuracy loss.

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Embedding Hardware Approximations in Discrete Genetic-based Training for Printed MLPs

Printed Electronics (PE) stands out as a promisingtechnology for widespread computing due to its distinct attributes, such as low costs and flexible manufacturing. Unlike traditional silicon-based technologies, PE enables stretchable, conformal,and non-toxic hardware. However, PE are constrained by larger feature sizes, making it challenging to implement complex circuits such as machine learning (ML) classifiers. Approximate computing has been proven to reduce the hardware cost of ML circuits such as Multilayer Perceptrons (MLPs). In this paper, we maximize the benefits of approximate computing by integrating hardware approximation into the MLP training process. Due to the discrete nature of hardware approximation, we propose and implement a genetic-based, approximate, hardware-aware training approach specifically designed for printed MLPs. For a 5% accuracy loss, our MLPs achieve over 5x area and power reduction compared to the baseline while outperforming state of-the-art approximate and stochastic printed MLPs.

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Hacking the Fabric: Targeting Partial Reconfiguration for Fault Injection in FPGA Fabrics

FPGAs are now ubiquitous in cloud computing infrastructures and reconfigurable system-on-chip, particularly for AI acceleration. Major cloud service providers such as Amazon and Microsoft are increasingly incorporating FPGAs for specialized compute-intensive tasks within their data centers. The availability of FPGAs in cloud data centers has opened up new opportunities for users to improve application performance by implementing customizable hardware accelerators directly on the FPGA fabric. However, the virtualization and sharing of FPGA resources among multiple users open up new security risks and threats. We present a novel fault attack methodology capable of causing persistent fault injections in partial bitstreams during the process of FPGA reconfiguration. This attack leverages power-wasters and is timed to inject faults into bitstreams as they are being loaded onto the FPGA through the reconfiguration manager, without needing to remain active throughout the entire reconfiguration process. Our experiments, conducted on a Pynq FPGA setup, demonstrate the feasibility of this attack on various partial application bitstreams, such as a neural network accelerator unit and a signal processing accelerator unit.

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Tiny Deep Ensemble: Uncertainty Estimation in Edge AI Accelerators via Ensembling Normalization Layers with Shared Weights

The applications of artificial intelligence (AI) are rapidly evolving, and they are also commonly used in safety-critical domains, such as autonomous driving and medical diagnosis, where functional safety is paramount. In AI-driven systems, uncertainty estimation allows the user to avoid overconfidence predictions and achieve functional safety. Therefore, the robustness and reliability of model predictions can be improved. However, conventional uncertainty estimation methods, such as the deep ensemble method, impose high computation and, accordingly, hardware (latency and energy) overhead because they require the storage and processing of multiple models. Alternatively, Monte Carlo dropout (MC-dropout) methods, although having low memory overhead, necessitate numerous ($\sim 100$) forward passes, leading to high computational overhead and latency. Thus, these approaches are not suitable for battery-powered edge devices with limited computing and memory resources. In this paper, we propose the Tiny-Deep Ensemble approach, a low-cost approach for uncertainty estimation on edge devices. In our approach, only normalization layers are ensembled $M$ times, with all ensemble members sharing common weights and biases, leading to a significant decrease in storage requirements and latency. Moreover, our approach requires only one forward pass in a hardware architecture that allows batch processing for inference and uncertainty estimation. Furthermore, it has approximately the same memory overhead compared to a single model. Therefore, latency and memory overhead are reduced by a factor of up to $\sim M\times$. Nevertheless, our method does not compromise accuracy, with an increase in inference accuracy of up to $\sim 1\%$ and a reduction in RMSE of $17.17\%$ in various benchmark datasets, tasks, and state-of-the-art architectures.

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Enhancing Reliability of Neural Networks at the Edge: Inverted Normalization with Stochastic Affine Transformations

Bayesian Neural Networks (BayNNs) naturally provide uncertainty in their predictions, making them a suitable choice in safety-critical applications. Additionally, their realization using memristor-based in-memory computing (IMC) architectures enables them for resource-constrained edge applications. In addition to predictive uncertainty, however, the ability to be inherently robust to noise in computation is also essential to ensure functional safety. In particular, memristor-based IMCs are susceptible to various sources of non-idealities such as manufacturing and runtime variations, drift, and failure, which can significantly reduce inference accuracy. In this paper, we propose a method to inherently enhance the robustness and inference accuracy of BayNNs deployed in IMC architectures. To achieve this, we introduce a novel normalization layer combined with stochastic affine transformations. Empirical results in various benchmark datasets show a graceful degradation in inference accuracy, with an improvement of up to $58.11\%$.

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Scale-Dropout: Estimating Uncertainty in Deep Neural Networks Using Stochastic Scale

Uncertainty estimation in Neural Networks (NNs) is vital in improving reliability and confidence in predictions, particularly in safety-critical applications. Bayesian Neural Networks (BayNNs) with Dropout as an approximation offer a systematic approach to quantifying uncertainty, but they inherently suffer from high hardware overhead in terms of power, memory, and computation. Thus, the applicability of BayNNs to edge devices with limited resources or to high-performance applications is challenging. Some of the inherent costs of BayNNs can be reduced by accelerating them in hardware on a Computation-In-Memory (CIM) architecture with spintronic memories and binarizing their parameters. However, numerous stochastic units are required to implement conventional dropout-based BayNN. In this paper, we propose the Scale Dropout, a novel regularization technique for Binary Neural Networks (BNNs), and Monte Carlo-Scale Dropout (MC-Scale Dropout)-based BayNNs for efficient uncertainty estimation. Our approach requires only one stochastic unit for the entire model, irrespective of the model size, leading to a highly scalable Bayesian NN. Furthermore, we introduce a novel Spintronic memory-based CIM architecture for the proposed BayNN that achieves more than $100\times$ energy savings compared to the state-of-the-art. We validated our method to show up to a $1\%$ improvement in predictive performance and superior uncertainty estimates compared to related works.

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NeuSpin: Design of a Reliable Edge Neuromorphic System Based on Spintronics for Green AI

Internet of Things (IoT) and smart wearable devices for personalized healthcare will require storing and computing ever-increasing amounts of data. The key requirements for these devices are ultra-low-power, high-processing capabilities, autonomy at low cost, as well as reliability and accuracy to enable Green AI at the edge. Artificial Intelligence (AI) models, especially Bayesian Neural Networks (BayNNs) are resource-intensive and face challenges with traditional computing architectures due to the memory wall problem. Computing-in-Memory (CIM) with emerging resistive memories offers a solution by combining memory blocks and computing units for higher efficiency and lower power consumption. However, implementing BayNNs on CIM hardware, particularly with spintronic technologies, presents technical challenges due to variability and manufacturing defects. The NeuSPIN project aims to address these challenges through full-stack hardware and software co-design, developing novel algorithmic and circuit design approaches to enhance the performance, energy-efficiency and robustness of BayNNs on sprintronic-based CIM platforms.

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Testing Spintronics Implemented Monte Carlo Dropout-Based Bayesian Neural Networks

Bayesian Neural Networks (BayNNs) can inherently estimate predictive uncertainty, facilitating informed decision-making. Dropout-based BayNNs are increasingly implemented in spintronics-based computation-in-memory architectures for resource-constrained yet high-performance safety-critical applications. Although uncertainty estimation is important, the reliability of Dropout generation and BayNN computation is equally important for target applications but is overlooked in existing works. However, testing BayNNs is significantly more challenging compared to conventional NNs, due to their stochastic nature. In this paper, we present for the first time the model of the non-idealities of the spintronics-based Dropout module and analyze their impact on uncertainty estimates and accuracy. Furthermore, we propose a testing framework based on repeatability ranking for Dropout-based BayNN with up to $100\%$ fault coverage while using only $0.2\%$ of training data as test vectors.

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On-sensor Printed Machine Learning Classification via Bespoke ADC and Decision Tree Co-Design

Printed electronics (PE) technology provides cost-effective hardware with unmet customization, due to their low non-recurring engineering and fabrication costs. PE exhibit features such as flexibility, stretchability, porosity, and conformality, which make them a prominent candidate for enabling ubiquitous computing. Still, the large feature sizes in PE limit the realization of complex printed circuits, such as machine learning classifiers, especially when processing sensor inputs is necessary, mainly due to the costly analog-to-digital converters (ADCs). To this end, we propose the design of fully customized ADCs and present, for the first time, a co-design framework for generating bespoke Decision Tree classifiers. Our comprehensive evaluation shows that our co-design enables self-powered operation of on-sensor printed classifiers in all benchmark cases.

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