arXiv subjects

Mehdi B. Tahoori

Publications and source records attributed to Mehdi B. Tahoori.

28 records · Page 2Linked to original sources

arXiv2023

Spatial-SpinDrop: Spatial Dropout-based Binary Bayesian Neural Network with Spintronics Implementation

Recently, machine learning systems have gained prominence in real-time, critical decision-making domains, such as autonomous driving and industrial automation. Their implementations should avoid overconfident predictions through uncertainty estimation. Bayesian Neural Networks (BayNNs) are principled methods for estimating predictive uncertainty. However, their computational costs and power consumption hinder their widespread deployment in edge AI. Utilizing Dropout as an approximation of the posterior distribution, binarizing the parameters of BayNNs, and further to that implementing them in spintronics-based computation-in-memory (CiM) hardware arrays provide can be a viable solution. However, designing hardware Dropout modules for convolutional neural network (CNN) topologies is challenging and expensive, as they may require numerous Dropout modules and need to use spatial information to drop certain elements. In this paper, we introduce MC-SpatialDropout, a spatial dropout-based approximate BayNNs with spintronics emerging devices. Our method utilizes the inherent stochasticity of spintronic devices for efficient implementation of the spatial dropout module compared to existing implementations. Furthermore, the number of dropout modules per network layer is reduced by a factor of $9\times$ and energy consumption by a factor of $94.11\times$, while still achieving comparable predictive performance and uncertainty estimates compared to related works.

cs.LG↗

arXiv2023

One-Shot Online Testing of Deep Neural Networks Based on Distribution Shift Detection

Neural networks (NNs) are capable of learning complex patterns and relationships in data to make predictions with high accuracy, making them useful for various tasks. However, NNs are both computation-intensive and memory-intensive methods, making them challenging for edge applications. To accelerate the most common operations (matrix-vector multiplication) in NNs, hardware accelerator architectures such as computation-in-memory (CiM) with non-volatile memristive crossbars are utilized. Although they offer benefits such as power efficiency, parallelism, and nonvolatility, they suffer from various faults and variations, both during manufacturing and lifetime operations. This can lead to faulty computations and, in turn, degradation of post-mapping inference accuracy, which is unacceptable for many applications, including safety-critical applications. Therefore, proper testing of NN hardware accelerators is required. In this paper, we propose a \emph{one-shot} testing approach that can test NNs accelerated on memristive crossbars with only one test vector, making it very suitable for online testing applications. Our approach can consistently achieve $100\%$ fault coverage across several large topologies with up to $201$ layers and challenging tasks like semantic segmentation. Nevertheless, compared to existing methods, the fault coverage is improved by up to $24\%$, the memory overhead is only $0.0123$ MB, a reduction of up to $19980\times$ and the number of test vectors is reduced by $10000\times$.

cs.LG↗

arXiv2023

Model-to-Circuit Cross-Approximation For Printed Machine Learning Classifiers

Printed electronics (PE) promises on-demand fabrication, low non-recurring engineering costs, and sub-cent fabrication costs. It also allows for high customization that would be infeasible in silicon, and bespoke architectures prevail to improve the efficiency of emerging PE machine learning (ML) applications. Nevertheless, large feature sizes in PE prohibit the realization of complex ML models in PE, even with bespoke architectures. In this work, we present an automated, cross-layer approximation framework tailored to bespoke architectures that enable complex ML models, such as Multi-Layer Perceptrons (MLPs) and Support Vector Machines (SVMs), in PE. Our framework adopts cooperatively a hardware-driven coefficient approximation of the ML model at algorithmic level, a netlist pruning at logic level, and a voltage over-scaling at the circuit level. Extensive experimental evaluation on 12 MLPs and 12 SVMs and more than 6000 approximate and exact designs demonstrates that our model-to-circuit cross-approximation delivers power and area optimal designs that, compared to the state-of-the-art exact designs, feature on average 51% and 66% area and power reduction, respectively, for less than 5% accuracy loss. Finally, we demonstrate that our framework enables 80% of the examined classifiers to be battery-powered with almost identical accuracy with the exact designs, paving thus the way towards smart complex printed applications.

cs.LG↗

arXiv2023

Co-Design of Approximate Multilayer Perceptron for Ultra-Resource Constrained Printed Circuits

Printed Electronics (PE) exhibits on-demand, extremely low-cost hardware due to its additive manufacturing process, enabling machine learning (ML) applications for domains that feature ultra-low cost, conformity, and non-toxicity requirements that silicon-based systems cannot deliver. Nevertheless, large feature sizes in PE prohibit the realization of complex printed ML circuits. In this work, we present, for the first time, an automated printed-aware software/hardware co-design framework that exploits approximate computing principles to enable ultra-resource constrained printed multilayer perceptrons (MLPs). Our evaluation demonstrates that, compared to the state-of-the-art baseline, our circuits feature on average 6x (5.7x) lower area (power) and less than 1% accuracy loss.

cs.LG↗

arXiv2023

Hardware-Aware Automated Neural Minimization for Printed Multilayer Perceptrons

The demand of many application domains for flexibility, stretchability, and porosity cannot be typically met by the silicon VLSI technologies. Printed Electronics (PE) has been introduced as a candidate solution that can satisfy those requirements and enable the integration of smart devices on consumer goods at ultra low-cost enabling also in situ and ondemand fabrication. However, the large features sizes in PE constraint those efforts and prohibit the design of complex ML circuits due to area and power limitations. Though, classification is mainly the core task in printed applications. In this work, we examine, for the first time, the impact of neural minimization techniques, in conjunction with bespoke circuit implementations, on the area-efficiency of printed Multilayer Perceptron classifiers. Results show that for up to 5% accuracy loss up to 8x area reduction can be achieved.

cs.AR↗

arXiv2022

Approximate Computing and the Efficient Machine Learning Expedition

Approximate computing (AxC) has been long accepted as a design alternative for efficient system implementation at the cost of relaxed accuracy requirements. Despite the AxC research activities in various application domains, AxC thrived the past decade when it was applied in Machine Learning (ML). The by definition approximate notion of ML models but also the increased computational overheads associated with ML applications-that were effectively mitigated by corresponding approximations-led to a perfect matching and a fruitful synergy. AxC for AI/ML has transcended beyond academic prototypes. In this work, we enlighten the synergistic nature of AxC and ML and elucidate the impact of AxC in designing efficient ML systems. To that end, we present an overview and taxonomy of AxC for ML and use two descriptive application scenarios to demonstrate how AxC boosts the efficiency of ML systems.

cs.AR↗

arXiv2022

Approximate Decision Trees For Machine Learning Classification on Tiny Printed Circuits

Although Printed Electronics (PE) cannot compete with silicon-based systems in conventional evaluation metrics, e.g., integration density, area and performance, PE offers attractive properties such as on-demand ultra-low-cost fabrication, flexibility and non-toxicity. As a result, it targets application domains that are untouchable by lithography-based silicon electronics and thus have not yet seen much proliferation of computing. However, despite the attractive characteristics of PE, the large feature sizes in PE prohibit the realization of complex printed circuits, such as Machine Learning (ML) classifiers. In this work, we exploit the hardware-friendly nature of Decision Trees for machine learning classification and leverage the hardware-efficiency of the approximate design in order to generate approximate ML classifiers that are suitable for tiny, ultra-resource constrained, and battery-powered printed applications.

cs.AR↗

arXiv2022

Cross-Layer Approximation For Printed Machine Learning Circuits

Printed electronics (PE) feature low non-recurring engineering costs and low per unit-area fabrication costs, enabling thus extremely low-cost and on-demand hardware. Such low-cost fabrication allows for high customization that would be infeasible in silicon, and bespoke architectures prevail to improve the efficiency of emerging PE machine learning (ML) applications. However, even with bespoke architectures, the large feature sizes in PE constraint the complexity of the ML models that can be implemented. In this work, we bring together, for the first time, approximate computing and PE design targeting to enable complex ML models, such as Multi-Layer Perceptrons (MLPs) and Support Vector Machines (SVMs), in PE. To this end, we propose and implement a cross-layer approximation, tailored for bespoke ML architectures. At the algorithmic level we apply a hardware-driven coefficient approximation of the ML model and at the circuit level we apply a netlist pruning through a full search exploration. In our extensive experimental evaluation we consider 14 MLPs and SVMs and evaluate more than 4300 approximate and exact designs. Our results demonstrate that our cross approximation delivers Pareto optimal designs that, compared to the state-of-the-art exact designs, feature 47% and 44% average area and power reduction, respectively, and less than 1% accuracy loss.

cs.LG↗

arXiv2014

Towards Cross-layer Reliability Analysis of Transient and Permanent Faults

Due to the increasing complexity of Multi-Processor Systems on Chip (MPSoCs), system-level design methodologies have got a lot of attention in recent years. However, the significant gap between the system-level reliability analysis and the level where the actual faults occur necessitates a cross-layer approach in which the sufficient data about the effects of faults at low levels are passed to the system level. So far, the cross-layer reliability analysis techniques focus on a specific type of faults, e.g., either permanent or transient faults. In this work, we aim at proposing a cross-layer reliability analysis which considers different fault types concurrently and connects reliability analysis techniques at different levels of abstraction using adapters.

cs.DC↗

arXiv2007

An Accurate SER Estimation Method Based on Propagation Probability

In this paper, we present an accurate but very fast soft error rate (SER) estimation technique for digital circuits based on error propagation probability (EPP) computation. Experiments results and comparison of the results with the random simulation technique show that our proposed method is on average within 6% of the random simulation method and four to five orders of magnitude faster.

cs.AR↗