arXiv subjects

Rachel Kahler

Publications and source records attributed to Rachel Kahler.

4 recordsLinked to original sources

arXiv2026

4 MV/cm (010) $\beta$-Ga$_2$O$_3$ Heterojunction Diodes Realized by Low-Damage e-Beam NiO$_x$ Interlayers

We report on the utilization of a low-damage e-beam NiO$_x$ deposition process to realize field-plated heterojunction diodes (FP-HJDs) on (010) $\beta$-Ga$_2$O$_3$ films with high critical breakdown field strengths beyond 4 MV/cm and power figure of merits (PFOM) of >1 GW/cm$^2$. Diodes were fabricated on a 2.67 $\times$ 10$^{16}$ cm$^{-3}$ intentionally doped 6.2 $\mu$m thick epitaxial layer grown by metalorganic chemical vapor deposition (MOCVD) on a conductive Sn-doped $\beta$-Ga$_2$O$_3$ (010) substrate using TMGa, O$_2$, Ar carrier gas, and SiH$_4$ as the silicon dopant source. The mesa etched FP-HJD devices utilized a thin 7 nm e-beam NiO$_x$ interlayer before the sputtered NiO$_x$ layers to eliminate the effects of sputter-induced ion damage on the (010) epilayers. Current-Voltage measurements resulted in a forward current density of 700 A/cm$^2$ at 4 V, HJD ideality factor of 1.29, a V$_{bi}$ of 2 V, rectification ratio of 10$^{11}$, and a differential specific on resistance (R$_{on,sp}$) value of 2.36 m$\Omega$ $\times$ cm$^2$. Breakdown of the (010) FP-HJDs was 1.64 kV, leading to a parallel plane electric field at breakdown (E$_{||,max}$) of 4.02 MV/cm and a PFOM of 1.14 GW/cm$^2$, which is a state-of-the-art result for diodes on MOCVD-grown (010) drift layers.

cond-mat.mtrl-sci↗

arXiv2025

Realization of Insulating Buffer Layers via MOCVD-Grown Nitrogen-Doped (010) \b{eta}-Ga2O3

We present MOCVD-grown, nitrogen-doped \b{eta}-Ga2O3 films as an insulating buffer layer on Fe-doped (010) \b{eta}-Ga2O3 substrates in lieu of 49% HF treatment to remove unintentional silicon at the substrate-epitaxial layer growth interface. N-doped layer thickness and NH3 flow were systematically varied to experimentally determine the lowest nitrogen concentration and thickness of the buffer layer needed to fully compensate the interfacial silicon peak. The NH3 molar flow rate was varied from 200 sccm to 1800 sccm. Results showed fully insulating N-doped layers for samples with NH3 flow rates greater than or equal to 1200 sccm and a thickness of 50 nm. This study demonstrates the efficacy of in-situ, controllably doped nitrogen buffer layers as a mitigation method for unintentional interfacial silicon at the substrate-epitaxial layer growth interface.

cond-mat.mtrl-sci↗

arXiv2025

Kilovolt-Class $β-Ga_2O_3$ Field-Plated Schottky Barrier Diodes with MOCVD-Grown Intentionally $10^{15}$ $cm^{-3}$ Doped Drift Layers

We report on the growth optimization of intentionally low-doped ($10^{15}$ $cm^{-3}$) high-quality $β-Ga_2O_3$ drift layers up to 10 $μm$ thick via MOCVD and the fabrication of kilovolt-class field plated Schottky barrier diodes on these thick drift layers. Homoepitaxial growth was performed on (010) $10^{15}$ $cm^{-3}$ substrates using TMGa as the Ga precursor. Growth parameters were systematically optimized to determine the best conditions for high quality thick growths with the given reactor geometry. Chamber pressure was found to improve the growth rate, mobility, and roughness of the samples. Growth rates of up to 7.2 $μm$/hr., thicknesses of up to 10 $μm$, Hall mobilities of up to 176 $cm^2$/Vs, RMS roughness down to 5.45 nm, UID concentrations as low as $2 \times$ $10^{15}$ $cm^{-3}$, and controllable intentional doping down to $3 \times$ $10^{15}$ $cm^{-3}$ were achieved. Field plated Schottky barrier diodes (FP-SBDs) were fabricated on a $6.5 \times$ $10^{15}$ $cm^{-3}$ intentionally doped 10 $μm$ thick film to determine the electrical performance of the MOCVD-grown material. The FP-SBD was found to have current density $>$100 A/$cm^2$ at 3 V forward bias with a specific differential on resistance ($R_{on,sp}$) of 16.22 m$Ω$.$cm^2$ and a turn on voltage of 1 V. The diodes were found to have high quality anode metal/semiconductor interfaces with an ideality factor of 1.04, close to unity. Diodes had a maximum breakdown voltage of 1.50 kV, leading to a punch-through maximum field of 2.04 MV/cm under the anode metal, which is a state-of-the-art result for SBDs on MOCVD-grown (010) drift layers.

physics.app-ph↗

arXiv2024

Record-High Electron Mobility and Controlled Low 10$^{15}$ cm$^{-3}$ Si-doping in (010) $β$-Ga$_2$O$_3$ Epitaxial Drift Layers

We report on metalorganic chemical vapor deposition (MOCVD) growth of controllably Si-doped 4.5 $μ$m thick $β$-Ga$_2$O$_3$ films with electron concentrations in the 10$^{15}$ cm$^{-3}$ range and record-high room temperature Hall electron mobilities of up to 200 cm$^2$/V.s, reaching the predicted theoretical maximum room temperature mobility value for $β$-Ga$_2$O$_3$. Growth of the homoepitaxial films was performed on Fe-doped (010) $β$-Ga$_2$O$_3$ substrates at a growth rate of 1.9 $μ$m/hr using TEGa as the Gallium precursor. To probe the background electron concentration, an unintentionally doped film was grown with a Hall concentration of 3.43 x 10$^{15}$ cm$^{-3}$ and Hall mobility of 196 cm$^2$/V.s. Growth of intentionally Si-Doped films was accomplished by fixing all growth conditions and varying only the silane flow, with controllable Hall electron concentrations ranging from 4.38 x 10$^{15}$ cm$^{-3}$ to 8.30 x 10$^{15}$ cm$^{-3}$ and exceptional Hall mobilities ranging from 194 - 200 cm$^2$/V.s demonstrated. C-V measurements showed a flat charge profile with the N$_D^+$ - N$_A^-$ values correlating well with the Hall-measured electron concentration in the films. SIMS measurements showed the silicon atomic concentration matched the Hall electron concentration with Carbon and Hydrogen below detection limit in the films. The Hall, C-V, and SIMS data indicate the growth of high-quality 4.5 $μ$m thick $β$-Ga$_2$O$_3$ films and controllable doping into the mid 10$^{15}$ cm$^{-3}$ range. These results demonstrate MOCVD growth of electronics grade record-high mobility, low carrier density, and thick $β$-Ga$_2$O$_3$ drift layers for next generation vertical $β$-Ga$_2$O$_3$ power devices.

physics.app-ph↗