arXiv subjects

S. Grinstein

Publications and source records attributed to S. Grinstein.

30 records · Page 2Linked to original sources

arXiv2017

Gain and time resolution of 45 $μ$m thin Low Gain Avalanche Detectors before and after irradiation up to a fluence of $10^{15}$ n$_{eq}$/cm$^2$

Low Gain Avalanche Detectors (LGADs) are silicon sensors with a built-in charge multiplication layer providing a gain of typically 10 to 50. Due to the combination of high signal-to-noise ratio and short rise time, thin LGADs provide good time resolutions. LGADs with an active thickness of about 45 $μ$m were produced at CNM Barcelona. Their gains and time resolutions were studied in beam tests for two different multiplication layer implantation doses, as well as before and after irradiation with neutrons up to $10^{15}$ n$_{eq}$/cm$^2$. The gain showed the expected decrease at a fixed voltage for a lower initial implantation dose, as well as for a higher fluence due to effective acceptor removal in the multiplication layer. Time resolutions below 30 ps were obtained at the highest applied voltages for both implantation doses before irradiation. Also after an intermediate fluence of $3\times10^{14}$ n$_{eq}$/cm$^2$, similar values were measured since a higher applicable reverse bias voltage could recover most of the pre-irradiation gain. At $10^{15}$ n$_{eq}$/cm$^2$, the time resolution at the maximum applicable voltage of 620 V during the beam test was measured to be 57 ps since the voltage stability was not good enough to compensate for the gain layer loss. The time resolutions were found to follow approximately a universal function of gain for all implantation doses and fluences.

physics.ins-det↗

arXiv2016

Module production of the one-arm AFP 3D pixel tracker

The ATLAS Forward Proton (AFP) detector is designed to identify events in which one or two protons emerge intact from the LHC collisions. AFP will consist of a tracking detector, to measure the momentum of the protons, and a time of flight system to reduce the background from multiple proton-proton interactions. Following an extensive qualification period, 3D silicon pixel sensors were selected for the AFP tracker. The sensors were produced at CNM (Barcelona) during 2014. The tracker module assembly and quality control was performed at IFAE during 2015. The assembly of the first AFP arm and the following installation in the LHC tunnel took place in February 2016. This paper reviews the fabrication process of the AFP tracker focusing on the pixel modules.

physics.ins-det↗

arXiv2016

3D silicon pixel detectors for the High-Luminosity LHC

3D silicon pixel detectors have been investigated as radiation-hard candidates for the innermost layers of the HL-LHC upgrade of the ATLAS pixel detector. 3D detectors are already in use today in the ATLAS IBL and AFP experiments. These are based on 50x250 um2 large pixels connected to the FE-I4 readout chip. Detectors of this generation were irradiated to HL-LHC fluences and demonstrated excellent radiation hardness with operational voltages as low as 180 V and power dissipation of 12--15 mW/cm2 at a fluence of about 1e16 neq/cm2, measured at -25 degree C. Moreover, to cope with the higher occupancies expected at the HL-LHC, a first run of a new generation of 3D detectors designed for the HL-LHC was produced at CNM with small pixel sizes of 50x50 and 25x100 um2, matched to the FE-I4 chip. They demonstrated a good performance in the laboratory and in beam tests with hit efficiencies of about 97% at already 1--2V before irradiation.

physics.ins-det↗

arXiv2016

Beam tests of an integrated prototype of the ATLAS Forward Proton detector

The ATLAS Forward Proton (AFP) detector is intended to measure protons scattered at small angles from the ATLAS interaction point. To this end, a combination of 3D Silicon pixel tracking modules and Quartz-Cherenkov time-of-flight (ToF) detectors is installed 210m away from the interaction point at both sides of ATLAS. Beam tests with an AFP prototype detector combining tracking and timing sub-detectors and a common readout have been performed at the CERN-SPS test-beam facility in November 2014 and September 2015 to complete the system integration and to study the detector performance. The successful tracking-timing integration was demonstrated. Good tracker hit efficiencies above 99.9% at a sensor tilt of 14°, as foreseen for AFP, were observed. Spatial resolutions in the short pixel direction with 50 μm pitch of 5.5 +/- 0.5 μm per pixel plane and of 2.8 +/- 0.5 μm for the full four-plane tracker at 14° were found, largely surpassing the AFP requirement of 10 μm. The timing detector showed also good hit efficiencies above 99%, and a full-system time resolution of 35 +/- 6 ps was found for the ToF prototype detector with two Quartz bars in-line (half the final AFP size) without dedicated optimisation, fulfilling the requirements for initial low-luminosity AFP runs.

physics.ins-det↗

arXiv2016

3D sensors for the HL-LHC

In order to increase its discovery potential, the Large Hadron Collider (LHC) accelerator will be upgraded in the next decade. The high luminosity LHC (HL-LHC) period demands new sensor technologies to cope with increasing radiation fluences and particle rates. The ATLAS experiment will replace the entire inner tracking detector with a completely new silicon-only system. 3D pixel sensors are promising candidates for the innermost layers of the Pixel detector due to their excellent radiation hardness at low operation voltages and low power dissipation at moderate temperatures. Recent developments of 3D sensors for the HL-LHC are presented.

physics.ins-det↗

arXiv2015

Beam Test Studies of 3D Pixel Sensors Irradiated Non-Uniformly for the ATLAS Forward Physics Detector

Pixel detectors with cylindrical electrodes that penetrate the silicon substrate (so called 3D detectors) offer advantages over standard planar sensors in terms of radiation hardness, since the electrode distance is decoupled from the bulk thickness. In recent years significant progress has been made in the development of 3D sensors, which culminated in the sensor production for the ATLAS Insertable B-Layer (IBL) upgrade carried out at CNM (Barcelona, Spain) and FBK (Trento, Italy). Based on this success, the ATLAS Forward Physics (AFP) experiment has selected the 3D pixel sensor technology for the tracking detector. The AFP project presents a new challenge due to the need for a reduced dead area with respect to IBL, and the in-homogeneous nature of the radiation dose distribution in the sensor. Electrical characterization of the first AFP prototypes and beam test studies of 3D pixel devices irradiated non-uniformly are presented in this paper.

physics.ins-det↗

arXiv2013

Operational experience, improvements, and performance of the CDF Run II silicon vertex detector

The Collider Detector at Fermilab (CDF) pursues a broad physics program at Fermilab's Tevatron collider. Between Run II commissioning in early 2001 and the end of operations in September 2011, the Tevatron delivered 12 fb-1 of integrated luminosity of p-pbar collisions at sqrt(s)=1.96 TeV. Many physics analyses undertaken by CDF require heavy flavor tagging with large charged particle tracking acceptance. To realize these goals, in 2001 CDF installed eight layers of silicon microstrip detectors around its interaction region. These detectors were designed for 2--5 years of operation, radiation doses up to 2 Mrad (0.02 Gy), and were expected to be replaced in 2004. The sensors were not replaced, and the Tevatron run was extended for several years beyond its design, exposing the sensors and electronics to much higher radiation doses than anticipated. In this paper we describe the operational challenges encountered over the past 10 years of running the CDF silicon detectors, the preventive measures undertaken, and the improvements made along the way to ensure their optimal performance for collecting high quality physics data. In addition, we describe the quantities and methods used to monitor radiation damage in the sensors for optimal performance and summarize the detector performance quantities important to CDF's physics program, including vertex resolution, heavy flavor tagging, and silicon vertex trigger performance.

physics.ins-det↗

arXiv2012

Planar Pixel Sensors for the ATLAS Upgrade: Beam Tests results

Results of beam tests with planar silicon pixel sensors aimed towards the ATLAS Insertable B-Layer and High Luminosity LHC (HL-LHC) upgrades are presented. Measurements include spatial resolution, charge collection performance and charge sharing between neighbouring cells as a function of track incidence angle for different bulk materials. Measurements of n-in-n pixel sensors are presented as a function of fluence for different irradiations. Furthermore p-type silicon sensors from several vendors with slightly differing layouts were tested. All tested sensors were connected by bump-bonding to the ATLAS Pixel read-out chip. We show that both n-type and p-type tested planar sensors are able to collect significant charge even after integrated fluences expected at HL-LHC.

physics.ins-det↗

arXiv2011

Test Beam Results of 3D Silicon Pixel Sensors for the ATLAS upgrade

Results on beam tests of 3D silicon pixel sensors aimed at the ATLAS Insertable-B-Layer and High Luminosity LHC (HL-LHC)) upgrades are presented. Measurements include charge collection, tracking efficiency and charge sharing between pixel cells, as a function of track incident angle, and were performed with and without a 1.6 T magnetic field oriented as the ATLAS Inner Detector solenoid field. Sensors were bump bonded to the front-end chip currently used in the ATLAS pixel detector. Full 3D sensors, with electrodes penetrating through the entire wafer thickness and active edge, and double-sided 3D sensors with partially overlapping bias and read-out electrodes were tested and showed comparable performance.

physics.ins-det↗

arXiv2010

The D0 Silicon Microstrip Tracker

This paper describes the mechanical design, the readout chain, the production, testing and the installation of the Silicon Microstrip Tracker of the D0 experiment at the Fermilab Tevatron collider. In addition, description of the performance of the detector during the experiment data collection between 2001 and 2010 is provided.

physics.ins-det↗

arXiv2009

Preliminary results of 3D-DDTC pixel detectors for the ATLAS upgrade

3D Silicon sensors fabricated at FBK-irst with the Double-side Double Type Column (DDTC) approach and columnar electrodes only partially etched through p-type substrates were tested in laboratory and in a 1.35 Tesla magnetic field with a 180GeV pion beam at CERN SPS. The substrate thickness of the sensors is about 200um, and different column depths are available, with overlaps between junction columns (etched from the front side) and ohmic columns (etched from the back side) in the range from 110um to 150um. The devices under test were bump bonded to the ATLAS Pixel readout chip (FEI3) at SELEX SI (Rome, Italy). We report leakage current and noise measurements, results of functional tests with Am241 gamma-ray sources, charge collection tests with Sr90 beta-source and an overview of preliminary results from the CERN beam test.

physics.ins-det↗

arXiv2000

Run II Jet Physics: Proceedings of the Run II QCD and Weak Boson Physics Workshop

The Run II jet physics group includes the Jet Algorithms, Jet Shape/Energy Flow, and Jet Measurements/Correlations subgroups. The main goal of the jet algorithm subgroup was to explore and define standard Run II jet finding procedures for CDF and DO. The focus of the jet shape/energy flow group was the study of jets as objects and the energy flows around these objects. The jet measurements/correlations subgroup discussed measurements at different beam energies; strong coupling constant measurements; and LO, NLO, NNLO, and threshold jet calculations. As a practical matter the algorithm and shape/energy flow groups merged to concentrate on the development of Run II jet algorithms that are both free of theoretical and experimental difficulties and able to reproduce Run I measurements. Starting from a review of the experience gained during Run I, the group considered a variety of cone algorithms and KT algorithms. The current understanding of both types of algorithms, including calibration issues, are discussed in this report along with some preliminary experimental results. The jet algorithms group recommends that CDF and DO employ the same version of both a cone algorithm and a KT algorithm during Run II. Proposed versions of each type of algorithm are discussed. The group also recommends the use of full 4-vector kinematic variables whenever possible. The recommended algorithms attempt to minimize the impact of seeds in the case of the cone algorithm and preclustering in the case of the KT algorithm. Issues regarding precluster definitions and merge/split criteria require further study.

hep-ex↗