arXiv subjects

S. Grinstein

Publications and source records attributed to S. Grinstein.

At least 19 recordsLinked to original sources

arXiv2026

Test-beam results from MiniCACTUS-v2: A depleted monolithic CMOS timing sensor prototype

MiniCACTUS-v2 is a monolithic sensor prototype designed in LF 150 nm CMOS process for time tagging of individual Minimum Ionizing Particles with an accuracy better than 100 ps. The sensing element is a deep n-well/p-substrate diode without internal amplification. To minimize detector capacitances, the analog front-ends and the discriminators for each pixel have been implemented outside the pixel, at the column level. After fabrication, the sensors have been thinned to 150 microns, 175 microns and 200 microns and then post-processed for backside biasing. The breakdown voltages measured on these sensors are higher than 500 V, ensuring the complete depletion of the charge collection volume. In this paper, we will focus on the time resolution measurements from a test-beam campaign conducted in July 2025 at SPS-CERN. During this period, several pixels from the 3 different sensor thicknesses have been tested at different bias voltages. The best time resolution measured is 48.88 ps on a 0.5 mm x 0.5 mm pixel from a 175 microns-thick sensor at 500 V, with nominal settings for the on-chip analog front-end and discriminator.

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arXiv2025

Beam-test evaluation of pre-production Low Gain Avalanche Detectors for the ATLAS High Granularity Timing Detector

The High Granularity Timing Detector (HGTD) will be installed in the ATLAS experiment as part of the Phase-II upgrade for the High Luminosity-Large Hadron Collider (HL-LHC). It will mitigate pile-up effects in the forward region, and measure per bunch luminosity. The design of HGTD is based on Low Gain Avalanche Detector (LGAD) sensors. This paper presents the results of beam-test campaigns conducted at CERN and DESY in 2023 and 2024 on single LGADs from HGTD pre-production test structures, before and after neutron irradiation up to fluences of $2.5 \times 10^{15}~\mathrm{n_{eq}/cm^2}$. The tested LGADs can meet HGTD requirements in terms of charge collection, time resolution, and hit efficiency, even under HL-LHC end-of-life conditions, supporting their deployment in the final detector.

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arXiv2025

Thermal Cycling Reliability of Hybrid Pixel Sensor Modules for The ATLAS High Granularity Timing Detector

The reliability of bump connection structures has become a critical aspect of future silicon detectors for particle physics. The High Granularity Timing Detector (HGTD) for the ATLAS experiment at the High-Luminosity Large Hadron Collider will require 8032 hybrid pixel sensor modules, composed of two Low Gain Avalanche Diode sensors bump-bonded to two readout ASICs and glued to a passive PCB. The detector will operate at low temperature (-30 degrees Celsius) to mitigate the impact of irradiation. The thermomechanical reliability of flip-chip bump connections in HGTD modules is a critical concern, particularly due to their characteristically lower bump density (pixel pitch dimensions of 1.3 mm by 1.3 mm). This paper elaborates on the challenges arising from this design characteristic. Finite element analysis and experimental testing were employed to investigate failure modes in the flip-chip bump structures under thermal cycling from -45 degrees Celsius to 40 degrees Celsius and to guide the module redesign. The optimized design demonstrates significantly enhanced robustness and is projected to fulfill the full lifetime requirements of the HGTD.

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arXiv2023

Destructive breakdown studies of irradiated LGADs at beam tests for the ATLAS HGTD

In the past years, it has been observed at several beam test campaigns that irradiated LGAD sensors break with a typical star shaped burn mark when operated at voltages much lower than those at which they were safely operated during laboratory tests. The study presented in this paper was designed to determine the safe operating voltage that these sensors can withstand. Many irradiated sensors from various producers were tested in two test beam facilities, DESY (Hamburg) and CERN-SPS (Geneva), as part of ATLAS High Granularity Timing Detector (HGTD) beam tests. The samples were placed in the beam and kept under bias over a long period of time in order to reach a high number of particles crossing each sensor. Both beam tests lead to a similar conclusion, that these destructive events begin to occur when the average electric field in the sensor becomes larger than 12 Volts per micrometre.

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arXiv2023

Performance of a front-end prototype ASIC for the ATLAS High Granularity Timing Detector

This paper presents the design and characterisation of a front-end prototype ASIC for the ATLAS High Granularity Timing Detector, which is planned for the High-Luminosity phase of the LHC. This prototype, called ALTIROC1, consists of a 5$\times$5-pad matrix and contains the analog part of the single-channel readout (preamplifier, discriminator, two TDCs and SRAM). Two preamplifier architectures (transimpedance and voltage) were implemented and tested. The ASIC was characterised both alone and as a module when connected to a 5$\times$5-pad array of LGAD sensors. In calibration measurements, the ASIC operating alone was found to satisfy the technical requirements for the project, with similar performances for both preamplifier types. In particular, the jitter was found to be 15$\pm$1~ps (35$\pm$1~ps) for an injected charge of 10~fC (4~fC). A degradation in performance was observed when the ASIC was connected to the LGAD array. This is attributed to digital couplings at the entrance of the preamplifiers. When the ASIC is connected to the LGAD array, the lowest detectable charge increased from 1.5~fC to 3.4~fC. As a consequence, the jitter increased for an injected charge of 4~fC. Despite this increase, ALTIROC1 still satisfies the maximum jitter specification (below 65~ps) for the HGTD project. This coupling issue also affects the time over threshold measurements and the time-walk correction can only be performed with transimpedance preamplifiers. Beam test measurements with a pion beam at CERN were also undertaken to evaluate the performance of the module. The best time resolution obtained using only ALTIROC TDC data was 46.3$\pm$0.7~ps for a restricted time of arrival range where the coupling issue is minimized. The residual time-walk contribution is equal to 23~ps and is the dominant electronic noise contribution to the time resolution at 15~fC.

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arXiv2023

Performance in beam tests of Carbon-enriched irradiated Low Gain Avalanche Detectors for the ATLAS High Granularity Timing Detector

The High Granularity Timing Detector (HGTD) will be installed in the ATLAS experiment to mitigate pile-up effects during the High Luminosity (HL) phase of the Large Hadron Collider (LHC) at CERN. Low Gain Avalanche Detectors (LGADs) will provide high-precision measurements of the time of arrival of particles at the HGTD, improving the particle-vertex assignment. To cope with the high-radiation environment, LGADs have been optimized by adding carbon in the gain layer, thus reducing the acceptor removal rate after irradiation. Performances of several carbon-enriched LGAD sensors from different vendors, and irradiated with high fluences of 1.5 and 2.5 x 10^15 neq/cm2, have been measured in beam test campaigns during the years 2021 and 2022 at CERN SPS and DESY. This paper presents the results obtained with data recorded by an oscilloscope synchronized with a beam telescope which provides particle position information within a resolution of a few um. Collected charge, time resolution and hit efficiency measurements are presented. In addition, the efficiency uniformity is also studied as a function of the position of the incident particle inside the sensor pad.

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arXiv2021

Comprehensive technology study of radiation hard LGADs

Towards radiation tolerant sensors for pico-second timing, several dopants are explored. Using a common mask, CNM produced LGADs with boron, boron + carbon and gallium implanted gain layers are studied under neutron and proton irradiation. With fluences ranging from $10^{14}$ to $6\times 10^{15} n_{eq}/cm^{2}$ on both particle species, reported results focus on acceptor removal and gain reduction via electrical characterization. Timing performance, charge collection, gain and relative efficiency are treated through charged particle measurements, including signal analysis and noise characterization. An accent is placed on stability, via dark rate and operating voltage studies while, radiation related gain reduction mechanisms are examined comparing gain estimations through different approaches.

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arXiv2021

The TaichuPix1: A Monolithic Active Pixel Sensor with fast in-pixel readout electronics for the CEPC vertex detector

The proposed Circular Electron Positron Collider (CEPC) imposes new challenges for the vertex detector in terms of high resolution, low material, fast readout and low power. The Monolithic Active Pixel Sensor (MAPS) technology has been chosen as one of the most promising candidates to satisfy these requirements. A MAPS prototype, called TaichuPix1, based on a data-driven structure, together with a column drain readout architecture, benefiting from the ALPIDE and FE-I3 approaches, has been implemented to achieve fast readout. This paper presents the overall architecture of TaichuPix1, the experimental characterization of the FE-I3-like matrix, the threshold dispersion, the noise distribution of the pixels and verifies the charge collection using a radioactive source. These results prove the functionality of the digital periphery and serializer are able to transmit the collected charge to the data interface correctly. Moreover, the individual self-tests of the serializer verify it can work up to about 3 Gbps. And it also indicates that the analog front-end features a fast-rising signal with a short time walk and that the FE-I3-like in-pixel digital logic is properly operating at the 40 MHz system clock.

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arXiv2020

Radiation Campaign of HPK Prototype LGAD sensors for the High-Granularity Timing Detector (HGTD)

We report on the results of a radiation campaign with neutrons and protons of Low Gain Avalanche Detectors (LGAD) produced by Hamamatsu (HPK) as prototypes for the High-Granularity Timing Detector (HGTD) in ATLAS. Sensors with an active thickness of 50~$\mu$m were irradiated in steps of roughly 2$\times$ up to a fluence of $3\times10^{15}~\mathrm{n_{eq}cm^{-2}}$. As a function of the fluence, the collected charge and time resolution of the irradiated sensors will be reported for operation at $-30^{\circ}$.

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arXiv2020

Layout and Performance of HPK Prototype LGAD Sensors for the High-Granularity Timing Detector

The High-Granularity Timing Detector is a detector proposed for the ATLAS Phase II upgrade. The detector, based on the Low-Gain Avalanche Detector (LGAD) technology will cover the pseudo-rapidity region of $2.4<|\eta|<4.0$ with two end caps on each side and a total area of 6.4 $m^2$. The timing performance can be improved by implanting an internal gain layer that can produce signal with a fast rising edge, which improve significantly the signal-to-noise ratio. The required average timing resolution per track for a minimum-ionising particle is 30 ps at the start and 50 ps at the end of the HL-LHC operation. This is achieved with several layers of LGAD. The innermost region of the detector would accumulate a 1 MeV-neutron equivalent fluence up to $2.5 \times 10^{15} cm^{-2}$ before being replaced during the scheduled shutdowns. The addition of this new detector is expected to play an important role in the mitigation of high pile-up at the HL-LHC. The layout and performance of the various versions of LGAD prototypes produced by Hamamatsu (HPK) have been studied by the ATLAS Collaboration. The breakdown voltages, depletion voltages, inter-pad gaps, collected charge as well as the time resolution have been measured and the production yield of large size sensors has been evaluated.

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arXiv2020

Performance of a Front End prototype ASIC for picosecond precision time measurements with LGAD sensors

For the High-Luminosity phase of LHC, the ATLAS experiment is proposing the addition of a High Granularity Timing Detector (HGTD) in the forward region to mitigate the effects of the increased pile-up. The chosen detection technology is Low Gain Avalanche Detector (LGAD) silicon sensors that can provide an excellent timing resolution below 50 ps. The front-end read-out ASIC must maintain the performance of the sensor, while keeping low power consumption. This paper presents the results on the first prototype of a front-end ASIC, named ALTIROC0, which contains the analog stages (preamplifier and discriminator) of the read-out chip. The ASIC was characterised both alone and as part of a module with a 2$\times$2 LGAD array of 1.1$\times$1.1 mm$^2$ pads bump-bonded to it. The various contributions of the electronics to the time resolution were investigated in test-bench measurements with a calibration setup. Both when the ASIC is alone or with a bump-bonded sensor, the jitter of the ASIC is better than 20 ps for an injected charge of 10 fC. The time walk effect that arises from the different response of the preamplifier for various injected charges can be corrected up to 10 ps using a Time Over Threshold measurement. The combined performance of the ASIC and the LGAD sensor, which was measured during a beam test campaign in October 2018 with pions of 120 GeV energy at the CERN SPS, is around 40 ps for all measured modules. All tested modules show good efficiency and time resolution uniformity.

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arXiv2019

Performance of Irradiated RD53A 3D Pixel Sensors

The ATLAS experiment at the LHC will replace its current inner tracker system for the HL-LHC era. 3D silicon pixel sensors are being considered as radiation-hard candidates for the innermost layers of the new fully silicon-based tracking detector. 3D sensors with a small pixel size of $\mathrm{50 \times 50~\mu m^{2}}$ and $\mathrm{25 \times 100~\mu m^{2}}$ compatible with the first prototype ASIC for the HL-LHC, the RD53A chip, have been studied in beam tests after uniform irradiation to $\mathrm{5 \times 10^{15}~n_{eq}/cm^{2}}$. An operation voltage of only 50 V is needed to achieve a 97% hit efficiency after this fluence.

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arXiv2018

Characterisation of AMS H35 HV-CMOS monolithic active pixel sensor prototypes for HEP applications

Monolithic active pixel sensors produced in High Voltage CMOS (HV-CMOS) technology are being considered for High Energy Physics applications due to the ease of production and the reduced costs. Such technology is especially appealing when large areas to be covered and material budget are concerned. This is the case of the outermost pixel layers of the future ATLAS tracking detector for the HL-LHC. For experiments at hadron colliders, radiation hardness is a key requirement which is not fulfilled by standard CMOS sensor designs that collect charge by diffusion. This issue has been addressed by depleted active pixel sensors in which electronics are embedded into a large deep implantation ensuring uniform charge collection by drift. Very first small prototypes of hybrid depleted active pixel sensors have already shown a radiation hardness compatible with the ATLAS requirements. Nevertheless, to compete with the present hybrid solutions a further reduction in costs achievable by a fully monolithic design is desirable. The H35DEMO is a large electrode full reticle demonstrator chip produced in AMS 350 nm HV-CMOS technology by the collaboration of Karlsruher Institut f\"ur Technologie (KIT), Institut de F\'isica d'Altes Energies (IFAE), University of Liverpool and University of Geneva. It includes two large monolithic pixel matrices which can be operated standalone. One of these two matrices has been characterised at beam test before and after irradiation with protons and neutrons. Results demonstrated the feasibility of producing radiation hard large area fully monolithic pixel sensors in HV-CMOS technology. H35DEMO chips with a substrate resistivity of 200$\Omega$ cm irradiated with neutrons showed a radiation hardness up to a fluence of $10^{15}$n$_{eq}$cm$^{-2}$ with a hit efficiency of about 99% and a noise occupancy lower than $10^{-6}$ hits in a LHC bunch crossing of 25ns at 150V.

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arXiv2018

Radiation hardness of small-pitch 3D pixel sensors up to a fluence of $3\times10^{16}$ n$_{\mathrm{eq}}$/cm$^2$

Small-pitch 3D silicon pixel detectors have been investigated as radiation-hard candidates for the innermost layers of the HL-LHC pixel detector upgrades. Prototype 3D sensors with pixel sizes of 50$\times$50 and 25$\times$100 $\mu$m$^{2}$ connected to the existing ATLAS FE-I4 readout chip have been produced by CNM Barcelona. Irradiations up to particle fluences of $3\times10^{16}$ n$_{\mathrm{eq}}$/cm$^2$, beyond the full expected HL-LHC fluences at the end of lifetime, have been carried out at Karlsruhe and CERN. The performance of the 50$\times$50 $\mu$m$^{2}$ devices has been measured in the laboratory and beam tests at CERN SPS. A high charge collected and a high hit efficiency of 98% were found up to the highest fluence. The bias voltage to reach the target efficiency of 97% at perpendicular beam incidence was found to be about 100 V at $1.4\times10^{16}$ n$_{\mathrm{eq}}$/cm$^2$ and 150 V at $2.8\times10^{16}$ n$_{\mathrm{eq}}$/cm$^2$, significantly lower than for the previous IBL 3D generation with larger inter-electrode distance and than for planar sensors. The power dissipation at -25$^{\circ}$C and $1.4\times10^{16}$ n$_{\mathrm{eq}}$/cm$^2$ was found to be 13 mW/cm$^2$. Hence, 3D pixel detectors demonstrated superior radiation hardness and were chosen as the baseline for the inner layer of the ATLAS HL-LHC pixel detector upgrade.

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arXiv2018

Beam test measurements of Low Gain Avalanche Detector single pads and arrays for the ATLAS High Granularity Timing Detector

For the high luminosity upgrade of the LHC at CERN, ATLAS is considering the addition of a High Granularity Timing Detector (HGTD) in front of the end cap and forward calorimeters at |z| = 3.5 m and covering the region 2.4 < |{\eta}| < 4 to help reducing the effect of pile-up. The chosen sensors are arrays of 50 {\mu}m thin Low Gain Avalanche Detectors (LGAD). This paper presents results on single LGAD sensors with a surface area of 1.3x1.3 mm2 and arrays with 2x2 pads with a surface area of 2x2 mm^2 or 3x3 mm^2 each and different implant doses of the p+ multiplication layer. They are obtained from data collected during a beam test campaign in Autumn 2016 with a pion beam of 120 GeV energy at the CERN SPS. In addition to several quantities measured inclusively for each pad, the gain, efficiency and time resolution have been estimated as a function of the position of the incident particle inside the pad by using a beam telescope with a position resolution of few {\mu}m. Different methods to measure the time resolution are compared, yielding consistent results. The sensors with a surface area of 1.3x1.3 mm^2 have a time resolution of about 40 ps for a gain of 20 and of about 27 ps for a gain of 50 and fulfill the HGTD requirements. Larger sensors have, as expected, a degraded time resolution. All sensors show very good efficiency and time resolution uniformity.

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arXiv2017

Test beam measurement of ams H35 HV-CMOS capacitively coupled pixel sensor prototypes with high-resistivity substrate

In the context of the studies of the ATLAS High Luminosity LHC programme, radiation tolerant pixel detectors in CMOS technologies are investigated. To evaluate the effects of substrate resistivity on CMOS sensor performance, the H35DEMO demonstrator, containing different diode and amplifier designs, was produced in ams H35 HV-CMOS technology using four different substrate resistivities spanning from $\mathrm{80}$ to $\mathrm{1000~\Omega \cdot cm}$. A glueing process using a high-precision flip-chip machine was developed in order to capacitively couple the sensors to FE-I4 Readout ASIC using a thin layer of epoxy glue with good uniformity over a large surface. The resulting assemblies were measured in beam test at the Fermilab Test Beam Facilities with 120 GeV protons and CERN SPS H8 beamline using 80 GeV pions. The in-time efficiency and tracking properties measured for the different sensor types are shown to be compatible with the ATLAS ITk requirements for its pixel sensors.

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arXiv2017

Radiation Hardness of Thin Low Gain Avalanche Detectors

Low Gain Avalanche Detectors (LGAD) are based on a n++-p+-p-p++ structure where an appropriate doping of the multiplication layer (p+) leads to high enough electric fields for impact ionization. Gain factors of few tens in charge significantly improve the resolution of timing measurements, particularly for thin detectors, where the timing performance was shown to be limited by Landau fluctuations. The main obstacle for their operation is the decrease of gain with irradiation, attributed to effective acceptor removal in the gain layer. Sets of thin sensors were produced by two different producers on different substrates, with different gain layer doping profiles and thicknesses (45, 50 and 80 um). Their performance in terms of gain/collected charge and leakage current was compared before and after irradiation with neutrons and pions up to the equivalent fluences of 5e15 cm-2. Transient Current Technique and charge collection measurements with LHC speed electronics were employed to characterize the detectors. The thin LGAD sensors were shown to perform much better than sensors of standard thickness (~300 um) and offer larger charge collection with respect to detectors without gain layer for fluences <2e15 cm-2. Larger initial gain prolongs the beneficial performance of LGADs. Pions were found to be more damaging than neutrons at the same equivalent fluence, while no significant difference was found between different producers. At very high fluences and bias voltages the gain appears due to deep acceptors in the bulk, hence also in thin standard detectors.

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arXiv2017

Radiation hardness of small-pitch 3D pixel sensors up to HL-LHC fluences

A new generation of 3D silicon pixel detectors with a small pixel size of 50$\times$50 and 25$\times$100 $μ$m$^{2}$ is being developed for the HL-LHC tracker upgrades. The radiation hardness of such detectors was studied in beam tests after irradiation to HL-LHC fluences up to $1.4\times10^{16}$ n$_{\mathrm{eq}}$/cm$^2$. At this fluence, an operation voltage of only 100 V is needed to achieve 97% hit efficiency, with a power dissipation of 13 mW/cm$^2$ at -25$^{\circ}$C, considerably lower than for previous 3D sensor generations and planar sensors.

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