arXiv subjects

T. James Marrow

Publications and source records attributed to T. James Marrow.

3 recordsLinked to original sources

arXiv2025

DIC2Abaqus: Calculating mixed-mode stress intensity factors from 2D and 3D-stereo displacement fields

Integrating experimental data into simulations is crucial for predicting material behaviour, especially in fracture mechanics. Digital Image Correlation (DIC) provides precise displacement measurements, essential for evaluating strain energy release rates and stress intensity factors (SIF) around cracks. Translating DIC data into CAE software like ABAQUS has been challenging. DIC2CAE, a MATLAB-based tool, automates this conversion, enabling accurate simulations. It uses the J-integral method to calculate SIFs and handles complex scenarios without needing specimen geometry or applied loads. DIC2CAE enhances fracture mechanics simulations' reliability, accelerating materials research and development.

cs.CE↗

arXiv2023

An iterative method for reference pattern selection in high resolution electron backscatter diffraction (HR-EBSD)

For high (angular) resolution electron backscatter diffraction (HR-EBSD), the selection of a reference diffraction pattern (EBSP0) significantly affects the precision of the calculated strain and rotation maps. This effect was demonstrated in plastically deformed body-centred cubic and face-centred cubic ductile metals (ferrite and austenite grains in duplex stainless steel) and brittle single-crystal silicon, which showed that the effect is not only limited to measurement magnitude but also spatial distribution. An empirical relationship was then identified between the cross-correlation parameter and angular error, which was used in an iterative algorithm to identify the optimal reference pattern that maximises the precision of HR-EBSD.

cond-mat.mtrl-sci↗

arXiv2022

HR-EBSD analysis of in situ stable crack growth at the micron scale

Understanding the local fracture resistance of microstructural features. such as brittle inclusions, coatings, and interfaces at the microscale under complex loading conditions is critical for microstructure-informed design of materials. In this study, a novel approach has been formulated to decompose the J-integral evaluation of the elastic energy release rate to the three-dimensional stress intensity factors directly from experimental measurements of the elastic deformation gradient tensors of the crack field by in situ high (angular) resolution electron backscatter diffraction (HR-EBSD). An exemplar study is presented of a quasi-static crack, inclined to the observed surface, propagating on low index {hkl} planes in a (001) single crystal silicon wafer.

cond-mat.mtrl-sci↗