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arXiv · 2206.10243

HR-EBSD analysis of in situ stable crack growth at the micron scale

Abdalrhaman Koko·Thorsten H. Becker·Elsiddig Elmukashfi·Nicola M. Pugno·Angus J. Wilkinson·T. James Marrow
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Abstract

Understanding the local fracture resistance of microstructural features. such as brittle inclusions, coatings, and interfaces at the microscale under complex loading conditions is critical for microstructure-informed design of materials. In this study, a novel approach has been formulated to decompose the J-integral evaluation of the elastic energy release rate to the three-dimensional stress intensity factors directly from experimental measurements of the elastic deformation gradient tensors of the crack field by in situ high (angular) resolution electron backscatter diffraction (HR-EBSD). An exemplar study is presented of a quasi-static crack, inclined to the observed surface, propagating on low index {hkl} planes in a (001) single crystal silicon wafer.

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Abdalrhaman Koko, Thorsten H. Becker, Elsiddig Elmukashfi, Nicola M. Pugno, Angus J. Wilkinson, T. James Marrow. 2022-06-21. HR-EBSD analysis of in situ stable crack growth at the micron scale. https://doi.org/10.1016/j.jmps.2022.105173

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