arXiv subjects

Vincent Gambin

Publications and source records attributed to Vincent Gambin.

8 recordsLinked to original sources

arXiv2026

Band alignment of grafted diamond/GaN p-n heterojunctions interfaced with ALD Al2O3 and SiNx/Al2O3

Diamond and gallium nitride are complementary semiconductors for forming p-n junctions because of their respective doping limitations. Understanding the band alignment of grafted diamond/GaN heterojunctions is therefore essential for optimizing diode performance. In this study, the band alignment of diamond/Al2O3/GaN and diamond/Al2O3/SiNx/GaN heterostructures was determined by X-ray photoelectron spectroscopy. Both structures exhibit type-II band alignment, but with different band offsets. The band offsets of the diamond/Al2O3/SiNx/GaN heterojunction are larger by 0.42 eV than those of diamond/Al2O3/GaN. This difference is attributed to a modification of the interfacial electrostatic potential, which may arise from a reduced density of positive fixed charges in the interfacial dielectric near the diamond/Al2O3 interface after insertion of the SiNx layer. These results demonstrate that interfacial-layer engineering provides an effective strategy for tailoring the band alignment of grafted diamond/GaN heterojunctions, offering guidance for the design of p-n diodes with tunable rectifying characteristics.

cond-mat.mtrl-sci↗

arXiv2026

Grafted Low-Leakage Si/AlN p-n Diodes Enabled by Fluorinated AlN Interface

Ultrawide-bandgap AlN is a promising material for next-generation power electronics; however, its practical implementation is hindered by unstable surface chemistry and the high activation energy of p-type dopants. In particular, high-temperature rapid thermal annealing (RTA), required for forming low-resistance contacts on n-type AlN, leads to the formation of thick and defective surface oxides that degrade heterojunction performance. In this work, we present an interface engineering approach based on fluorination-induced AlFx formation combined with SiNx passivation to suppress defect-assisted leakage in p-Si/n-AlN heterojunction diodes fabricated via semiconductor grafting. A low-damage pseudo-atomic layer etching process is employed to remove RTA-induced oxides and restore a near-stoichiometric AlN surface. Subsequent XeF2 treatment forms an ultrathin AlFx layer, which is stabilized by an atomic-layer-deposited SiNx capping layer prior to p-Si nanomembrane integration. Electrical measurements show that the engineered AlFx/SiNx interface reduces reverse leakage current by several orders of magnitude compared to untreated or oxide-removed AlN surfaces, while preserving forward conduction characteristics. Temperature-dependent analysis indicates strong suppression of Poole-Frenkel emission and a shift of leakage onset to higher reverse bias, ultimately limited by bulk AlN crystal quality. X-ray photoelectron spectroscopy and transmission electron microscopy confirm the formation of Al-F bonds, reduced Al-O content, and the presence of a thin interfacial SiOx/SiON layer. These results establish AlFx/SiNx passivation as an effective strategy for stabilizing AlN interfaces and enabling low-leakage ultrawide-bandgap heterojunction devices.

cond-mat.mtrl-sci↗

arXiv2025

Preliminary Demonstration of Diamond-GaN pn Diodes via Grafting

Ultrawide bandgap (UWBG) semiconductors exhibit exceptional electrical and thermal properties, offering strong potential for high power and high frequency electronics. However, efficient doping in UWBG materials is typically limited to either n type or p type, constraining their application to unipolar devices. The realization of pn junctions through heterogeneous integration of complementary UWBG or WBG semiconductors is hindered by lattice mismatch and thermal expansion differences. Here, we report the preliminary demonstration of diamond GaN heterojunction pn diodes fabricated via grafting. A single crystalline p plus diamond nanomembrane was integrated onto an epitaxially grown c plane n plus GaN substrate with an ultrathin ALD Al2O3 interlayer. The resulting diodes exhibit an ideality factor of 1.55 and a rectification ratio of over 1e4. Structural and interfacial properties were examined by AFM, XRD, Raman, and STEM, providing critical insights to guide further optimization of diamond GaN pn heterojunction devices.

cond-mat.mtrl-sci↗

arXiv2024

Single-crystalline GaAs/Si Heterojunction Tunnel Diodes Interfaced by an Ultrathin Oxygen-enriched Layer

We report the fabrication and characteristics of GaAs/Si p+/n+ heterojunction tunnel diodes. These diodes were fabricated via grafting the freestanding single-crystalline p-type degenerately doped GaAs (4E19 cm-3) nanomembrane (NM) onto single-crystalline n-type Si (5E19 cm-3) substrate. At the heterointerface, an amorphous ultrathin oxygen-enriched layer (UOL) was intentionally engineered through chemical oxidation and atomic layer deposition (ALD). Scanning transmission electron microscopy (STEM) confirmed the formation of the UOL and the single crystallinity of the grafted junction. The resulting tunnel diodes consistently exhibited negative differential resistance (NDR) behavior at room temperature, with a high maximum peak-to-valley current ratio (PVCR) of 36.38, valley voltages ranging from 1.3 to 1.8 V, and a peak tunneling current density of 0.95 kA/cm2. This study not only highlights the critical roles of the UOL as both an interface improvement layer and a quantum tunneling medium, but also establishes "semiconductor grafting" as an effective and versatile method for high-performance, lattice-mismatched heterojunction devices.

physics.app-ph↗

arXiv2023

Band alignment of grafted monocrystalline Si (001)/$β$-Ga$_2$O$_3$ (010) p-n heterojunction determined by X-ray photoelectron spectroscopy

Beta-phase gallium oxide ($β$-Ga$_2$O$_3$) research has gained accelerated pace due to its superiorly large bandgap and commercial availability of large-diameter native substrates. However, the high acceptor activation energy obstructs the development of homojunction bipolar devices employing $β$-Ga$_2$O$_3$. The recently demonstrated semiconductor grafting technique provides an alternative and viable approach towards lattice-mismatched $β$-Ga$_2$O$_3$-based p-n heterojunctions with high quality interfaces. Understanding and quantitatively characterizing the band alignment of the grafted heterojunctions is crucial for future bipolar device development employing the grafting method. In this work, we present a systematic study of the band alignment in the grafted monocrystalline Si/$β$-Ga$_2$O$_3$ heterostructure by employing X-ray photoelectron spectroscopy (XPS). The core level peaks and valence band spectra of the Si, $β$-Ga$_2$O$_3$, and the grafted heterojunction were carefully obtained and analyzed. The band diagrams of the Si/$β$-Ga$_2$O$_3$ heterostructure were constructed using two individual methods, the core level peak method and the valence band spectrum method, by utilizing the different portions of the measured data. The reconstructed band alignments of the Si/$β$-Ga$_2$O$_3$ heterostructure using the two different methods are identical within the error range. The band alignment is also consistent with the prediction from the electron affinity values of Si and $β$-Ga$_2$O$_3$. The study suggests that the interface defect density in grafted Si/$β$-Ga$_2$O$_3$ heterostructure is at a sufficiently low level such that Fermi level pinning at the interface has been completely avoided and the universal electron affinity rule can be safely employed to construct the band diagrams of grafted monocrystalline Si/$β$-Ga$_2$O$_3$ heterostructures.

cond-mat.mtrl-sci↗

arXiv2023

Demonstration of a monocrystalline GaAs-$β$-Ga$_2$O$_3$ p-n heterojunction

In this work, we report the fabrication and characterizations of a monocrystalline GaAs/$β$-Ga$_2$O$_3$ p-n heterojunction by employing semiconductor grafting technology. The heterojunction was created by lifting off and transfer printing a p-type GaAs single crystal nanomembrane to an Al$_2$O$_3$-coated n-type$β$-Ga$_2$O$_3$ epitaxial substrate. The resultant heterojunction diodes exhibit remarkable performance metrics, including an ideality factor of 1.23, a high rectification ratio of 8.04E9 at +/- 4V, and a turn on voltage of 2.35 V. Furthermore, at +5 V, the diode displays a large current density of 2500 A/cm$^2$ along with a low ON resistance of 2 m$Ω\cdot$cm$^2$.

physics.app-ph↗

arXiv2023

Monocrystalline Si/$β$-Ga$_2$O$_3$ p-n heterojunction diodes fabricated via grafting

The $β$-Ga$_2$O$_3$ has exceptional electronic properties with vast potential in power and RF electronics. Despite the excellent demonstrations of high-performance unipolar devices, the lack of p-type doping in $β$-Ga$_2$O$_3$ has hindered the development of Ga$_2$O$_3$-based bipolar devices. The approach of p-n diodes formed by polycrystalline p-type oxides with n-type $β$-Ga$_2$O$_3$ can face severe challenges in further advancing the $β$-Ga$_2$O$_3$ bipolar devices due to their unfavorable band alignment and the poor p-type oxide crystal quality. In this work, we applied the semiconductor grafting approach to fabricate monocrystalline Si/$β$-Ga$_2$O$_3$ p-n diodes for the first time. With enhanced concentration of oxygen atoms at the interface of Si/$β$-Ga$_2$O$_3$, double side surface passivation was achieved for both Si and $β$-Ga$_2$O$_3$ with an interface Dit value of 1-3 x 1012 /cm2 eV. A Si/$β$-Ga$_2$O$_3$ p-n diode array with high fabrication yield was demonstrated along with a diode rectification of 1.3 x 107 at +/- 2 V, a diode ideality factor of 1.13 and avalanche reverse breakdown characteristics. The diodes C-V shows frequency dispersion-free characteristics from 10 kHz to 2 MHz. Our work has set the foundation toward future development of $β$-Ga$_2$O$_3$-based transistors.

physics.app-ph↗

arXiv2019

Normal dispersion silicon oxynitride microresonator Kerr frequency combs

On-chip optical resonators have proven to be a promising platform for generating Kerr frequency combs. Whispering gallery mode resonators are particularly attractive because of their small footprint as well as low threshold and power consumption. This performance can be attributed to two characteristics: the cavity quality factor (Q) and the cavity dispersion. The input optical field into the cavity is amplified by the cavity Q, enabling nonlinear processes to occur with low input powers. In addition, the total span of the optical comb is governed by the dispersion. In an optical cavity-based comb, the dispersion is governed by the geometric dispersion of the cavity and the material dispersion. While many different materials have been explored, the realization of ultra-high Q (UHQ) on-chip frequency combs sources is still challenging for most materials. One exception is the family of integrated silica devices. However, because the silica attracts water molecules from the ambient environment, the lifetime of the device performance is fundamentally limited, unless packaged in a controlled atmosphere. Here, we demonstrate the generation of environmentally-stable frequency combs fabricated from SiO1.7N0.13 microtoroidal resonators. Due to the UHQ factors of the cavities, parametric oscillations with sub-microwatt thresholds are demonstrated. Based on their geometry and material properties, the cavities have normal dispersion. However, due to avoided mode crossing, frequency combs are generated. Finally, unlike SiO2, the SiO1.7N0.13 inhibits the formation of a water monolayer, allowing sub-microwatt performance to be maintained for over a week in devices stored with minimal environmental controls.

physics.optics↗