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Yibo Lin

Publications and source records attributed to Yibo Lin.

At least 19 recordsLinked to original sources

Unveiling the Scaling Potential of Drain Merge through Active (DMtA) in CFETs: Breaking the Super-Via Bottlenecks and Unlocking New PPA Boosters

Drain merge (DM), a super via vertically connecting the common S/D terminals of stacked n/pFETs in Complementary FETs (CFETs), blocks further parasitic optimization and cell scaling. For the first time, this work systematically investigates the state-of-the-art Drain Merge through Active (DMtA), a revolutionary technology reported recently with the DM embedded in the active region, through a comprehensive DTCO framework spanning process integration, contact-configuration-dependent (CTCD) compact modeling, standardcell design, RO evaluation and block-level PPA benchmark on a 32-bit RISC-V Ibex core. By reducing DM parasitics and enabling DM-width optimization, DMtA improves RO frequency by 11.7% over its conventional Drain Merge through field (DMtF) counterpart. Active widening and Area Borrowing, the latter first reported in [8] and exploiting spatial slack in adjacent cells to further enlarge the nanosheet width (WNS), increase the maximum Ibex-core frequency by up to 34.8%. More importantly, DMtA also enables the once GAA-exclusive Hyper-cells on CFETs by merging the active regions across adjacent cell rows, providing a further 8.7% frequency gain. A post-routing floating-output-pin-aware optimization further removes redundant S/D contacts (CTs) and reduces power by 5.3%. Finally, DMtA facilitates more area-efficient 2.5T cell scaling by preserving single-row cell compatibility, reducing post-PR core area by 25.7%.

cond-mat.mes-hall

MacroAgent: Regularity-Aware Macro Legalization with LLM-Agent-Designed Contour Algorithms

Macros constitute a large part of the core area in modern very large-scale integration (VLSI) designs. Moreover, macro positions have a significant impact on the final quality of result (QoR), and macro legalization is typically the final step in determining the macro positions. However, existing approaches related to macro legalization either lack robustness or incur substantial computational costs or neglect the regularity between macros. To address these limitations, we introduce MacroAgent. The novel framework is a four-stage approach: clustering, contour generation, template matching, and inter-cluster refinement. We propose leveraging Large Language Models (LLMs) to discover multiple, effective heuristic regularity-aware contour algorithms. This framework successfully generates robust and effective algorithmic solutions for macro legalization. Compared with state-of-the-art macro legalization works, experimental results on TILOS and Chipyard benchmarks demonstrate a 2 to 8 fold improvement in layout regularity, a 3% to 5% reduction in routed wirelength with comparable congestion after global routing, and significantly better robustness with an acceptable runtime. Furthermore, end-to-end evaluation through Cadence Innovus place-and-route confirms that the regularity improvements translate into tangible PPA gains, including 2.9% lower routed wirelength and 68.3% TNS improvement over the DREAMPlace macro legalization baseline; it also achieves 1.8% lower routed wirelength when integrated into the Innovus macro placement flow.

cs.LG

GoGoTB: Agentic RTL Verification with Specification-Grounded Coverage Closure

Functional verification dominates integrated circuit (IC) front-end engineering effort, and a single missed bug that escapes to silicon can trigger a costly respin. Recent large language models (LLMs) offer new opportunities to automate this process, yet existing LLM-based approaches generate each component through independent single-turn calls with no shared context, leaving interface mismatches undetected and reported coverage disconnected from specification requirements. To address these challenges, we present GoGoTB, an agentic framework that achieves end-to-end verification closure through three subsystems: an agentic execution control layer, an evolvable knowledge system, and specification-grounded coverage closure. The execution control layer separates deterministic enforcement from LLM reasoning at every tool and stage boundary. The knowledge system dispatches methodology and design-specific expertise on demand. The coverage framework anchors every bin to a named specification behavior so that each residual gap has a diagnosable root cause and a targeted remedy. Tested on 8 register transfer level (RTL) designs without any human intervention, GoGoTB achieves 100\% environment generation success and averages 98.4\% line, 97.2\% branch, 97.0\% toggle, and 83.2\% functional coverage. No prior work successfully generates a complete verification environment or achieves meaningful coverage on the same benchmarks.

cs.AI

PANDA: An LLM-Enhanced Performance-Driven Analog Design Framework Bridging Design Intent and Layout Generation

Traditional design of analog circuits heavily relies on manual interventions across topology, sizing, and layout, with prior automation addressing stages in isolation. In this work, we propose PANDA, an LLM-enhanced framework that bridges high-level design intent to final layout by actively managing cross-stage dependencies through guided topology synthesis, substructure-aware sizing, and constraint-driven layout generation. This shifts automation from algorithm-centric execution to intent-centric co-design, reducing turnaround time from days or weeks to hours while improving design performance.

cs.AR

AttentionCap: Transformer Based Capacitance Matrix Learning Toward Full-Chip Extraction

As capacitance extraction accuracy of rule-based pattern matching becomes difficult to sustain at advanced nodes, a growing trend emerges to develop deep-learning-based 2D capacitance models. However, existing MLP- and CNN-based methods constrain their input to fixed metal-layer combinations in a specific process node, limiting their usability in practice. Recognizing the inherent similarity between capacitance matrix and the prevailing attention mechanism, we propose AttentionCap, a customized Transformer for capacitance matrix learning, with a Gram representation framework, a physics-aligned symmetric-attention output layer, and a novel normalized Laplacian loss. We also introduce a process-node embedding to enable multi-node learning. Trained on synthetic data, AttentionCap attains 0.67\%/3.99\% self/coupling-capacitance error on unseen real designs under a multi-layer and multi-node setting, surpassing the CNN-Cap baseline with 4.6$\times$/5.7$\times$ lower self/coupling error and 192$\times$ faster inference speed. A pretrained AttentionCap accurately transfers to an unseen node with only 5K samples and 4K finetuning steps. With sufficient accuracy on unseen real designs and strong transferability to new process nodes, AttentionCap offers highly practical value for modern EDA workflows. Code and data are available at https://github.com/THU-numbda/AttentionCap.

cs.LG

FusionCell: Cross-Attentive Fusion of Layout Geometry and Netlist Topology for Standard-Cell Performance Prediction

Standard cells form the building blocks of digital circuits, so their delay and power critically influence chip-level performance; yet characterization still relies on slow simulation sweeps, and many fast predictors ignore layout geometry, missing coupling and layout-dependent effects. The challenge is to jointly represent layout geometry and netlist topology so models capture fine-grained spatial details together with structural connectivity for accurate performance prediction. We introduce FusionCell, a dual-modality predictor that treats routed layout geometry and netlist topology as inputs and fuses them explicitly in a unified model. A DeiT encoder processes three-layer routed layouts, while a graph transformer models heterogeneous device/net graphs. The modalities are integrated through a topology-guided mechanism, where the netlist acts as a structural "map" to actively query relevant physical regions in the layout for joint geometric and topological reasoning. We build a 7nm dataset based on the ASAP7 PDK with over 19.5k cells spanning 149 types using automatic tools, targeting six metrics: signal rise/fall delay, transition, and power. Experimental results demonstrate that FusionCell reduces regression error, with an average MAPE of 0.92 percent, and improves Spearman/Kendall ranking over baselines, while accelerating the characterization process by orders of magnitude compared to circuit simulation.

cs.LG

DataPrep-Bench: Benchmarking LLMs as Training Data Preparators

The quality of training data fundamentally determines the capabilities of large language models (LLMs), yet no unified benchmark exists to measure how well LLMs, agents, and data-centric workflows actually prepare training data end to end. We view LLM-driven data preparation as comprising two complementary capabilities: data construction, which transforms raw sources into supervised training data, and data quality evaluation, which predicts the training value of candidate datasets before downstream training; throughout, "quality" refers to downstream training utility rather than surface-level textual properties. We introduce DataPrep-Bench, the first unified benchmark that jointly evaluates both capabilities under a shared downstream-grounded protocol over six domains and multiple base models. For data construction, methods consume identical raw sources and are scored by fine-tuning a base model on their outputs jointly with Dolly-15k; alongside this track we release Data-Construction-Skill, a skill-guided agent that lifts the Dolly-only baseline by nearly 20 points absolute on Llama-3.1-8B Finance and is competitive with the strongest agent- and DataFlow-based methods in knowledge-extraction-dense domains. For data quality evaluation, scoring functions are scored by Pearson correlation with downstream performance on a shared candidate pool; we release the Distributional Alignment Score (DAS), a distribution-based evaluator that uses MMD between a candidate dataset and a domain proxy. DAS attains the strongest cross-model correlation in four of six domains and is the only metric clearing r > 0.70 simultaneously in Math, Science, and Medical, outperforming existing quality-, diversity-, and heuristic-based evaluators. DataPrep-Bench provides a unified, downstream-grounded framework for measuring progress on both capabilities as co-equal targets of LLM-driven data preparation.

cs.LG

DiagramNet: An End-to-End Recognition Framework and Dataset for Non-Standard System-Level Diagrams

System-level diagrams encode the architectural blueprint of chip design, specifying module functions, dataflows, and interface protocols. However, non-standardized symbols and the scarcity of structured training data hinder existing multimodal large language models (MLLMs) from recognizing these diagrams. To address this gap, we introduce DiagramNet, the first multimodal dataset for system-level diagrams, comprising 10,977 connection annotations and 15,515 chain-of-thought QA pairs across four tasks: Listing, Localization, Connection, and Circuit QA. Building on this dataset, we propose a progressive training pipeline together with a decoupled multi-agent workflow that decomposes complex visual reasoning into Perception, Reasoning, and Knowledge stages. On the DiagramNet benchmark, integrating our 3B-parameter model with the proposed workflow surpasses the 2025 EDA Elite Challenge winner and outperforms GPT-5, Claude-Sonnet-4, and Gemini-2.5-Pro by over 2x in end-to-end evaluation. Notably, the workflow generalizes beyond our model, boosting Task 1 performance by 128.7x for Gemini-2.5-Pro and 12.4x for GPT-5. Furthermore, with only 60 images for detector adaptation, the method transfers effectively to AMSBench, achieving zero-shot connectivity reasoning on par with GPT-5 and Claude-Sonnet-4 while surpassing the AMS state-of-the-art method Netlistify.

cs.AI

LEGO: An LLM Skill-Based Front-End Design Generation Platform

Existing LLM-based EDA agents are often isolated task-specific systems. This leads to repeated engineering effort and limited reuse of successful design and debugging strategies. We present LEGO, a unified skill-based platform for front-end design generation. It decomposes the digital front-end flow into six independent steps and represents every agent capability as a standardized composable circuit skill within a plug-and-play architecture. To build this skill library, we survey more than 100 papers, select 11 representative open-source projects, and extract 42 executable circuit skills within a six-step finite state machine formulation. Circuit Skill Builder automates skill extraction with linear scalability. Agent Skill RAG achieves submillisecond retrieval without relying on embedding models. Empirical evaluation on a hard subset of 41 VerilogEval v2 problems that gpt-5.2-codex fails to solve under extra-high reasoning effort shows that individual circuit skills constructed within LEGO raise Pass@1 from 0.000 to 0.805. This is an 80.5% gain over the baseline. Cross-project skill compositions also reach 0.805 Pass@1. They outperform hierarchy-verilog by 14.6% and VerilogCoder by 2.5%. They also match MAGE. These results show that modular skill composition supports both effective and flexible RTL design automation. The LEGO platform and all circuit skills are publicly available at GitHub: https://github.com/loujc/LEGO-An-LLM-Skill-Based-Front-End-Design-Generation-Platform

cs.AI

RePart: Efficient Hypergraph Partitioning with Logic Replication Optimization for Multi-FPGA System

Multi-FPGA systems (MFS) are widely adopted for VLSI emulation and rapid prototyping. In an MFS, FPGAs connect only to a limited number of neighbors through bandwidth-constrained links, so inter-FPGA communication cost depends on network topology. This setting exposes two fundamental limitations of existing MFS-aware partitioning methods: conventional hypergraph partitioners focus solely on cut size and ignore topological structure, and they leave substantial FPGA resources unused due to conservative balance margins. We present RePart, a fully customized multilevel hypergraph partitioning framework for MFS that integrates logic replication with topology-aware optimization. RePart introduces three coordinated innovations across the multilevel pipeline: FPGA-aware dynamic coarsening, heat-value guided assignment, and replication-deletion supported refinement. Extensive experiments on the Titan23 and EDA Elite Challenge Contest benchmarks show that RePart reduces total hop distance by 52.3% on average over state-of-the-art hypergraph partitioners with an 11.1x speedup, and outperforms the EDA Elite Challenge winners. Code is available at: https://github.com/Welement-zyf/RePart.

cs.AR

CellE: Automated Standard Cell Library Extension via Equality Saturation

Automated standard cell library extension is crucial for maximizing Quality of Results (QoR) in modern VLSI design. We introduce CellE, a novel framework that leverages formal methods to achieve exhaustive discovery of functionally equivalent subcircuits. CellE applies equality saturation to the post-mapping netlist, generating an e-graph to cluster all functionally equivalent implementations. This canonical representation enables an efficient pattern mining algorithm to select the most area-optimal standard cells. Experimental results show a 15.41% average area reduction (up to 23.64% over prior work). Furthermore, characterization in a commercial flow demonstrates an 8.00% average delay reduction, confirming CellE's superior QoR optimization capabilities.

cs.AR

ATSim3D: Towards Accurate Thermal Simulator for Heterogeneous 3D-IC Systems Considering Nonlinear Leakage and Conductivity

Thermal simulation plays a fundamental role in the thermal design of integrated circuits, especially 3D ICs. Current simulators require significant runtime for high-resolution simulation, and dismiss the complex nonlinear thermal effects, such as nonlinear thermal conductivity and leakage power. To address these issues, we propose ATSim3D, a thermal simulator for simulating the steady-state temperature profile of nonlinear and heterogeneous 3D IC systems. We utilize the global-local approach, combining a compact thermal model at the global level, and a finite volume method at the local level. We tackle the nonlinear effects with Kirchhoff transformation and iteration. ATSim3D enables local-level parallelization that helps achieve an average speedup of 40x compared to COMSOL, with a relative error <3% and a state-of-the-art resolution of 4096 x 4096, holding promise for enhancing thermal-aware design in 3D ICs.

physics.app-ph

ATSim3.5D: A Multiscale Thermal Simulator for 3.5D-IC Systems based on Nonlinear Multigrid Method

To resolve the rising temperatures in 3.5D-ICs, a thermal-aware design flow becomes increasingly crucial, necessitating an accurate and efficient thermal simulation tool. However, previous tools struggle to handle the unique heterogeneous multiscale structures in 3.5D-ICs and the nonlinear thermal effects caused by high temperatures. In this work, we present a multiscale thermal simulator for 3.5D-ICs. We propose a hybrid tree structure to generate multilevel grids and capture the multiscale features and employ the nonlinear multigrid method for quick solving. Compared to ANSYS Icepak, it exhibits high accuracy (mean absolute relative error <1%, max error $<\SI{2}{\degreeCelsius}$), and efficiency ($80\times$ acceleration), delivering a powerful means to evaluate and refine thermal designs.

physics.app-ph

LaMoSys3.5D: Enabling 3.5D-IC-Based Large Language Model Inference Serving Systems via Hardware/Software Co-Design

The success of large language models LLMs amplifies the need for highthroughput energyefficient inference at scale. 3DDRAMbased accelerators provide high memory bandwidth and therefore an opportunity to accelerate the bandwidthbound decode phase. However, how to adequately balance compute density for prefill with bandwidthcapacity for decode remains open. Moreover, most prior designs do not target endtoend serving, leaving the codesign of dataflow, parallel mapping, and scheduling underexplored. To bridge the gap, we present LaMoSys3.5D, to our knowledge the first scalable 3.5DIC architecture for LLM serving. LaMoSys3.5D composes heterogeneous 3DDRAM chiplets on a 2.5D interposer: computerich chiplets for prefill and bandwidthcapacityrich chiplets for decode. To realize efficient serving, we adopt a hardwaresoftware codesign spanning dataflow, parallel mapping, and introduce a thermalaware modeling and hierarchical designspace exploration framework. Across diverse LLMs and workloads, LaMoSys3.5D improves throughputperwatt over DGXA100 systems by 62 and achieves a 4.87 better endtoend latency geomean versus prior 3D designs. We further distill intriguing design guidelines for 3.5DIC architectures and endtoend inference serving.

eess.SY

ATMPlace: Analytical Thermo-Mechanical-Aware Placement Framework for 2.5D-IC

Rising demand in AI and automotive applications is accelerating 2.5D IC adoption, with multiple chiplets tightly placed to enable high-speed interconnects and heterogeneous integration. As chiplet counts grow, traditional placement tools, limited by poor scalability and reliance on slow simulations, must evolve beyond wirelength minimization to address thermal and mechanical reliability, critical challenges in heterogeneous integration. In this paper, we present ATMPlace, the first analytical placer for 2.5D ICs that jointly optimizes wirelength, peak temperature, and operational warpage using physics-based compact models. It generates Pareto optimal placements for systems with dozens of chiplets. Experimental results demonstrate superior performance: 146 percent and 52 percent geometric mean wirelength improvement over TAP 2.5D and TACPlace, respectively, with 3 to 13 percent lower temperature and 5 to 27 percent less warpage, all achieved approximately 10 times faster. The proposed framework is general and can be extended to enable fast, scalable, and reliable design exploration for next-generation 2.5D systems.

math.NA

HeteroSTA: A CPU-GPU Heterogeneous Static Timing Analysis Engine with Holistic Industrial Design Support

We introduce in this paper, HeteroSTA, the first CPU-GPU heterogeneous timing analysis engine that efficiently supports: (1) a set of delay calculation models providing versatile accuracy-speed choices without relying on an external golden tool, (2) robust support for industry formats, including especially the .sdc constraints containing all common timing exceptions, clock domains, and case analysis modes, and (3) end-to-end GPU-acceleration for both graph-based and path-based timing queries, all exposed as a zero-overhead flattened heterogeneous application programming interface (API). HeteroSTA is publicly available with both a standalone binary executable and an embeddable shared library targeting ubiquitous academic and industry applications. Example use cases as a standalone tool, a timing-driven DREAMPlace 4.0 integration, and a timing-driven global routing integration have all demonstrated remarkable runtime speed-up and comparable quality.

cs.DC

Orthrus: Dual-Loop Automated Framework for System-Technology Co-Optimization

With the diminishing return from Moore's Law, system-technology co-optimization (STCO) has emerged as a promising approach to sustain the scaling trends in the VLSI industry. By bridging the gap between system requirements and technology innovations, STCO enables customized optimizations for application-driven system architectures. However, existing research lacks sufficient discussion on efficient STCO methodologies, particularly in addressing the information gap across design hierarchies and navigating the expansive cross-layer design space. To address these challenges, this paper presents Orthrus, a dual-loop automated framework that synergizes system-level and technology-level optimizations. At the system level, Orthrus employs a novel mechanism to prioritize the optimization of critical standard cells using system-level statistics. It also guides technology-level optimization via the normal directions of the Pareto frontier efficiently explored by Bayesian optimization. At the technology level, Orthrus leverages system-aware insights to optimize standard cell libraries. It employs a neural network-assisted enhanced differential evolution algorithm to efficiently optimize technology parameters. Experimental results on 7nm technology demonstrate that Orthrus achieves 12.5% delay reduction at iso-power and 61.4% power savings at iso-delay over the baseline approaches, establishing new Pareto frontiers in STCO.

cs.AR

MMCircuitEval: A Comprehensive Multimodal Circuit-Focused Benchmark for Evaluating LLMs

The emergence of multimodal large language models (MLLMs) presents promising opportunities for automation and enhancement in Electronic Design Automation (EDA). However, comprehensively evaluating these models in circuit design remains challenging due to the narrow scope of existing benchmarks. To bridge this gap, we introduce MMCircuitEval, the first multimodal benchmark specifically designed to assess MLLM performance comprehensively across diverse EDA tasks. MMCircuitEval comprises 3614 meticulously curated question-answer (QA) pairs spanning digital and analog circuits across critical EDA stages - ranging from general knowledge and specifications to front-end and back-end design. Derived from textbooks, technical question banks, datasheets, and real-world documentation, each QA pair undergoes rigorous expert review for accuracy and relevance. Our benchmark uniquely categorizes questions by design stage, circuit type, tested abilities (knowledge, comprehension, reasoning, computation), and difficulty level, enabling detailed analysis of model capabilities and limitations. Extensive evaluations reveal significant performance gaps among existing LLMs, particularly in back-end design and complex computations, highlighting the critical need for targeted training datasets and modeling approaches. MMCircuitEval provides a foundational resource for advancing MLLMs in EDA, facilitating their integration into real-world circuit design workflows. Our benchmark is available at https://github.com/cure-lab/MMCircuitEval.

cs.LG