arXiv subjects

Yibo Lin

Publications and source records attributed to Yibo Lin.

At least 37 records · Page 2Linked to original sources

arXiv2025

Orthrus: Dual-Loop Automated Framework for System-Technology Co-Optimization

With the diminishing return from Moore's Law, system-technology co-optimization (STCO) has emerged as a promising approach to sustain the scaling trends in the VLSI industry. By bridging the gap between system requirements and technology innovations, STCO enables customized optimizations for application-driven system architectures. However, existing research lacks sufficient discussion on efficient STCO methodologies, particularly in addressing the information gap across design hierarchies and navigating the expansive cross-layer design space. To address these challenges, this paper presents Orthrus, a dual-loop automated framework that synergizes system-level and technology-level optimizations. At the system level, Orthrus employs a novel mechanism to prioritize the optimization of critical standard cells using system-level statistics. It also guides technology-level optimization via the normal directions of the Pareto frontier efficiently explored by Bayesian optimization. At the technology level, Orthrus leverages system-aware insights to optimize standard cell libraries. It employs a neural network-assisted enhanced differential evolution algorithm to efficiently optimize technology parameters. Experimental results on 7nm technology demonstrate that Orthrus achieves 12.5% delay reduction at iso-power and 61.4% power savings at iso-delay over the baseline approaches, establishing new Pareto frontiers in STCO.

cs.AR↗

arXiv2025

MMCircuitEval: A Comprehensive Multimodal Circuit-Focused Benchmark for Evaluating LLMs

The emergence of multimodal large language models (MLLMs) presents promising opportunities for automation and enhancement in Electronic Design Automation (EDA). However, comprehensively evaluating these models in circuit design remains challenging due to the narrow scope of existing benchmarks. To bridge this gap, we introduce MMCircuitEval, the first multimodal benchmark specifically designed to assess MLLM performance comprehensively across diverse EDA tasks. MMCircuitEval comprises 3614 meticulously curated question-answer (QA) pairs spanning digital and analog circuits across critical EDA stages - ranging from general knowledge and specifications to front-end and back-end design. Derived from textbooks, technical question banks, datasheets, and real-world documentation, each QA pair undergoes rigorous expert review for accuracy and relevance. Our benchmark uniquely categorizes questions by design stage, circuit type, tested abilities (knowledge, comprehension, reasoning, computation), and difficulty level, enabling detailed analysis of model capabilities and limitations. Extensive evaluations reveal significant performance gaps among existing LLMs, particularly in back-end design and complex computations, highlighting the critical need for targeted training datasets and modeling approaches. MMCircuitEval provides a foundational resource for advancing MLLMs in EDA, facilitating their integration into real-world circuit design workflows. Our benchmark is available at https://github.com/cure-lab/MMCircuitEval.

cs.LG↗

arXiv2025

AnalogXpert: Automating Analog Topology Synthesis by Incorporating Circuit Design Expertise into Large Language Models

Analog circuits are crucial in modern electronic systems, and automating their design has attracted significant research interest. One of major challenges is topology synthesis, which determines circuit components and their connections. Recent studies explore large language models (LLM) for topology synthesis. However, the scenarios addressed by these studies do not align well with practical applications. Specifically, existing work uses vague design requirements as input and outputs an ideal model, but detailed structural requirements and device-level models are more practical. Moreover, current approaches either formulate topology synthesis as graph generation or Python code generation, whereas practical topology design is a complex process that demands extensive design knowledge. In this work, we propose AnalogXpert, a LLM-based agent aiming at solving practical topology synthesis problem by incorporating circuit design expertise into LLMs. First, we represent analog topology as SPICE code and introduce a subcircuit library to reduce the design space, in the same manner as experienced designers. Second, we decompose the problem into two sub-task (i.e., block selection and block connection) through the use of CoT and incontext learning techniques, to mimic the practical design process. Third, we introduce a proofreading strategy that allows LLMs to incrementally correct the errors in the initial design, akin to human designers who iteratively check and adjust the initial topology design to ensure accuracy. Finally, we construct a high-quality benchmark containing both real data (30) and synthetic data (2k). AnalogXpert achieves 40% and 23% success rates on the synthetic dataset and real dataset respectively, which is markedly better than those of GPT-4o (3% on both the synthetic dataset and the real dataset).

cs.AR↗

arXiv2025

MuGrid-v2: A novel scintillator detector for multidisciplinary applications

Muography, traditionally recognized as a potent instrument for imaging the internal structure of gigantic objects, has initialized various interdisciplinary applications. As the financial and labor costs of muography detector development hinder their massive applications, we develop a novel muon detector called MuGrid by coupling a monolithic plastic scintillator with the light guide array in order to achieve competitive spatial resolution while substantially reducing production costs. For a prototype detector in 30 cm $\times$ 30 cm, the intrinsic spatial resolution has been optimized toward a millimeter scale. An outdoor field muography experiment was conducted to monitor two buildings for validation purposes. The test successfully resolved the geometric influence of architectural features based on the attenuation of muon flux in a good agreement between experimental results and the simulation prediction.

physics.ins-det↗

arXiv2025

SEGA-DCIM: Design Space Exploration-Guided Automatic Digital CIM Compiler with Multiple Precision Support

Digital computing-in-memory (DCIM) has been a popular solution for addressing the memory wall problem in recent years. However, the DCIM design still heavily relies on manual efforts, and the optimization of DCIM is often based on human experience. These disadvantages limit the time to market while increasing the design difficulty of DCIMs. This work proposes a design space exploration-guided automatic DCIM compiler (SEGA-DCIM) with multiple precision support, including integer and floating-point data precision operations. SEGA-DCIM can automatically generate netlists and layouts of DCIM designs by leveraging a template-based method. With a multi-objective genetic algorithm (MOGA)-based design space explorer, SEGA-DCIM can easily select appropriate DCIM designs for a specific application considering the trade-offs among area, power, and delay. As demonstrated by the experimental results, SEGA-DCIM offers solutions with wide design space, including integer and floating-point precision designs, while maintaining competitive performance compared to state-of-the-art (SOTA) DCIMs.

cs.AR↗

arXiv2025

A Systematic Approach for Multi-objective Double-side Clock Tree Synthesis

As the scaling of semiconductor devices nears its limits, utilizing the back-side space of silicon has emerged as a new trend for future integrated circuits. With intense interest, several works have hacked existing backend tools to explore the potential of synthesizing double-side clock trees via nano Through-Silicon-Vias (nTSVs). However, these works lack a systematic perspective on design resource allocation and multi-objective optimization. We propose a systematic approach to design clock trees with double-side metal layers, including hierarchical clock routing, concurrent buffers and nTSVs insertion, and skew refinement. Compared with the state-of-the-art (SOTA) methods, the widely-used open-source tool, our algorithm outperforms them in latency, skew, wirelength, and the number of buffers and nTSVs.

cs.AR↗

arXiv2025

Evolution of Optimization Algorithms for Global Placement via Large Language Models

Optimization algorithms are widely employed to tackle complex problems, but designing them manually is often labor-intensive and requires significant expertise. Global placement is a fundamental step in electronic design automation (EDA). While analytical approaches represent the state-of-the-art (SOTA) in global placement, their core optimization algorithms remain heavily dependent on heuristics and customized components, such as initialization strategies, preconditioning methods, and line search techniques. This paper presents an automated framework that leverages large language models (LLM) to evolve optimization algorithms for global placement. We first generate diverse candidate algorithms using LLM through carefully crafted prompts. Then we introduce an LLM-based genetic flow to evolve selected candidate algorithms. The discovered optimization algorithms exhibit substantial performance improvements across many benchmarks. Specifically, Our design-case-specific discovered algorithms achieve average HPWL improvements of \textbf{5.05\%}, \text{5.29\%} and \textbf{8.30\%} on MMS, ISPD2005 and ISPD2019 benchmarks, and up to \textbf{17\%} improvements on individual cases. Additionally, the discovered algorithms demonstrate good generalization ability and are complementary to existing parameter-tuning methods.

cs.NE↗

arXiv2025

Design Optimization of Flip FET Standard Cells with Dual-sided Pins for Ultimate Scaling

Recently, we proposed a novel transistor architecture for 3D stacked FETs called Flip FET (FFET), featuring N/P transistors back-to-back stacked and dual-sided interconnects. With dual-sided power rails and signal tracks, FFET can achieve an aggressive 2.5T cell height. As a tradeoff, the complex structure and limited numbers of M0 tracks could limit the standard cell design. As a solution, multiple innovations were introduced and examined in this work. Based on an advanced node design rule, several unique building blocks in FFET such as drain merge (DM), gate merge (GM), field drain merge (FDM) and buried signal track (BST) were investigated. Other key design concepts of multi-row, split gate and dummy gate insertion (DG) were also carefully studied, delivering around 35.6% area reduction compared with 3T CFET. Furthermore, the symmetric design of FFET has unique superiority over CFET thanks to the separate N/P logic on two sides of the wafer and their connections using DM and GM. New routing scheme with dual-sided output pins on both wafer frontside (FS) and backside (BS) was proposed for the first time. Finally, we conducted a comprehensive evaluation on complex cell design, taking AOI22 as an example. New strategies were proposed and examined. The FDM design is identified as the best, outperforming the BST and dummy gate design by 1.93% and 5.13% for the transition delay.

cond-mat.mes-hall↗

arXiv2025

DOMAC: Differentiable Optimization for High-Speed Multipliers and Multiply-Accumulators

Multipliers and multiply-accumulators (MACs) are fundamental building blocks for compute-intensive applications such as artificial intelligence. With the diminishing returns of Moore's Law, optimizing multiplier performance now necessitates process-aware architectural innovations rather than relying solely on technology scaling. In this paper, we introduce DOMAC, a novel approach that employs differentiable optimization for designing multipliers and MACs at specific technology nodes. DOMAC establishes an analogy between optimizing multi-staged parallel compressor trees and training deep neural networks. Building on this insight, DOMAC reformulates the discrete optimization challenge into a continuous problem by incorporating differentiable timing and area objectives. This formulation enables us to utilize existing deep learning toolkit for highly efficient implementation of the differentiable solver. Experimental results demonstrate that DOMAC achieves significant enhancements in both performance and area efficiency compared to state-of-the-art baselines and commercial IPs in multiplier and MAC designs.

cs.AR↗

arXiv2025

DiffuSE: Cross-Layer Design Space Exploration of DNN Accelerator via Diffusion-Driven Optimization

The proliferation of deep learning accelerators calls for efficient and cost-effective hardware design solutions, where parameterized modular hardware generator and electronic design automation (EDA) tools play crucial roles in improving productivity and final Quality-of-Results (QoR). To strike a good balance across multiple QoR of interest (e.g., performance, power, and area), the designers need to navigate a vast design space, encompassing tunable parameters for both hardware generator and EDA synthesis tools. However, the significant time for EDA tool invocations and complex interplay among numerous design parameters make this task extremely challenging, even for experienced designers. To address these challenges, we introduce DiffuSE, a diffusion-driven design space exploration framework for cross-layer optimization of DNN accelerators. DiffuSE leverages conditional diffusion models to capture the inverse, one-to-many mapping from QoR objectives to parameter combinations, allowing for targeted exploration within promising regions of the design space. By carefully selecting the conditioning QoR values, the framework facilitates an effective trade-off among multiple QoR metrics in a sample-efficient manner. Experimental results under 7nm technology demonstrate the superiority of the proposed framework compared to previous arts.

cs.AR↗

arXiv2025

A Tale of Two Sides of Wafer: Physical Implementation and Block-Level PPA on Flip FET with Dual-sided Signals

As the conventional scaling of logic devices comes to an end, functional wafer backside and 3D transistor stacking are consensus for next-generation logic technology, offering considerable design space extension for powers, signals or even devices on the wafer backside. The Flip FET (FFET), a novel transistor architecture combining 3D transistor stacking and fully functional wafer backside, was recently proposed. With symmetric dual-sided standard cell design, the FFET can deliver around 12.5% cell area scaling and faster but more energy-efficient libraries beyond other stacked transistor technologies such as CFET. Besides, thanks to the novel cell design with dual-sided pins, the FFET supports dual-sided signal routing, delivering better routability and larger backside design space. In this work, we demonstrated a comprehensive FFET evaluation framework considering physical implementation and block-level power-performance-area (PPA) assessment for the first time, in which key functions are dual-sided routing and dual-sided RC extraction. A 32-bit RISC-V core was used for the evaluation here. Compared to the CFET with single-sided signals, the FFET with single-sided signals achieved 23.3% post-P&R core area reduction, 25.0% higher frequency and 11.9% lower power at the same utilization, and 16.0 % higher frequency at the same core area. Meanwhile, the FFET supports dual-sided signals, which can further benefit more from flexible allocation of cell input pins on both sides. By optimizing the input pin density and BEOL routing layer number on each side, 10.6% frequency gain was realized without power degradation compared to the one with single-sided signal routing. Moreover, the routability and power efficiency of FFET barely degrades even with the routing layer number reduced from 12 to 5 on each side, validating the great space for cost-friendly design enabled by FFET.

physics.app-ph↗

arXiv2025

LayoutCopilot: An LLM-powered Multi-agent Collaborative Framework for Interactive Analog Layout Design

Analog layout design heavily involves interactive processes between humans and design tools. Electronic Design Automation (EDA) tools for this task are usually designed to use scripting commands or visualized buttons for manipulation, especially for interactive automation functionalities, which have a steep learning curve and cumbersome user experience, making a notable barrier to designers' adoption. Aiming to address such a usability issue, this paper introduces LayoutCopilot, a pioneering multi-agent collaborative framework powered by Large Language Models (LLMs) for interactive analog layout design. LayoutCopilot simplifies human-tool interaction by converting natural language instructions into executable script commands, and it interprets high-level design intents into actionable suggestions, significantly streamlining the design process. Experimental results demonstrate the flexibility, efficiency, and accessibility of LayoutCopilot in handling real-world analog designs.

cs.AR↗

arXiv2024

PDNNet: PDN-Aware GNN-CNN Heterogeneous Network for Dynamic IR Drop Prediction

IR drop on the power delivery network (PDN) is closely related to PDN's configuration and cell current consumption. As the integrated circuit (IC) design is growing larger, dynamic IR drop simulation becomes computationally unaffordable and machine learning based IR drop prediction has been explored as a promising solution. Although CNN-based methods have been adapted to IR drop prediction task in several works, the shortcomings of overlooking PDN configuration is non-negligible. In this paper, we consider not only how to properly represent cell-PDN relation, but also how to model IR drop following its physical nature in the feature aggregation procedure. Thus, we propose a novel graph structure, PDNGraph, to unify the representations of the PDN structure and the fine-grained cell-PDN relation. We further propose a dual-branch heterogeneous network, PDNNet, incorporating two parallel GNN-CNN branches to favorably capture the above features during the learning process. Several key designs are presented to make the dynamic IR drop prediction highly effective and interpretable. We are the first work to apply graph structure to deep-learning based dynamic IR drop prediction method. Experiments show that PDNNet outperforms the state-of-the-art CNN-based methods and achieves 545x speedup compared to the commercial tool, which demonstrates the superiority of our method.

cs.LG↗

arXiv2024

Theseus: Exploring Efficient Wafer-Scale Chip Design for Large Language Models

The emergence of the large language model~(LLM) poses an exponential growth of demand for computation throughput, memory capacity, and communication bandwidth. Such a demand growth has significantly surpassed the improvement of corresponding chip designs. With the advancement of fabrication and integration technologies, designers have been developing Wafer-Scale Chips~(WSCs) to scale up and exploit the limits of computation density, memory capacity, and communication bandwidth at the level of a single chip. Existing solutions have demonstrated the significant advantages of WSCs over traditional designs, showing potential to effectively support LLM workloads. Despite the benefits, exploring the early-stage design space of WSCs for LLMs is a crucial yet challenging task due to the enormous and complicated design space, time-consuming evaluation methods, and inefficient exploration strategies. To address these challenges, we propose Theseus, an efficient WSC design space exploration framework for LLMs. We construct the design space of WSCs with various constraints considering the unique characteristics of WSCs. We propose efficient evaluation methodologies for large-scale NoC-based WSCs and introduce multi-fidelity Bayesian optimization to efficiently explore the design space. Evaluation results demonstrate the efficiency of Theseus that the searched Pareto optimal results outperform GPU cluster and existing WSC designs by up to 62.8\%/73.7\% in performance and 38.6\%/42.4\% in power consumption for LLM training, while improving up to 23.2$\times$ and 15.7$\times$ for the performance and power of inference tasks. Furthermore, we conduct case studies to address the design tradeoffs in WSCs and provide insights to facilitate WSC designs for LLMs.

cs.AR↗

arXiv2024

MORE-Stress: Model Order Reduction based Efficient Numerical Algorithm for Thermal Stress Simulation of TSV Arrays in 2.5D/3D IC

Thermomechanical stress induced by through-silicon vias (TSVs) plays an important role in the performance and reliability analysis of 2.5D/3D ICs. While the finite element method (FEM) adopted by commercial software can provide accurate simulation results, it is very time- and memory-consuming for large-scale analysis. Over the past decade, the linear superposition method has been utilized to perform fast thermal stress estimations of TSV arrays, but it suffers from a lack of accuracy. In this paper, we propose MORE-Stress, a novel strict numerical algorithm for efficient thermal stress simulation of TSV arrays based on model order reduction. Extensive experimental results demonstrate that our algorithm can realize a 153-504 times reduction in computational time and a 39-115 times reduction in memory usage compared with the commercial software ANSYS, with negligible errors less than 1%. Our algorithm is as efficient as the linear superposition method, with an order of magnitude smaller errors and fast convergence.

cs.CE↗

arXiv2024

From Flip FET to Flip 3D Integration (F3D): Maximizing the Scaling Potential of Wafer Both Sides Beyond Conventional 3D Integration

In this work, we proposed a new 3D integration technology: the Flip 3D integration (F3D), consisting of the 3D transistor stacking, the 3D dual-sided interconnects, the 3D die-to-die stacking and the dual-sided Monolithic 3D (M3D). Based on a 32-bit FFET RISCV core, besides the scaling benefits of the Flip FET (FFET), the dual-sided signal routing shows even more routing flexibility with 6.8% area reduction and 5.9% EDP improvement. Novel concepts of Multi-Flipping processes (Double Flips and Triple Flips) were proposed to relax the thermal budget constraints in the F3D and thus support the dual-sided M3D in the F3D. The core's EDP and frequency are improved by up to 3.2% and 2.3% respectively, after BEOL optimizations based on the Triple Flips compared with unoptimized ones.

cond-mat.mes-hall↗

arXiv2024

Analytical Heterogeneous Die-to-Die 3D Placement with Macros

This paper presents an innovative approach to 3D mixed-size placement in heterogeneous face-to-face (F2F) bonded 3D ICs. We propose an analytical framework that utilizes a dedicated density model and a bistratal wirelength model, effectively handling macros and standard cells in a 3D solution space. A novel 3D preconditioner is developed to resolve the topological and physical gap between macros and standard cells. Additionally, we propose a mixed-integer linear programming (MILP) formulation for macro rotation to optimize wirelength. Our framework is implemented with full-scale GPU acceleration, leveraging an adaptive 3D density accumulation algorithm and an incremental wirelength gradient algorithm. Experimental results on ICCAD 2023 contest benchmarks demonstrate that our framework can achieve 5.9% quality score improvement compared to the first-place winner with 4.0x runtime speedup. Additional experiments on modern RISC-V designs further validate the generalizability and superiority of our framework.

cs.AR↗

arXiv2024

The Dawn of AI-Native EDA: Opportunities and Challenges of Large Circuit Models

Within the Electronic Design Automation (EDA) domain, AI-driven solutions have emerged as formidable tools, yet they typically augment rather than redefine existing methodologies. These solutions often repurpose deep learning models from other domains, such as vision, text, and graph analytics, applying them to circuit design without tailoring to the unique complexities of electronic circuits. Such an AI4EDA approach falls short of achieving a holistic design synthesis and understanding, overlooking the intricate interplay of electrical, logical, and physical facets of circuit data. This paper argues for a paradigm shift from AI4EDA towards AI-native EDA, integrating AI at the core of the design process. Pivotal to this vision is the development of a multimodal circuit representation learning technique, poised to provide a comprehensive understanding by harmonizing and extracting insights from varied data sources, such as functional specifications, RTL designs, circuit netlists, and physical layouts. We champion the creation of large circuit models (LCMs) that are inherently multimodal, crafted to decode and express the rich semantics and structures of circuit data, thus fostering more resilient, efficient, and inventive design methodologies. Embracing this AI-native philosophy, we foresee a trajectory that transcends the current innovation plateau in EDA, igniting a profound shift-left in electronic design methodology. The envisioned advancements herald not just an evolution of existing EDA tools but a revolution, giving rise to novel instruments of design tools that promise to radically enhance design productivity and inaugurate a new epoch where the optimization of circuit performance, power, and area (PPA) is achieved not incrementally, but through leaps that redefine the benchmarks of electronic systems' capabilities.

cs.AR↗