arXiv subjects

Yoshinobu Unno

Publications and source records attributed to Yoshinobu Unno.

5 recordsLinked to original sources

arXiv2026

Radiation effects on surface and bulk properties of ATLAS18 silicon sensors under low- and high-dose gamma irradiation and annealing

Silicon strip detectors for the ATLAS Inner Tracker (ITk) at the HL-LHC must withstand harsh radiation conditions, including fluences of up to 1.6E15 1 MeV n$_{eq}$/cm$^{2}$ and total ionizing doses (TID) of up to 66 Mrad. These requirements are met using radiation-hard n+-in-p technology implemented in the ATLAS18 silicon strip sensors currently under production. This work presents a combined study of gamma-irradiation effects in ATLAS18 silicon sensors, including both segmented miniature strip sensors (minis) and unsegmented MD8 diodes fabricated on ATLAS18 production wafers. The samples were irradiated with a $^{60}$Co gamma source to multiple low TIDs between 0.5 and 100 krad, corresponding to the dose range relevant for the early operational phase of the ITk tracker. Additional measurements extending up to a few Mrad were performed to investigate the saturation of surface related damage effects. Post-irradiation characterization included measurements of total, bulk, and surface leakage currents, as well as capacitance-voltage measurements used to extract the full depletion voltage. The thermal stability of radiation-induced defects was studied using isochronal annealing between 80°C and 300°C and isothermal annealing at 60°C and 160°C. In addition, complementary studies of MD8 diodes irradiated to ultra-high doses of several hundred Mrad, well beyond the ATLAS ITk requirements, are included to investigate possible bulk-related effects induced by pure gamma irradiation and their annealing behavior. The combined analysis of low- and ultra-high-dose irradiation provides a comprehensive picture of surface- and bulk-related gamma-induced effects in ATLAS18 silicon sensors and their thermal evolution.

physics.ins-det↗

arXiv2025

TCAD Simulations of Humidity-Induced Breakdown of Silicon Sensors

The breakdown voltage of silicon sensors is known to be affected by the ambient humidity. To understand the sensor's humidity sensitivity, Synopsys TCAD was used to simulate n-in-p sensors for different effective relative humidities. Photon emission of hot electrons was imaged with a microscope to locate breakdown in the edge-region of the sensor. The Top-Transient Current Technique was used to measure charge transport near the surface in the breakdown region of the sensor. Using the measurements and simulations, the evolution of the electric field with relative humidity and the carrier densities towards breakdown in the periphery of p-bulk silicon sensors are investigated.

physics.ins-det↗

arXiv2019

Mapping the depleted area of silicon diodes using a micro-focused X-ray beam

For the Phase-II Upgrade of the ATLAS detector at CERN, the current ATLAS Inner Detector will be replaced with the ATLAS Inner Tracker. The ATLAS Inner Tracker will be an all-silicon detector, consisting of a pixel tracker and a strip tracker. Sensors for the ITk strip tracker are required to have a low leakage current up to bias voltages of -700 V to maintain a low noise and power dissipation. In order to minimise sensor leakage currents, particularly in the high-radiation environment inside the ATLAS detector, sensors are foreseen to be operated at low temperatures and to be manufactured from wafers with a high bulk resistivity of several kΩ cm. Simulations showed the electric field inside sensors with high bulk resistivity to extend towards the sensor edge, which could lead to increased surface currents for narrow dicing edges. In order to map the electric field inside biased silicon sensors with high bulk resistivity, three diodes from ATLAS silicon strip sensor prototype wafers were studied with a monochromatic, micro-focused X-ray beam at the Diamond Light Source. For all devices under investigation, the electric field inside the diode was mapped and its dependence on the applied bias voltage was studied. The findings showed that the electric field in each diode under investigation extended beyond its bias ring and reached the dicing edge.

physics.ins-det↗

arXiv2017

Investigations into the impact of locally modified sensor architectures on the detection efficiency of silicon micro-strip sensors

The High Luminosity Upgrade of the LHC will require the replacement of the Inner Detector of ATLAS with the Inner Tracker (ITk) in order to cope with higher radiation levels and higher track densities. Prototype silicon strip detector modules are currently developed and their performance is studied in both particle test beams and X-ray beams. In previous test beam studies of prototype modules, silicon sensor strips were found to respond in regions varying from the strip pitch of 74.5 {\upmu}m. The variations have been linked to local features of the sensor architecture. This paper presents results of detailed sensor measurements in both X-ray and particle beams investigating the impact of sensor features (metal pads and p-stops) on the responding area of a sensor strip.

physics.ins-det↗

arXiv2016

Characterisation of silicon microstrip detectors for the ATLAS Phase-II Upgrade with a micro-focused X-ray beam

The planned HL-LHC (High Luminosity LHC) in 2025 is being designed to maximise the physics potential through a sizable increase in the luminosity up to 6*10^34 cm^-2 s^-1. A consequence of this increased luminosity is the expected radiation damage at 3000 fb^-1 after ten years of operation, requiring the tracking detectors to withstand fluences to over 1*10^16 1 MeV n_eq/cm^2 . In order to cope with the consequent increased readout rates, a complete re-design of the current ATLAS Inner Detector (ID) is being developed as the Inner Tracker (ITk). Two proposed detectors for the ATLAS strip tracker region of the ITk were characterized at the Diamond Light Source with a 3 um FWHM 15 keV micro focused X-ray beam. The devices under test were a 320 Um thick silicon stereo (Barrel) ATLAS12 strip mini sensor wire bonded to a 130 nm CMOS binary readout chip (ABC130) and a 320 Um thick full size radial (end-cap) strip sensor - utilizing bi-metal readout layers - wire bonded to 250 nm CMOS binary readout chips (ABCN-25). A resolution better than the inter strip pitch of the 74.5 um strips was achieved for both detectors. The effect of the p-stop diffusion layers between strips was investigated in detail for the wire bond pad regions. Inter strip charge collection measurements indicate that the effective width of the strip on the silicon sensors is determined by p-stop regions between the strips rather than the strip pitch.

physics.ins-det↗