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Yuemin Li

Publications and source records attributed to Yuemin Li.

3 recordsLinked to original sources

Overcoming noise-agility trade-off in integrated lasers for precision sensing

Lasers that combine narrow linewidths with rapid tunability are critical for applications such as coherent optical ranging, distributed fiber-optic sensing, and precision spectroscopy. Despite significant progress in integrated laser technologies, the concurrent realization of low phase noise and frequency agility on a single integrated platform remains challenging owing to a fundamental architectural trade-off: conventional integrated laser designs typically suppress phase noise via high-$Q$ resonators, yet the extended photon lifetimes inherent to such resonators intrinsically constrain tuning speed. Here, we address this noise-agility trade-off by introducing a laser architecture that achieves ultralow phase noise and ultrafast tunability simultaneously. Rather than relying on ultrahigh-$Q$ resonators for self-injection locking, our design employs strong synthetic feedback within a Pockels-tunable, resonator-enhanced distributed Bragg reflector to suppress phase noise. As a proof of concept, we demonstrate a hybrid integrated laser with a short-term linewidth of 29 Hz, realized using a lithium niobate external cavity with a loaded $Q$ of only 0.62 million. The adoption of a moderate resonator $Q$ relaxes the photon-lifetime constraint on tuning speed, enabling sub-exahertz-per-second tuning rates and a chirp nonlinearity as low as 0.14%. Leveraging this laser, we implement a frequency-modulated continuous-wave LiDAR system that achieves a relative ranging precision of $1.7 \times 10^{-4}$ at a measurement rate of $1\,\text{MSa s}^{-1}$, without requiring complex chirp linearization techniques. We further demonstrate fiber-optic acoustic sensing capable of detecting sub-$\mu\epsilon$ dynamic strain, underscoring the platform's versatility for high-speed precision optical measurements. Our work provides a route toward cost-effective yet high-performance sensing and metrology systems.

physics.optics

Scalable 3D silicon nitride photonic interposer for high-density optical interconnects

Modern computing workloads demand energy-efficient, high-bandwidth interconnects, motivating photonic interposers as an alternative to electrical links. Here we demonstrate a compact 3D silicon nitride (SiN) photonic interposer prototype comprising two routing layers, with the 3D routing scheme optimized by a global optimization algorithm. The 3D interposer realizes a fully connected 12-node optical network that reduces the total number of intralayer crossings from 495 for all-planar routing to merely 150 (69.7% reduction), below the theoretical lower bound of 153 for all-planar interconnects. Comparing the two schemes, our 3D design achieves a 45.8% reduction experimentally in the average loss per waveguide. The proposed 3D routing architecture also features inherent symmetry and is scalable to higher node counts, flexible node placements, additional routing layers, and other operating wavelengths, enabling denser, lower-loss photonic interposers for next-generation scale-up and high-performance computing (HPC) systems.

physics.optics

Building reliable 3D photonic integrated circuits and cavities at the wafer scale

Three-dimensional (3D) photonic integrated circuits (PIC) are emerging as an indispensable scheme for high density and multifunctional photonic systems. However, the wafer-scale scaling of PICs towards a 3D configuration is constrained by two key factors: (i) the trade-off between inter-layer taper efficiency and footprint, and (ii) wafer-scale uniformity of inter-layer transition loss. In this work, we introduce etch-back assisted chemical mechanical polishing (E-CMP) to achieve high wafer-scale uniformity of the spacer layer. Moreover, we break the efficiency-footprint trade-off by demonstrating a novel $\kappa$-engineered taper, achieving a reliability metric that is 75\% higher than the traditional linearly tapered structure. Building on these design and fabrication developments, we enable reliable 3D PICs with typical loss of 0.077 and 0.068 dB/cm on two silicon nitride (SiN) waveguide layers and typical 3D transition loss as low as 6 mdB. Furthermore, the low 3D transition loss enables the first class of 3D high-Q optical cavities occupying two distinct device layers, providing new design space for high-Q optical cavities. The scalable fabrication process and design methodology provide routes for wafer-scale reliable 3D PICs that are promising in a series of applications ranging from photonic interconnects and computing networks to high-density photonic sensors and nonlinear photonics.

physics.optics