arXiv subjects

Zexin Fu

Publications and source records attributed to Zexin Fu.

5 recordsLinked to original sources

arXiv2026

Accelerating Precise End-to-End Simulation: Latency-Sensitive Many-core System Modeling

Modern large language model workloads put increasing demands on parallel compute capability and on-chip memory capacity, while also stressing fine-grained data movement and synchronization. These trends motivate exploring and designing many-core accelerators with tightly coupled scratchpad memory (SPM) for scalable compute and predictable, explicitly managed data access. However, this architectural shift raises two challenges: cycle-accurate register-transfer level (RTL) simulation becomes prohibitively slow as system complexity grows, and performance estimation requires precise modeling of latency-sensitive interconnect behavior. This paper presents a fast yet accurate end-to-end modeling approach for latency-sensitive many-core architectures, targeting large-scale instances such as TeraNoC with 1024 cores and a 4MiB globally shared L1 SPM. The approach captures timing behavior of latency-sensitive SPM accesses across multiple interconnect scales, while abstracting non-essential hardware details. Across diverse benchmarks, the model tracks a cycle-accurate RTL golden model with errors below 7%, while delivering up to 115x faster simulation. The framework also provides detailed profiling across processing elements and interconnect, enabling efficient end-to-end software development and hardware design exploration. Two case studies demonstrate its practicality: profiling-guided optimization of FlashAttention-2 to reduce interconnect stalls and synchronization overhead, and design space exploration of network-on-chip (NoC) router remapping to alleviate traffic imbalance and improve throughput.

cs.AR↗

arXiv2025

Hemlet: A Heterogeneous Compute-in-Memory Chiplet Architecture for Vision Transformers with Group-Level Parallelism

Vision Transformers (ViTs) have established new performance benchmarks in vision tasks such as image recognition and object detection. However, these advancements come with significant demands for memory and computational resources, presenting challenges for hardware deployment. Heterogeneous compute-in-memory (CIM) accelerators have emerged as a promising solution for enabling energy-efficient deployment of ViTs. Despite this potential, monolithic CIM-based designs face scalability issues due to the size limitations of a single chip. To address this challenge, emerging chiplet-based techniques offer a more scalable alternative. However, chiplet designs come with their own costs, as they introduce expensive communication, which can hinder improvements in throughput. This work introduces Hemlet, a heterogeneous CIM chiplet system designed to accelerate ViT workloads. Hemlet enables flexible resource scaling through the integration of heterogeneous analog CIM (ACIM), digital CIM (DCIM), and Intermediate Data Process (IDP) chiplets. To improve throughput while reducing communication overhead, it employs a group-level parallelism (GLP) mapping strategy and system-level dataflow optimization, achieving speedups ranging from 2.41x to 5.74x across various hardware configurations within the chiplet system. Our evaluation results show that Hemlet can reach a throughput of 9.56 TOPS with an energy efficiency of 4.98 TOPS/W.

cs.AR↗

arXiv2025

TeraNoC: A Multi-Channel 32-bit Fine-Grained, Hybrid Mesh-Crossbar NoC for Efficient Scale-up of 1000+ Core Shared-L1-Memory Clusters

A key challenge in on-chip interconnect design is to scale up bandwidth while maintaining low latency and high area efficiency. 2D-meshes scale with low wiring area and congestion overhead; however, their end-to-end latency increases with the number of hops, making them unsuitable for latency-sensitive core-to-L1-memory access. On the other hand, crossbars offer low latency, but their routing complexity grows quadratically with the number of I/Os, requiring large physical routing resources and limiting area-efficient scalability. This two-sided interconnect bottleneck hinders the scale-up of many-core, low-latency, tightly coupled shared-memory clusters, pushing designers toward instantiating many smaller and loosely coupled clusters, at the cost of hardware and software overheads. We present TeraNoC, an open-source, hybrid mesh-crossbar on-chip interconnect that offers both scalability and low latency, while maintaining very low routing overhead. The topology, built on 32bit word-width multi-channel 2D-meshes and crossbars, enables the area-efficient scale-up of shared-memory clusters. A router remapper is designed to balance traffic load across interconnect channels. Using TeraNoC, we build a cluster with 1024 single-stage, single-issue cores that share a 4096-banked L1 memory, implemented in 12nm technology. The low interconnect stalls enable high compute utilization of up to 0.85 IPC in compute-intensive, data-parallel key GenAI kernels. TeraNoC only consumes 7.6\% of the total cluster power in kernels dominated by crossbar accesses, and 22.7\% in kernels with high 2D-mesh traffic. Compared to a hierarchical crossbar-only cluster, TeraNoC reduces die area by 37.8\% and improves area efficiency (GFLOP/s/mm2) by up to 98.7\%, while occupying only 10.9\% of the logic area.

cs.DC↗

arXiv2025

Ramping Up Open-Source RISC-V Cores: Assessing the Energy Efficiency of Superscalar, Out-of-Order Execution

Open-source RISC-V cores are increasingly demanded in domains like automotive and space, where achieving high instructions per cycle (IPC) through superscalar and out-of-order (OoO) execution is crucial. However, high-performance open-source RISC-V cores face adoption challenges: some (e.g. BOOM, Xiangshan) are developed in Chisel with limited support from industrial electronic design automation (EDA) tools. Others, like the XuanTie C910 core, use proprietary interfaces and protocols, including non-standard AXI protocol extensions, interrupts, and debug support. In this work, we present a modified version of the OoO C910 core to achieve full RISC-V standard compliance in its debug, interrupt, and memory interfaces. We also introduce CVA6S+, an enhanced version of the dual-issue, industry-supported open-source CVA6 core. CVA6S+ achieves 34.4% performance improvement over CVA6 core. We conduct a detailed performance, area, power, and energy analysis on the superscalar out-of-order C910, superscalar in-order CVA6S+ and vanilla, single-issue in-order CVA6, all implemented in a 22nm technology and integrated into Cheshire, an open-source modular SoC. We examine the performance and efficiency of different microarchitectures using the same ISA, SoC, and implementation with identical technology, tools, and methodologies. The area and performance rankings of CVA6, CVA6S+, and C910 follow expected trends: compared to the scalar CVA6, CVA6S+ shows an area increase of 6% and an IPC improvement of 34.4%, while C910 exhibits a 75% increase in area and a 119.5% improvement in IPC. However, efficiency analysis reveals that CVA6S+ leads in area efficiency (GOPS/mm2), while the C910 is highly competitive in energy efficiency (GOPS/W). This challenges the common belief that high performance in superscalar and out-of-order cores inherently comes at a significant cost in area and energy efficiency.

cs.AR↗

arXiv2025

CVA6S+: A Superscalar RISC-V Core with High-Throughput Memory Architecture

Open-source RISC-V cores are increasingly adopted in high-end embedded domains such as automotive, where maximizing instructions per cycle (IPC) is becoming critical. Building on the industry-supported open-source CVA6 core and its superscalar variant, CVA6S, we introduce CVA6S+, an enhanced version incorporating improved branch prediction, register renaming and enhanced operand forwarding. These optimizations enable CVA6S+ to achieve a 43.5% performance improvement over the scalar configuration and 10.9% over CVA6S, with an area overhead of just 9.30% over the scalar core (CVA6). Furthermore, we integrate CVA6S+ with the OpenHW Core-V High-Performance L1 Dcache (HPDCache) and report a 74.1% bandwidth improvement over the legacy CVA6 cache subsystem.

cs.AR↗