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arXiv · 0711.3276

Surface Conditioning Effect on Vacuum Microelectronics Components Fabricated by Deep Reactive Ion Etching

A. Phommahaxay·G. Lissorgues·L. Rousseau·T. Bourouina·P. Nicole
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Abstract

Advances in material processing such as silicon micromachining are opening the way to vacuum microelectronics. Two-dimensional vacuum components can be fabricated using the microsystems processes. We developed such devices using a single metal layer and silicon micromachining by DRIE. The latter technological step has significant impact on the characteristics of the vacuum components. This paper presents a brief summary of electron emission possibilities and the design leading to the fabrication of a lateral field emission diode. First measurement results and the aging of the devices are also discussed.

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A. Phommahaxay, G. Lissorgues, L. Rousseau, T. Bourouina, P. Nicole. 2007-11-21. Surface Conditioning Effect on Vacuum Microelectronics Components Fabricated by Deep Reactive Ion Etching. https://arxiv.org/abs/0711.3276

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