Interconnect Challenges in Highly Integrated MEMS/ASIC Subsystems

N. Marenco; S. Warnat; W. Reinert

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arXiv · 0802.3095

Interconnect Challenges in Highly Integrated MEMS/ASIC Subsystems

N. Marenco·S. Warnat·W. Reinert

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Abstract

Micromechanical devices like accelerometers or rotation sensors form an increasing segment beneath the devices supplying the consumer market. A hybrid integration approach to build smart sensor clusters for the precise detection of movements in all spatial dimensions requires a large toolbox of interconnect technologies, each with its own constraints regarding the total process integration. Specific challenges described in this paper are post-CMOS feedthroughs, front-to-front die contact arrays, vacuum-compliant lateral interconnect and fine-pitch solder balling to finally form a Chip-Scale System-in-Package (CSSiP).

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N. Marenco, S. Warnat, W. Reinert. 2008-02-21. Interconnect Challenges in Highly Integrated MEMS/ASIC Subsystems. https://arxiv.org/abs/0802.3095

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