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arXiv · 1306.0796

Deposited low temperature silicon GHz modulator

Yoon Ho Daniel Lee·Michael O. Thompson·Michal Lipson
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Abstract

The majority of silicon photonics is built on silicon-on-insulator (SOI) wafers while the majority of electronics, including CPUs and memory, are built on bulk silicon wafers, limiting broader acceptance of silicon photonics. This discrepancy is a result of silicon photonics's requirement for a single-crystalline silicon (c-Si) layer and a thick undercladding for optical guiding that bulk silicon wafers to not provide. While the undercladding problem can be partially addressed by substrate removal techniques, the complexity of co-integrating photonics with state-of-the-art transistors and real estate competition between electronics and photonics remain problematic. We show here a platform for deposited GHz silicon photonics based on polycrystalline silicon with high optical quality suitable for high performance electro-optic devices. We demonstrate 3 Gbps polysilicon electro-optic modulator fabricated on a deposited polysilicon layer fully compatible with CMOS backend integration. These results open up an array of possibilities for silicon photonics including photonics on DRAM and flexible substrates.

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Yoon Ho Daniel Lee, Michael O. Thompson, Michal Lipson. 2013-06-04. Deposited low temperature silicon GHz modulator. https://doi.org/10.1364/oe.21.026688

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