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arXiv · 1709.04156

Through-membrane electron-beam lithography for ultrathin membrane applications

M. Neklyudova·A. K. Erdamar·L. Vicarelli·S. J. Heerema·T. Rehfeldt·G. Pandraud·Z. Kolahdouz·C. Dekker·H. W. Zandbergen
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Abstract

We present a technique to fabricate ultrathin (down to 20 nm) uniform electron transparent windows at dedicated locations in a SiN membrane for in situ transmission electron microscopy experiments. An electron-beam (e-beam) resist is spray-coated on the backside of the membrane in a KOH- etched cavity in silicon which is patterned using through-membrane electron-beam lithography. This is a controlled way to make transparent windows in membranes, whilst the topside of the membrane remains undamaged and retains its flatness. Our approach was optimized for MEMS-based heating chips but can be applied to any chip design. We show two different applications of this technique for (1) fabrication of a nanogap electrode by means of electromigration in thin free-standing metal films and (2) making low-noise graphene nanopore devices.

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M. Neklyudova, A. K. Erdamar, L. Vicarelli, S. J. Heerema, T. Rehfeldt, G. Pandraud, Z. Kolahdouz, C. Dekker, H. W. Zandbergen. 2017-09-13. Through-membrane electron-beam lithography for ultrathin membrane applications. https://doi.org/10.1063/1.4986991

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