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arXiv · 1810.09531

Fiber to Chip Fusion Splicing for Robust, Low Loss Photonic Packaging

Juniyali Nauriyal·Meiting Song·Raymond Yu·Jaime Cardenas
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Abstract

Silicon photonic devices are poised to enter high volume markets such as data-communications, telecommunications, biological sensing, and optical phased arrays; however, permanently attaching a fiber to the photonic chip with high optical efficiency remains a challenge. We present a robust and low-loss packaging technique of permanent optical edge coupling between a fiber and a chip using fusion splicing which is low-cost and scalable to high volume manufacturing. We fuse a SMF-28 cleaved fiber to the chip via CO$_2$ laser and reinforce it with optical adhesive. We demonstrate minimum loss of 1.0dB per-facet with 0.6dB penalty over 160nm bandwidth from 1480nm-1640nm.

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Juniyali Nauriyal, Meiting Song, Raymond Yu, Jaime Cardenas. 2018-10-03. Fiber to Chip Fusion Splicing for Robust, Low Loss Photonic Packaging. https://arxiv.org/abs/1810.09531

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