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arXiv · 2107.00444

Bridging the gap between atomically thin semiconductors and metal leads

Xiangbin Cai·Zefei Wu·Xu Han·Shuigang Xu·Jiangxiazi Lin·Tianyi Han·Pingge He·Xuemeng Feng·Liheng An·Run Shi·Jingwei Wang·Zhehan Ying·Yuan Cai·Mengyuan Hua·Junwei Liu·Ding Pan·Chun Cheng·Ning Wang
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Abstract

Electrically interfacing atomically thin transition metal dichalcogenide semiconductors (TMDSCs) with metal leads is challenging because of undesired interface barriers, which have drastically constrained the electrical performance of TMDSC devices for exploring their unconventional physical properties and realizing potential electronic applications. Here we demonstrate a strategy to achieve nearly barrier-free electrical contacts with few-layer TMDSCs by engineering interfacial bonding distortion. The carrier-injection efficiency of such electrical junction is substantially increased with robust ohmic behaviors from room to cryogenic temperatures. The performance enhancements of TMDSC field-effect transistors are well reflected by the ultralow contact resistance (down to 90 Ohm um in MoS2, towards the quantum limit), the ultrahigh field-effect mobility (up to 358,000 cm2V-1s-1 in WSe2) and the prominent transport characteristics at cryogenic temperatures. This method also offers new possibilities of the local manipulation of structures and electronic properties for TMDSC device design.

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Xiangbin Cai, Zefei Wu, Xu Han, Shuigang Xu, Jiangxiazi Lin, Tianyi Han, Pingge He, Xuemeng Feng, Liheng An, Run Shi, Jingwei Wang, Zhehan Ying, Yuan Cai, Mengyuan Hua, Junwei Liu, Ding Pan, Chun Cheng, Ning Wang. 2021-07-01. Bridging the gap between atomically thin semiconductors and metal leads. https://doi.org/10.1038/s41467-022-29449-4

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