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arXiv · 2205.12669

The MAPS foil

S. Beolé·F. Carnesecchi·G. Contin·R. de Oliveira·A. di Mauro·S. Ferry·H. Hillemanns·A. Junique·A. Kluge·L. Lautner·M. Mager·B. Mehl·K. Rebane·F. Reidt·I. Sanna·M. Šuljić·A. Yüncü
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Abstract

We present a method of embedding a Monolithic Active Pixel Sensor (MAPS) into a flexible printed circuit board (FPC) and its interconnection by means of through-hole copper plating. The resulting assembly, baptised "MAPS foil", is a flexible, light, protected, and fully integrated detector module. By using widely available printed circuit board manufacturing techniques, the production of these devices can be scaled easily in size and volume, making it a compelling candidate for future large-scale applications. A first series of prototypes that embed the ALPIDE chip has been produced, functionally tested, and shown to be working.

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S. Beolé, F. Carnesecchi, G. Contin, R. de Oliveira, A. di Mauro, S. Ferry, H. Hillemanns, A. Junique, A. Kluge, L. Lautner, M. Mager, B. Mehl, K. Rebane, F. Reidt, I. Sanna, M. Šuljić, A. Yüncü. 2022-05-25. The MAPS foil. https://doi.org/10.1016/j.nima.2022.167673

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