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arXiv · 2211.09351

Design of The Kinetic Inductance Detector Based Focal Plane Assembly for The Terahertz Intensity Mapper

L. -J. Liu·R. M. J. Janssen·C. M. Bradford·S. Hailey-Dunsheath·J. Fu·J. P. Filippini·J. E. Aguirre·J. S. Bracks·A. J. Corso·C. Groppi·J. Hoh·R. P. Keenan·I. N. Lowe·D. P. Marrone·P. Mauskopf·R. Nie·J. Redford·I. Trumper·J. D. Vieira
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Abstract

We report on the kinetic inductance detector (KID) array focal plane assembly design for the Terahertz Intensity Mapper (TIM). Each of the 2 arrays consists of 4 wafer-sized dies (quadrants), and the overall assembly must satisfy thermal and mechanical requirements, while maintaining high optical efficiency and a suitable electromagnetic environment for the KIDs. In particular, our design manages to strictly maintain a 50 $\mathrm{\mu m}$ air gap between the array and the horn block. We have prototyped and are now testing a sub-scale assembly which houses a single quadrant for characterization before integration into the full array. The initial test result shows a $>$95% yield, indicating a good performance of our TIM detector packaging design.

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L. -J. Liu, R. M. J. Janssen, C. M. Bradford, S. Hailey-Dunsheath, J. Fu, J. P. Filippini, J. E. Aguirre, J. S. Bracks, A. J. Corso, C. Groppi, J. Hoh, R. P. Keenan, I. N. Lowe, D. P. Marrone, P. Mauskopf, R. Nie, J. Redford, I. Trumper, J. D. Vieira. 2022-11-17. Design of The Kinetic Inductance Detector Based Focal Plane Assembly for The Terahertz Intensity Mapper. https://doi.org/10.1007/s10909-022-02882-x

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