arXiv · 2410.06417
A multi-channel silicon package for large-scale skipper-CCD experiments
Abstract
The next generation of experiments for rare-event searches based on skipper Charge Coupled Devices (skipper-CCDs) presents new challenges for the sensor packaging and readout. Scaling the active mass and simultaneously reducing the experimental backgrounds in orders of magnitude requires a novel high-density silicon-based package that must be massively produced and tested. In this work, we present the design, fabrication, testing, and empirical signal model of a multi-channel silicon package. In addition, we outline the chosen specifications for the ongoing production of 1500 wafers that will add up to a 10 kg skipper-CCD array with 24000 readout channels.
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A. M. Botti, C. Chavez, M. Sofo-Haro, C. S. Miller, F. Chierchie, M. Jonas, M. Lisovenko, H. Gutti, D. Czaplewski, A. Lathrop, J. Tiffenberg, G. Fernandez-Moroni, J. Estrada. 2024-10-08. A multi-channel silicon package for large-scale skipper-CCD experiments. https://doi.org/10.1109/jsen.2025.3529769
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