Development of Low-Mass Flex PCB and Nanowire Interconnect Technologies for HEP Module Integration

Abhishek Sharma; Atul Gorane; Petra Riedler; Julian Weick

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arXiv · 2601.17029

Development of Low-Mass Flex PCB and Nanowire Interconnect Technologies for HEP Module Integration

Abhishek Sharma·Atul Gorane·Petra Riedler·Julian Weick

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Abstract

The development of lightweight flex PCBs and nanowire-based thermal interfaces for low-mass, high-performance detector modules are presented. A novel manufacturing approach targeting flex circuits with double-sided pad access, assembled using ACF and gold studs. Signal integrity was simulated and validation trials conducted on test structures. For thermal management, sintered nanowire interfaces were evaluated. These results contribute quantitative input relevant to minimal-mass, scalable packaging in HEP detectors.

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Abhishek Sharma, Atul Gorane, Petra Riedler, Julian Weick. 2026-01-18. Development of Low-Mass Flex PCB and Nanowire Interconnect Technologies for HEP Module Integration. https://arxiv.org/abs/2601.17029

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