Laser-micromachined silicon-platelet feedhorns for large-scale submillimeter and millimeter-wave focal planes

Abstract

We present the fabrication and characterization of the first silicon-platelet feedhorn arrays produced using laser micromachining. First, we present a demonstration of the technology for the millimeter-wave band of 80~GHz to 170~GHz, i.e. covering the 90/150~GHz bands typical of CMB experiments. Next, we expand the technology to large-scale production on 150~mm wafers and demonstrate operation at submillimeter wavelengths. This feedhorn array is optimized for operation in a band centered at 350~GHz (330~GHz to 370~GHz) and is being deployed as one of the focal plane elements of the CCAT 350~GHz module of Prime-Cam. We present the design and fabrication processes for these feedhorn arrays and compare the optical performance directly to simulation and to feedhorns of identical design but produced using traditional deep reactive-ion etching (DRIE). We conclude with a discussion of future expansions of this technology, including the potential of sidewall control and using thicker (and thus fewer) wafers, which could significantly reduce production costs and labor.