arXiv subjects

Andrew Armstrong

Publications and source records attributed to Andrew Armstrong.

13 recordsLinked to original sources

arXiv2026

AlN Gate Interlayer for UWBG AlGaN Transistors with Breakdown Field >6.9 MV/cm and PFOM >1.8 GW/cm2

We report the demonstration of regrown epitaxial AlN gate interlayers with ultra-wide bandgap (UWBG) AlGaN polarization-graded field effect transistors (PolFETs). The introduction of the epitaxial AlN gate interlayer enables significant improvement in breakdown strength, with average breakdown field exceeding 6.94 MV/cm, which represents state-of-the-art for lateral field effect transistors, while maintaining excellent on-state current density exceeding 1 A/mm. The integration of epitaxial AlN enables state-of-the-art power-switching figure of merit exceeding 1.87 GW/cm2 at a breakdown voltage exceeding 1.45 kV. This work shows the potential of UWBG AlGaN for next-generation high-power switching and RF applications with enhanced device performance established by a high-quality epitaxially regrown AlN gate interlayer.

physics.app-ph↗

arXiv2026

High Breakdown Field Multi-kV UWBG AlGaN Transistors

We demonstrate high-performance UWBG AlGaN PolFETs exhibiting a state-of-the-art combination of nearly 1 A/mm on-state current (~ 960 mA/mm) and large breakdown field (> 4.8 MV/cm) in high carrier density (1.15 x 1013 cm-2). Multi-kV robustness is successfully demonstrated exhibiting 1.28 and 2.17 kV by utilizing a gate-connected field plate structures in 3.9 and 6.8 {\mu}m LGD, corresponding to the extremely low specific on-resistance of 1.25 and 2.86 m{\Omega}cm2, respectively. High RF performance is also achieved, providing fT and fMAX, of 8.5 and 15 GHz, respectively, for 3.9 {\mu}m LGD. These results highlight UWBG AlGaN as a platform for both high-voltage RF and power applications.

physics.app-ph↗

arXiv2025

Ultra-Wide Bandgap AlGaN Heterostructure Field Effect Transistors with Current Gain Cutoff Frequency Above 85 GHz

We report the design and demonstration of ultra-wide-bandgap (UWBG) AlGaN polarization-graded field-effect transistors (PolFETs) that achieve a current-gain cutoff frequency above 85 GHz and a current density exceeding 1.3 A/mm. Ultra-thin channel and buffer layers were grown epitaxially on AlN substrates, and a reverse-graded AlGaN contact layer was incorporated to reduce the contact resistance to below 1 ohm.mm. With aggressively scaled device dimensions, the AlGaN PolFETs exhibit state-of-the-art high-frequency performance for UWBG transistors. Small-signal modeling reveals both parasitic and transit delays, confirming the benefits of reduced access resistance and enhanced intrinsic transconductance. These results establish a new performance benchmark for UWBG AlGaN devices and demonstrate their strong potential for next-generation millimeter-wave electronics.

physics.app-ph↗

arXiv2025

Barrier Electrostatics and Contact Engineering for Ultra-Wide Bandgap AlGaN HFETs

We report ultra-wide bandgap (UWBG) AlGaN heterostructure field-effect transistors (HFETs) exhibiting a high breakdown field (> 5.3 MV/cm) and a low contact resistance (~1.55 {\Omega}mm), tailored for high-power radiofrequency applications. A split-doped barrier architecture, employing two distinct doping concentrations, is shown to enhance both the breakdown field and contact resistance. This design enables a state-of-the-art combination of maximum drain current (487 mA/mm) and breakdown field, along with a high cutoff frequency of 7.2 GHz. These results demonstrate a viable pathway to push device performance toward the material limits while minimizing contact resistance in UWBG AlGaN HFETs, paving the way for next-generation high-power, high-frequency applications.

cond-mat.mtrl-sci↗

arXiv2025

High Breakdown Electric Field (> 5 MV/cm) in UWBG AlGaN Transistors

We report on the design and demonstration of ultra-wide bandgap (UWBG) AlGaN-channel metal-insulator heterostructure field effect transistors (HEFTs) for high-power, high-frequency applications. We find that the integration of gate dielectrics and field plates greatly improves the breakdown field in these devices, with state-of-art average breakdown field of 5.3 MV/cm (breakdown voltage > 260 V) with an associated maximum current density of 342 mA/mm, and cut-off frequency of 9.1 GHz. Furthermore, low trap-related impact was observed from minimal gate and drain lag estimated from pulsed I-V characteristics. The reported results provide the potential of UWBG AlGaN HEFTs for the next generation high-power radio frequency applications.

cond-mat.mtrl-sci↗

arXiv2025

Energy Bands and Breakdown Characteristics in Al2O3/UWBG AlGaN Heterostructures

We report on energy bands and breakdown characteristics of Al2O3 dielectrics on ultra-wide bandgap (UWBG) AlGaN heterostructures. Metal-dielectric-semiconductor structures are important to sustain high fields needed for future high-performance UWBG transistors. Using systematic experiments, we determined the fixed charge density (> 1013 cm-2), the dielectric/interface, and electric fields in the oxide of under flat-band conditions in the semiconductor. Low gate-to-drain leakage current of up to 5 x 10-7 A/cm2 were obtained in the metal-oxide-semiconductor structures. In lateral metal-semiconductor-insulator test structures, breakdown voltage exceeding 1 kV was obtained with a channel sheet charge density of 1.27 x 1013 cm-2. The effective peak electric field and average breakdown field were estimated to be > 4.27 MV/cm and 1.99 MV/cm, respectively. These findings demonstrate the potential of Al2O2 integration for enhancing the breakdown performance of UWBG AlGaN HEMTs.

cond-mat.mtrl-sci↗

arXiv2024

Heterostructure and Interfacial Engineering for Low-Resistance Contacts to Ultra-Wide Bandgap AlGaN

We report on the heterostructure and interfacial engineering of metalorganic chemical vapor deposition (MOCVD) grown reverse-graded contacts to ultra-wide bandgap AlGaN. A record low contact resistivity of 1.4 x 10-6 Ohm.cm2 was reported on an Al0.82Ga0.18N metal semiconductor field effect transistor (MESFET) by compositionally grading the contact layer from Al0.85Ga0.15N to Al0.14Ga0.86N with degenerate doping and proper interfacial engineering considering bandgap-narrowing-induced band offset between channel and contact layer. This represents orders-of-magnitude of lower contact resistivity than that obtained in similar MOCVD-grown structures. A detailed, layer-by-layer analysis of the reverse graded contact and TCAD simulation of the bandgap narrowing effect highlighted that the reverse graded contact layer itself is extremely conductive and interfacial resistance due to bandgap-narrowing-induced barrier between contact and channel dominates the contact resistance.

cond-mat.mtrl-sci↗

arXiv2024

Tunnel Junction-Enabled Monolithically Integrated GaN Micro-Light Emitting Transistor

GaN/InGaN microLEDs are a very promising technology for next generation displays. Switching control transistors and their integration are key components in achieving high-performance, efficient displays. Monolithic integration of microLEDs with GaN switching devices provides an opportunity to control microLED output power with capacitive (voltage) control rather than current controlled schemes. This approach can greatly reduce system complexity for the driver circuit arrays while maintaining device opto-electronic performance. In this work, we demonstrate a 3-terminal GaN micro-light emitting transistor that combines a GaN/InGaN blue tunneling-based microLED with a GaN n-channel FET. The integrated device exhibits excellent gate control, drain current control and optical emission control. This work provides a promising pathway for future monolithic integration of GaN FETs with microLED to enable fast switching high efficiency microLED display and communication systems.

physics.app-ph↗

arXiv2020

All-MOCVD-Grown Gallium Nitride Diodes with Ultra-Low Resistance Tunnel Junctions

We carefully investigate three important effects including postgrowth activation annealing, delta (δ) dose and p+-GaN layer thickness and experimentally demonstrate their influence on the electrical properties of GaN p-n homojunction diodes with a tunnel junction (TJ)-based p-contact. The p-n diodes and TJ structures were monolithically grown by metalorganic chemical vapor deposition (MOCVD) in a single growth step. By optimizing the annealing time and temperature for magnesium (Mg) activation and introducing δ-doses for both donors and acceptors at TJ interfaces, a significant improvement in electrical properties is achieved. For the continuously-grown, all-MOCVD GaN homojunction TJs, ultra-low forward voltage penalties of 158 mV and 490 mV are obtained at current densities of 20 A/cm2 and 100 A/cm2, respectively. The p-n diode with an engineered TJ shows a record-low normalized differential resistance of 1.6 x 10-4 Ω-cm2 at 5 kA/cm2.

cond-mat.mtrl-sci↗

arXiv2017

Cathodoluminescence as an Effective Probe of Carrier Transport and Deep Level Defects in Droop-Mitigating InGaN/GaN Quantum Well Heterostructures

Commercial InGaN/GaN light emitting diode heterostructures continue to suffer from efficiency droop at high current densities. Droop mitigation strategies target Auger recombination and typically require structural and/or compositional changes within the multi-quantum well active region. However, these modifications are often accompanied by a corresponding degradation in material quality that decreases the expected gains in high-current external quantum efficiency. We study origins of these efficiency losses by correlating chip-level quantum efficiency measurements with structural and optical properties obtained using a combination of electron microscopy tools. The drop in quantum efficiency is not found to be correlated with quantum well (QW) width fluctuations. Rather, we show direct correlation between active region design, deep level defects, and delayed electron beam induced cathodoluminescence (CL) with characteristic rise time constants on the order of tens of seconds. We propose a model in which the electron beam fills deep level defect states and simultaneously drives reduction of the built-in field within the multi-quantum well active region, resulting in a delay in accumulation of carrier populations within the QWs. The CL measurements yield fundamental insights into carrier transport phenomena, efficiency-reducing defects, and quantum well band structure that are important in guiding future heterostructure process development.

cond-mat.mes-hall↗

arXiv2015

Enhanced Light Extraction in Tunnel Junction Enabled Top Emitting UV LEDs

The efficiency of ultra violet LEDs is critically limited by the absorption losses in p-type and metal layers. In this work, surface roughening based light extraction structures are combined with tunneling-based top-contacts to realize highly efficient top-side light extraction efficiency in UV LEDs. Surface roughening of the top n-type AlGaN contact layer is demonstrated using self-assembled Ni nano-clusters as etch mask. The top surface roughened LEDs were found to enhance external quantum efficiency by over 40% for UV LEDs with a peak emission wavelength of 326 nm. The method described here can enable highly efficient UV LEDs without the need for complex manufacturing methods such as flip chip bonding.

cond-mat.mtrl-sci↗

arXiv2015

Interband Tunneling for Hole Injection in III-Nitride Ultra-violet Emitters

Ultra-violet emitters have several applications in the areas of sensing, water purification, and data storage. While the III-Nitride semiconductor system has the band gap region necessary for ultraviolet emission, achieving efficient ultraviolet solid state emitters remains a challenge due to the low p-type conductivity and high contact resistance in wide band gap AlGaN-based ultra-violet light emitters. In this work, we show that efficient interband tunneling can be used for non-equilibrium injection of holes into ultraviolet emitters. Polarization-engineered tunnel junctions were used to enhance tunneling probability by several orders of magnitude over a PN homojunction, leading to highly efficient tunnel injection of holes to ultraviolet light emitters. This demonstration of efficient interband tunneling introduces a new paradigm for design of ultra-violet light emitting diodes and diode lasers, and enables higher efficiency and lower cost ultra-violet emitters.

cond-mat.mtrl-sci↗

arXiv2012

The head leads the body: a curvature-based kinematic description of C. elegans

Caenorhabditis elegans, a free-living soil nematode, propels itself by producing undulatory body motion and displays a rich variety of body shapes and trajectories during its locomotion in complex environments. Here we show that the complex shapes and trajectories of C. elegans have a simple analytical description in curvature representation. Our model is based on the assumption that the curvature wave is generated in the head segment of the worm body and propagates backwards. We have found that a simple harmonic function for the curvature can capture multiple worm shapes during the undulatory movement. The worm body trajectories can be well represented in terms of piecewise sinusoidal curvature with abrupt changes in amplitude, wavevector, and phase.

physics.bio-ph↗