arXiv subjects

Simon Spannagel

Publications and source records attributed to Simon Spannagel.

At least 37 records · Page 2Linked to original sources

arXiv2024

Simulations and Performance Studies of a MAPS in 65 nm CMOS Imaging Technology

Monolithic active pixel sensors (MAPS) produced in a 65 nm CMOS imaging technology are being investigated for applications in particle physics. The MAPS design has a small collection electrode characterized by an input capacitance of ~fF, granting a high signal-to-noise ratio and low power consumption. Additionally, the 65 nm CMOS imaging technology brings a reduction in material budget and improved logic density of the readout circuitry, compared to previously studied technologies. Given these features, this technology was chosen by the TANGERINE project to develop the next generation of silicon pixel sensors. The sensor design targets temporal and spatial resolutions compatible with the requirements for a vertex detector at future lepton colliders. Simulations and test-beam characterization of technology demonstrators have been carried out in close collaboration with the CERN EP R&D program and the ALICE ITS3 upgrade. TCAD device simulations using generic doping profiles and Monte Carlo simulations have been used to build an understanding of the technology and predict the performance parameters of the sensor. Technology demonstrators of a 65 nm CMOS MAPS with a small collection electrode have been characterized in laboratory and test-beam facilities by studying performance parameters such as cluster size, charge collection, and efficiency. This work compares simulation results to test-beam data. The experimental results establish this technology as a promising candidate for a vertex detector at future lepton colliders and give valuable information for improving the simulation approach.

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arXiv2023

Developing a Monolithic Silicon Sensor in a 65 nm CMOS Imaging Technology for Future Lepton Collider Vertex Detectors

Monolithic CMOS sensors in a 65 nm imaging technology are being investigated by the CERN EP Strategic R&D Programme on Technologies for Future Experiments for an application in particle physics. The appeal of monolithic detectors lies in the fact that both sensor volume and readout electronics are integrated in the same silicon wafer, providing a reduction in production effort, costs and scattering material. The Tangerine Project WP1 at DESY participates in the Strategic R&D Programme and is focused on the development of a monolithic active pixel sensor with a time and spatial resolution compatible with the requirements for a future lepton collider vertex detector. By fulfilling these requirements, the Tangerine detector is suitable as well to be used as telescope planes for the DESY-II Test Beam facility. The project comprises all aspects of sensor development, from the electronics engineering and the sensor design using simulations, to laboratory and test beam investigations of prototypes. Generic TCAD Device and Monte-Carlo simulations are used to establish an understanding of the technology and provide important insight into performance parameters of the sensor. Testing prototypes in laboratory and test beam facilities allows for the characterization of their response to different conditions. By combining results from all these studies it is possible to optimize the sensor layout. This contribution presents results from generic TCAD and Monte-Carlo simulations, and measurements performed with test chips of the first sensor submission.

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arXiv2023

Ultrafast CMOS image sensors and data-enabled super-resolution for multimodal radiographic imaging and tomography

We summarize recent progress in ultrafast Complementary Metal Oxide Semiconductor (CMOS) image sensor development and the application of neural networks for post-processing of CMOS and charge-coupled device (CCD) image data to achieve sub-pixel resolution (thus $super$-$resolution$). The combination of novel CMOS pixel designs and data-enabled image post-processing provides a promising path towards ultrafast high-resolution multi-modal radiographic imaging and tomography applications.

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arXiv2022

Towards a New Generation of Monolithic Active Pixel Sensors

A new generation of Monolithic Active Pixel Sensors (MAPS), produced in a 65 nm CMOS imaging process, promises higher densities of on-chip circuits and, for a given pixel size, more sophisticated in-pixel logic compared to larger feature size processes. MAPS are a cost-effective alternative to hybrid pixel sensors since flip-chip bonding is not required. In addition, they allow for significant reductions of the material budget of detector systems, due to the smaller physical thicknesses of the active sensor and the absence of a separate readout chip. The TANGERINE project develops a sensor suitable for future Higgs factories as well as for a beam telescope to be used at beam-test facilities. The sensors will have small collection electrodes (order of $μ$m) to maximize the signal-to-noise ratio, which makes it possible to minimize power dissipation in the circuitry. The first batch of test chips, featuring full front-end amplifiers with Krummenacher feedback, was produced and tested at the Mainzer Mikrotron (MAMI) at the end of 2021. MAMI provides an electron beam with currents up to 100 $μ$A and an energy of 855 MeV. The analog output signal of the test chips was recorded with a high bandwidth oscilloscope and used to study the charge-sensitive amplifier of the chips in terms of waveform analysis. A beam telescope was used as a reference system to allow for track-based analysis of the recorded data.

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arXiv2022

Comparison of different sensor thicknesses and substrate materials for the monolithic small collection-electrode technology demonstrator CLICTD

Small collection-electrode monolithic CMOS sensors profit from a high signal-to-noise ratio and a small power consumption, but have a limited active sensor volume due to the fabrication process based on thin high-resistivity epitaxial layers. In this paper, the active sensor depth is investigated in the monolithic small collection-electrode technology demonstrator CLICTD. Charged particle beams are used to study the charge-collection properties and the performance of devices with different thicknesses both for perpendicular and inclined particle incidence. In CMOS sensors with a high-resistivity Czochralski substrate, the depth of the sensitive volume is found to increase by a factor two in comparison with standard epitaxial material and leads to significant improvements in the hit-detection efficiency and the spatial and time resolution.

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arXiv2022

The Tangerine project: Development of high-resolution 65 nm silicon MAPS

The Tangerine project aims to develop new state-of-the-art high-precision silicon detectors. Part of the project has the goal of developing a monolithic active pixel sensor using a novel 65 nm CMOS imaging process, with a small collection electrode. This is the first application of this process in particle physics, and it is of great interest as it allows for an increased logic density and reduced power consumption and material budget compared to other processes. The process is envisioned to be used in for example the next ALICE inner tracker upgrade, and in experiments at the electron-ion collider. The initial goal of the three-year Tangerine project is to develop and test a sensor in a 65 nm CMOS imaging process that can be used in test beam telescopes at DESY, providing excellent spatial resolution and high time resolution, and thus demonstrating the capabilities of the process. The project covers all aspects of sensor R&D, from electronics and sensor design using simulations, to prototype test chip characterisation in labs and at test beams. The sensor design simulations are performed by using a powerful combination of detailed electric field simulations using technology computer-aided design and high-statistics Monte Carlo simulations using the Allpix Squared framework. A first prototype test chip in the process has been designed and produced, and successfully operated and tested both in labs and at test beams.

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arXiv2022

Transient Monte Carlo Simulations for the Optimisation and Characterisation of Monolithic Silicon Sensors

An ever-increasing demand for high-performance silicon sensors requires complex sensor designs that are challenging to simulate and model. The combination of electrostatic finite element simulations with a transient Monte Carlo approach provides simultaneous access to precise sensor modelling and high statistics. The high simulation statistics enable the inclusion of Landau fluctuations and production of secondary particles, which offers a realistic simulation scenario. The transient simulation approach is an important tool to achieve an accurate time-resolved description of the sensor, which is crucial in the face of novel detector prototypes with increasingly precise timing capabilities. The simulated time resolution as a function of operating parameters as well as the full transient pulse can be monitored and assessed, which offers a new perspective on the optimisation and characterisation of silicon sensors. In this paper, a combination of electrostatic finite-element simulations using 3D TCAD and transient Monte Carlo simulations with the Allpix Squared framework are presented for a monolithic CMOS pixel sensor with a small collection diode, that is characterised by a highly inhomogeneous, complex electric field. The results are compared to transient 3D TCAD simulations that offer a precise simulation of the transient behaviour but long computation times. Additionally, the simulations are benchmarked against test-beam data and good agreement is found for the performance parameters over a wide range of different operation conditions.

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arXiv2021

Allpix$^2$ -- Silicon Detector Monte Carlo Simulations for Particle Physics and Beyond

Allpix$^2$ is a versatile, open-source simulation framework for silicon pixel detectors. Its goal is to ease the implementation of detailed simulations for both single sensors and more complex setups with multiple detectors. While originally created for silicon detectors in high-energy physics, it is capable of simulating a wide range of detector types for various application scenarios, through its interface to Geant4 to describe the interaction of particles with matter, and the different algorithms for charge transport and digitization. The simulation chain is arranged with the help of intuitive configuration files and an extensible system of modules, which implement the individual simulation steps. Detailed electric field maps imported from TCAD simulations can be used to precisely model the drift behavior of the charge carriers, bringing a new level of realism to the Monte Carlo simulation of particle detectors. Recently, Allpix$^2$ has seen major improvements to its core framework to take full advantage of multi- and many-core processor architectures for simulating events fully parallel. Furthermore, new physics models such as charge carrier recombination in silicon have been introduced, further extending the application range. This contribution provides an overview of the framework and its components, highlighting the versatility and recent developments.

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arXiv2021

Corryvreckan: A Modular 4D Track Reconstruction and Analysis Software for Test Beam Data

Corryvreckan is a versatile, highly configurable software with a modular structure designed to reconstruct and analyse test beam and laboratory data. It caters to the needs of the test beam community by providing a flexible offline event building facility to combine detectors with different read-out schemes, with or without trigger information, and includes the possibility to correlate data from multiple devices based on timestamps. Hit timing information, available with high precision from an increasing number of detectors, can be used in clustering and tracking to reduce combinatorics. Several algorithms, including an implementation of Millepede-II, are provided for offline alignment. A graphical user interface enables direct monitoring of the reconstruction progress and can be employed for quasi-online monitoring during data taking. This work introduces the Corryvreckan framework architecture and user interface, and provides a detailed overview of the event building algorithm. The reconstruction and analysis capabilities are demonstrated with data recorded at the DESY II Test Beam Facility using the EUDAQ2 data acquisition framework with an EUDET-type beam telescope, a Timepix3 timing reference, a fine-pitch planar silicon sensor with CLICpix2 readout and the AIDA Trigger Logic Unit. The individual steps of the reconstruction chain are presented in detail.

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arXiv2020

EUTelescope: A modular reconstruction framework for beam telescope data

EUTelescope is a modular, comprehensive software framework for the reconstruction of particle trajectories recorded with beam telescopes. Its modularity allows for a flexible usage of processors each fulfilling separate tasks of the reconstruction chain such as clustering, alignment and track fitting. %The reconstruction chain is directed via XML steering files. The framework facilitates the usage of any position sensitive device for both the beam telescope sensors as well as the device under test and supports a wide range of geometric arrangements of the sensors. In this work, the functionality of the EUTelescope framework as released in v2.2 and its underlying dependencies are discussed. Various use cases with emphasis on the General Broken Lines advanced track fitting methods give examples of the work flow and capabilities of the framework.

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arXiv2020

Combining TCAD and Monte Carlo Methods to Simulate CMOS Pixel Sensors with a Small Collection Electrode using the Allpix Squared Framework

Combining electrostatic field simulations with Monte Carlo methods enables realistic modeling of the detector response for novel monolithic silicon detectors with strongly non-linear electric fields. Both the precise field description and the inclusion of Landau fluctuations and production of secondary particles in the sensor are crucial ingredients for the understanding and reproduction of detector characteristics. In this paper, a CMOS pixel sensor with small collection electrode design, implemented in a high-resistivity epitaxial layer, is simulated by integrating a detailed electric field model from finite element TCAD into a Monte Carlo based simulation with the Allpix$^2$ framework. The simulation results are compared to data recorded in test-beam measurements and very good agreement is found for various quantities such as cluster size, spatial resolution and efficiency. Furthermore, the observables are studied as a function of the intra-pixel incidence position to enable a detailed comparison with the detector behavior observed in data. The validation of such simulations is fundamental for modeling the detector response and for predicting the performance of future prototype designs. Moreover, visualization plots extracted from the charge carrier drift model of the framework can aid in understanding the charge propagation behavior in different regions of the sensor.

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arXiv2020

Silicon Vertex & Tracking Detectors for the Compact Linear Collider

CLIC is a proposed linear $e^+e^-$ collider with center-of-mass energies of up to 3 TeV. Its main objectives are precise top quark, Higgs boson and Beyond Standard Model physics. In addition to spatial resolutions of a few micrometers and a very low material budget, the vertex and tracking detectors also require timing capabilities with a precision of a few nanoseconds to allow suppression of beam-induced background particles. Different technologies using hybrid silicon detectors are explored for the vertex detectors, such as dedicated 65 nm readout ASICs, small-pitch sensors as well as bonding using anisotropic conductive films. Monolithic sensors are the current choice for the tracking detector, and a prototype using a 180 nm high-resistivity CMOS process has been designed and produced, and is currently under evaluation. Different designs using a silicon-on-insulator process are under investigation for both vertex and tracking detector. All prototypes are tested in laboratory and beam tests, and newly developed simulation tools combining Geant4 and TCAD are used to assess and optimize their performance. This contribution gives an overview of the R&D program for the CLIC vertex and tracking detectors, highlighting new results from the prototypes.

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arXiv2019

User Manual for the Corryvreckan Test Beam Data Reconstruction Framework, Version 1.0

Test beam data reconstruction is a task that requires a large amount of flexibility due to the heterogeneous data acquisition environments found in these experiments. Often, detectors with different readout schemes such as triggered, frame-based or data driven approaches are combined in a single setup. In order to correlate these data and to reconstruct particle tracks, a versatile event building algorithm and analysis framework is required. Corryvreckan is a flexible, fast and lightweight test beam data reconstruction framework based on a modular concept of the reconstruction chain. It is written in modern C++ , requires a minimum of external dependencies and is designed to be fully configurable by the user without the need to alter code. This document presents the user manual of the software as of release version 1.0.

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arXiv2019

Scattering studies with the DATURA beam telescope

High-precision particle tracking devices allow for two-dimensional analyses of the material budget distribution of particle detectors and their periphery. In this contribution, the material budget of different targets is reconstructed from the width of the angular distribution of scattered beam particle at a sample under test. Electrons in the GeV-range serve as beam particles carrying enough momentum to traverse few millimetre thick targets whilst offering sufficient deflection for precise measurement. Reference measurements of the scattering angle distribution of targets of known thicknesses are presented that serve as calibration techniques required for tomographic reconstructions of inhomogeneous objects.

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arXiv2019

Time Resolution Studies with Timepix3 Assemblies with Thin Silicon Pixel Sensors

Timepix3 is a multi-purpose readout ASIC for hybrid pixel detectors. It can measure time and energy simultaneously by employing time-of-arrival (ToA) and time-over-threshold (ToT) techniques. Both methods are systematically affected by timewalk. In this paper, a method for pixel-by-pixel calibration of the time response is presented. Assemblies of Timepix3 ASICs bump-bonded to thin planar silicon pixel sensors of different thicknesses between 50 um and 150 um are calibrated and characterised in particle beams. For minimum ionising particles, time resolutions down to 0.72 $\pm$ 0.04 ns are achieved.

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arXiv2018

A detector for CLIC: main parameters and performance

Together with the recent CLIC detector model CLICdet a new software suite was introduced for the simulation and reconstruction of events in this detector. This note gives a brief introduction to CLICdet and describes the CLIC experimental conditions at 380 GeV and 3 TeV, including beam-induced backgrounds. The simulation and reconstruction tools are introduced, and the physics performance obtained is described in terms of single particles, particles in jets, jet energy resolution and flavour tagging. The performance of the very forward electromagnetic calorimeters is also discussed.

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arXiv2018

Technologies for Future Vertex and Tracking Detectors at CLIC

CLIC is a proposed linear $e^{+}e^{-}$ collider with center-of-mass energies of up to $3\,\textrm{TeV}$. Its main objectives are precise top quark and Higgs boson measurements, as well as searches for Beyond Standard Model physics. To meet the physics goals, the vertex and tracking detectors require not only a spatial resolution of a few micrometers and a very low material budget, but also timing capabilities with a precision of a few nanoseconds to allow suppression of beam-induced backgrounds. Different technologies using hybrid silicon detectors are explored for the vertex detectors, such as dedicated readout ASICs, small-pitch active edge sensors as well as capacitively coupled High-Voltage CMOS sensors. Monolithic sensors are considered as an option for the tracking detector, and a prototype using a CMOS process with a high-resistivity epitaxial layer is being designed. Different designs using a silicon-on-insulator process are under investigation for both vertex and tracking detector. All prototypes are evaluated in laboratory and beam tests, and newly developed simulation tools combining Geant4 and TCAD are used to assess and optimize their performance. This contribution gives an overview of the R&D program for the CLIC vertex and tracking detectors, highlighting new results from the prototypes.

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arXiv2018

Allpix$^2$: A Modular Simulation Framework for Silicon Detectors

Allpix$^2$ (read: Allpix Squared) is a generic, open-source software framework for the simulation of silicon pixel detectors. Its goal is to ease the implementation of detailed simulations for both single detectors and more complex setups such as beam telescopes from incident radiation to the digitised detector response. Predefined detector types can be automatically constructed from simple model files describing the detector parameters. The simulation chain is arranged with the help of intuitive configuration files and an extensible system of modules, which implement separate simulation steps such as realistic charge carrier deposition with the Geant4 toolkit or propagation of charge carriers in silicon using a drift-diffusion model. Detailed electric field maps imported from TCAD simulations can be used to precisely model the drift behaviour of charge carriers within the silicon, bringing a new level of realism to Monte Carlo based simulations of particle detectors. This paper provides an overview of the framework and a selection of different simulation modules, and presents a comparison of simulation results with test beam data recorded with hybrid pixel detectors. Emphasis is placed on the performance of the framework itself, using a first-principles simulation of the detectors without addressing secondary ASIC-specific effects.

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