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Valeria Bragaglia

Publications and source records attributed to Valeria Bragaglia.

17 recordsLinked to original sources

Update Disturbance-Resilient Analog ReRAM Crossbar Arrays for In-Memory Deep Learning Accelerators

Resistive memory (ReRAM) technologies with crossbar array architectures hold significant potential for analog AI accelerator hardware, enabling both in-memory inference and training. Recent developments have successfully demonstrated inference acceleration by offloading compute-heavy training workloads to off-chip digital processors. However, in-memory acceleration of training algorithms is crucial for more sustainable and power-efficient AI, but still in an early stage of research. This study addresses in-memory training acceleration using analog ReRAM arrays, focusing on a key challenge during fully parallel weight updates: disturbances of the weight values in cross-point devices. A ReRAM device solution is presented on 350 nm silicon technology, utilizing a resistive switching conductive metal oxide (CMO) formed on a nanoscale conductive filament within a HfOx layer. The devices not only exhibit 60 ns fast, non-volatile analog switching, but also demonstrates outstanding resilience to update disturbances, enduring over 100k pulses. The disturbance tolerance of the ReRAM is analyzed using COMSOL Multiphysics simulations, modeling the filament-induced thermoelectric energy concentration that results in a highly nonlinear device responses to input voltage amplitudes. Disturbance-free parallel weight mapping is also demonstrated on the back-end-of-line integrated ReRAM array chip. Finally, comprehensive hardware-aware neural network simulations validate the potential of our ReRAM for in-memory deep learning accelerators capable of fully parallel weight updates.

cs.ET↗

Study of Resistive Switching Dynamics and Memory States Equilibria in Analog Filamentary Conductive-Metal-Oxide/HfOx ReRAM via Compact Modeling

Resistive Random Access Memory (ReRAM) devices offer a promising solution for next-generation non-volatile memory and neuromorphic computing systems. Yet, existing compact models fail to capture analog resistive switching behavior of ReRAM devices. This work presents an advanced physics-based compact model for analog filamentary Conductive-Metal-Oxide (CMO)/HfOx ReRAM, capable of reproducing switching characteristics over a broad range of operating conditions. Compared to the state-of-the-art, the model extends the dynamic interplay between ion migration and electron hopping, while also accounting for parasitic resistive elements. Simulations of various voltage inputs are tested to reproduce quasi-static I-V curves, SET switching kinetics under single-pulse programming conditions, and analog accumulative conductance modulation upon bipolar identical pulse streams. Additional simulations reveal the physical criterion underlying the stabilization of the CMO/HfOx-based ReRAM memory state around the equilibrium point, namely symmetry point, under pulsing conditions when a fading memory mechanism emerges. Building upon the evidence of such equilibrium stabilization under pulsing and quasi-static conditions, a procedure is established to visualize and map equilibrium memory states across different input domains. The physical model supports design optimization of switching behavior for analog neuromorphic systems and non-volatile memory architectures. It also enables accurate integrated circuit simulations with CMO/HfOx-based ReRAM technology.

cs.ET↗

Unsupervised local learning based on voltage-dependent synaptic plasticity for resistive and ferroelectric synapses

The deployment of AI on edge computing devices faces significant challenges related to energy consumption and functionality. These devices could greatly benefit from brain-inspired learning mechanisms, allowing for real-time adaptation while using low-power. In-memory computing with nanoscale resistive memories may play a crucial role in enabling the execution of AI workloads on these edge devices. In this study, we introduce voltage-dependent synaptic plasticity (VDSP) as an efficient approach for unsupervised and local learning in memristive synapses based on Hebbian principles. This method enables online learning without requiring complex pulse-shaping circuits typically necessary for spike-timing-dependent plasticity (STDP). We show how VDSP can be advantageously adapted to three types of memristive devices (TiO$_2$, HfO$_2$-based metal-oxide filamentary synapses, and HfZrO$_4$-based ferroelectric tunnel junctions (FTJ)) with disctinctive switching characteristics. System-level simulations of spiking neural networks incorporating these devices were conducted to validate unsupervised learning on MNIST-based pattern recognition tasks, achieving state-of-the-art performance. The results demonstrated over 83% accuracy across all devices using 200 neurons. Additionally, we assessed the impact of device variability, such as switching thresholds and ratios between high and low resistance state levels, and proposed mitigation strategies to enhance robustness.

cs.NE↗

Analytical Modelling of the Transport in Analog Filamentary Conductive-Metal-Oxide/HfOx ReRAM Devices

The recent co-optimization of memristive technologies and programming algorithms enabled neural networks training with in-memory computing systems. In this context, novel analog filamentary conductive-metal-oxide (CMO)/HfOx redox-based resistive switching memory (ReRAM) represents a key technology. Despite device performance enhancements reported in literature, the underlying mechanism behind resistive switching is not fully understood. This work presents the first physics-based analytical model of the current transport and of the resistive switching in these devices. As a case study, analog TaOx/HfOx ReRAM devices are considered. The current transport is explained by a trap-to-trap tunneling process, and the resistive switching by a modulation of the defect density within the sub-band of the TaOx that behaves as electric field and temperature confinement layer. The local temperature and electric field distributions are derived from the solution of the electric and heat transport equations in a 3D finite element ReRAM model. The intermediate resistive states are described as a gradual modulation of the TaOx defect density, which results in a variation of its electrical conductivity. The drift-dynamics of ions during the resistive switching is analytically described, allowing the estimation of defect migration energies in the TaOx layer. Moreover, the role of the electro-thermal properties of the CMO layer is unveiled. The proposed analytical model accurately describes the experimental switching characteristic of analog TaOx/HfOx ReRAM devices, increasing the physical understanding and providing the equations necessary for circuit simulations incorporating this technology.

cs.ET↗

Decoupling Electric Field and Temperature-Driven Atomistic Forming Mechanisms in TaOx/HfO2-Based ReRAMs using Reactive Molecular Dynamics Simulations

Resistive random access memories (ReRAMs) with a bilayer TaOx/HfO2 stack structure have shown unique multi-level resistive switching capabilities. However, the physical processes governing their behavior, and specifically the atomistic mechanisms of forming, remain poorly understood. In this work, we present a detailed analysis of the forming mechanism at the atomic level using molecular dynamics (MD) simulations. An extended charge equilibration scheme, based on a combination of the charge transfer ionic potential (CTIP) formalism and the electrochemical dynamics with implicit degrees of freedom (EChemDID) method, is employed to model the localized effects of applied voltage. Our simulations reveal that tantalum ions exhibit the highest displacement under applied voltage, followed by hafnium ions, while oxygen ions respond only minimally. This results in the formation of a tantalum-depleted, oxygen-rich zone near the positive top electrode (anode), and the clustering of oxygen vacancies near the negative bottom electrode (cathode), where the conductive filament nucleates. This ionic segregation partially shields the bulk dielectric from the applied electric field, hindering further migration of ions in the vertical direction. We find that a minimum threshold voltage is required to initiate vacancy clustering. Filament growth proceeds through a localized mechanism, driven by thermally activated generation of oxygen vacancy defects, which are stabilized near the edge of the nucleated filament at the cathode.

cond-mat.mtrl-sci↗

All-in-One Analog AI Hardware: On-Chip Training and Inference with Conductive-Metal-Oxide/HfOx ReRAM Devices

Analog in-memory computing is an emerging paradigm designed to efficiently accelerate deep neural network workloads. Recent advancements have focused on either inference or training acceleration. However, a unified analog in-memory technology platform-capable of on-chip training, weight retention, and long-term inference acceleration-has yet to be reported. This work presents an all-in-one analog AI accelerator, combining these capabilities to enable energy-efficient, continuously adaptable AI systems. The platform leverages an array of analog filamentary conductive-metal-oxide (CMO)/HfOx resistive switching memory cells (ReRAM) integrated into the back-end-of-line (BEOL). The array demonstrates reliable resistive switching with voltage amplitudes below 1.5V, compatible with advanced technology nodes. The array multi-bit capability (over 32 stable states) and low programming noise (down to 10nS) enable a nearly ideal weight transfer process, more than an order of magnitude better than other memristive technologies. Inference performance is validated through matrix-vector multiplication simulations on a 64x64 array, achieving a root-mean-square error improvement by a factor of 20 at 1 second and 3 at 10 years after programming, compared to state-of-the-art. Training accuracy closely matching the software equivalent is achieved across different datasets. The CMO/HfOx ReRAM technology lays the foundation for efficient analog systems accelerating both inference and training in deep neural networks.

cs.ET↗

Electroforming Kinetics in HfOx/Ti RRAM: Mechanisms Behind Compositional and Thermal Engineering

A critical issue affecting filamentary resistive random access memory (RRAM) cells is the requirement of high voltages during electroforming. Reducing the magnitude of these voltages is of significant interest, as it ensures compatibility with Complementary Metal-Oxide-Semiconductor (CMOS) technologies. Previous studies have identified that changing the initial stoichiometry of the switching layer and/or implementing thermal engineering approaches has an influence over the electroforming voltage magnitude, but the exact mechanisms remain unclear. Here, we develop an understanding of how these mechanisms work within a standard a-HfO$_x$/Ti RRAM stack through combining atomistic driven-Kinetic Monte Carlo (d-KMC) simulations with experimental data. By performing device-scale simulations at atomistic resolution, we can precisely model the movements of point defects under applied biases in structurally inhomogeneous materials, which allows us to not only capture finite-size effects but also to understand how conductive filaments grow under different electroforming conditions. Doing atomistic simulations at the device-level also enables us to link simulations of the mechanisms behind conductive filament formation with trends in experimental data with the same material stack. We identify a transition from primarily vertical to lateral ion movement dominating the filamentary growth process in sub-stoichiometric oxides, and differentiate the influence of global and local heating on the morphology of the formed filaments. These different filamentary structures have implications for the dynamic range exhibited by formed devices in subsequent SET/RESET operations. Overall, our results unify the complex ion dynamics in technologically relevant HfO$_x$/Ti-based stacks, and provide guidelines that can be leveraged when fabricating devices.

cond-mat.mtrl-sci↗

Hardware Implementation of Ring Oscillator Networks Coupled by BEOL Integrated ReRAM for Associative Memory Tasks

We demonstrate the first hardware implementation of an oscillatory neural network (ONN) utilizing resistive memory (ReRAM) for coupling elements. A ReRAM crossbar array chip, integrated into the Back End of Line (BEOL) of CMOS technology, is leveraged to establish dense coupling elements between oscillator neurons, allowing phase-encoded analog information to be processed in-memory. We also realize an ONN architecture design with the coupling ReRAM array. To validate the architecture experimentally, we present a conductive metal oxide (CMO)/HfOx ReRAM array chip integrated with a 2-by-2 ring oscillator-based network. The system successfully retrieves patterns through correct binary phase locking. This proof of concept underscores the potential of ReRAM technology for large-scale, integrated ONNs.

cs.ET↗

Edge Training and Inference with Analog ReRAM Technology for Hand Gesture Recognition

Tactile hand gesture recognition is a crucial task for user control in the automotive sector, where Human-Machine Interactions (HMI) demand low latency and high energy efficiency. This study addresses the challenges of power-constrained edge training and inference by utilizing analog Resistive Random Access Memory (ReRAM) technology in conjunction with a real tactile hand gesture dataset. By optimizing the input space through a feature engineering strategy, we avoid relying on large-scale crossbar arrays, making the system more suitable for edge deployment. Through realistic hardware-aware simulations that account for device non-idealities derived from experimental data, we demonstrate the functionalities of our analog ReRAM-based analog in-memory computing for on-chip training, utilizing the state-of-the-art Tiki-Taka algorithm. Furthermore, we validate the classification accuracy of approximately 91.4% for post-deployment inference of hand gestures. The results highlight the potential of analog ReRAM technology and crossbar architecture with fully parallelized matrix computations for real-time HMI systems at the Edge.

eess.SP↗

Understanding the Growth and Properties of Sputter-Deposited Phase-Change Superlattice Films

Highly textured chalcogenide films have recently gained significant interest for phase-change memory applications. Several reports have highlighted that programming efficiency improves in devices featuring superlattice stacks, such as Ge2Sb2Te5/Sb2Te3. However, to be technologically relevant, these films must be deposited on foundry-scale wafers using processes compatible with back end of the line (BEOL) integration and complementary metal-oxide-semiconductor (CMOS) technology, such as, for example, sputter deposition. In this work, we present our observations on the influence of temperature, pressure, and seeding layer parameters on the sputter growth processes of superlattice films. By measuring various material properties, we construct a pseudo-phase diagram to illustrate the growth of both individual and superlattice films with different periodicities on technologically relevant substrates, namely SiO2 and carbon. These results provide important insights into the structure, intermixing and electro-optical properties of superlattice films,

cond-mat.mtrl-sci↗

Highly Reproducible and CMOS-compatible VO2-based Oscillators for Brain-inspired Computing

With remarkable electrical and optical switching properties induced at low power and near room temperature (68C), vanadium dioxide (VO2) has sparked rising interest in unconventional computing among the phase-change materials research community. The scalability and the potential to compute beyond the von Neumann model make VO2 especially appealing for implementation in oscillating neural networks for artificial intelligence (AI) applications, to solve constraint satisfaction problems, and for pattern recognition. Its integration into large networks of oscillators on a Silicon platform still poses challenges associated with the stabilization in the correct oxidation state and the ability to fabricate a structure with predictable electrical behavior showing very low variability. In this work, the role played by the different annealing parameters applied by three methods (slow thermal annealing, flash annealing, and rapid thermal annealing), following the vanadium oxide atomic layer deposition (ALD), on the formation of VO2 grains is studied and an optimal substrate stack configuration that minimizes variability between devices is proposed. Material and electrical characterizations are performed on the different films and a step-by-step recipe to build reproducible VO2-based oscillators is presented, which is argued to be made possible thanks to the introduction of a hafnium oxide (HfO2) layer between the silicon substrate and the vanadium oxide layer. Up to seven nearly identical VO2-based devices are contacted simultaneously to create a network of oscillators, paving the way for large-scale implementation of VO2 oscillating neural networks.

physics.app-ph↗

A BEOL Compatible, 2-Terminals, Ferroelectric Analog Non-Volatile Memory

A Ferroelectric Analog Non-Volatile Memory based on a WOx electrode and ferroelectric HfZrO$_4$ layer is fabricated at a low thermal budget (~375$^\circ$C), enabling BEOL processes and CMOS integration. The devices show suitable properties for integration in crossbar arrays and neural network inference: analog potentiation/depression with constant field or constant pulse width schemes, cycle to cycle and device to device variation <10%, ON/OFF ratio up to 10 and good linearity. The physical mechanisms behind the resistive switching and conduction mechanisms are discussed.

cs.AR↗

A Back-End-Of-Line Compatible, Ferroelectric Analog Non-Volatile Memory

A Ferroelectric Analog Non-Volatile Memory based on a WOx electrode and ferroelectric HfZrO4 layer is fabricated at a low thermal budget (~375C), enabling BEOL processes and CMOS integration. The devices show suitable properties for integration in crossbar arrays and neural network inference: analog potentiation/depression with constant field or constant pulse width schemes, cycle to cycle and device to device variation <10%, ON/OFF ratio up to 10 and good linearity. The physical mechanisms behind the resistive switching and conduction mechanisms are discussed.

cs.AR↗

A back-end, CMOS compatible ferroelectric Field Effect Transistor for synaptic weights

Neuromorphic computing architectures enable the dense co-location of memory and processing elements within a single circuit. This co-location removes the communication bottleneck of transferring data between separate memory and computing units as in standard von Neuman architectures for data-critical applications including machine learning. The essential building blocks of neuromorphic systems are non-volatile synaptic elements such as memristors. Key memristor properties include a suitable non-volatile resistance range, continuous linear resistance modulation and symmetric switching. In this work, we demonstrate voltage-controlled, symmetric and analog potentiation and depression of a ferroelectric Hf$_{57}$Zr$_{43}$O$_{2}$ (HZO) field effect transistor (FeFET) with good linearity. Our FeFET operates with a low writing energy (fJ) and fast programming time (40 ns). Retention measurements have been done over 4-bits depth with low noise (1%) in the tungsten oxide (WO$_{x}$) read out channel. By adjusting the channel thickness from 15nm to 8nm, the on/off ratio of the FeFET can be engineered from 1% to 200% with an on-resistance ideally >100 kOhm, depending on the channel geometry. The device concept is using earth-abundant materials, and is compatible with a back end of line (BEOL) integration into complementary metal-oxidesemiconductor (CMOS) processes. It has therefore a great potential for the fabrication of high density, large-scale integrated arrays of artificial analog synapses.

cs.ET↗

Mapping the band structure of GeSbTe phase change alloys around the Fermi level

Phase change alloys are used for non-volatile random access memories exploiting the conductivity contrast between amorphous and metastable, crystalline phase. However, this contrast has never been directly related to the electronic band structure. Here, we employ photoelectron spectroscopy to map the relevant bands for metastable, epitaxial GeSbTe films. The constant energy surfaces of the valence band close to the Fermi level are hexagonal tubes with little dispersion perpendicular to the (111) surface. The electron density responsible for transport belongs to the tails of this bulk valence band, which is broadened by disorder, i.e., the Fermi level is 100 meV above the valence band maximum. This result is consistent with transport data of such films in terms of charge carrier density and scattering time. In addition, we find a state in the bulk band gap with linear dispersion, which might be of topological origin.

cond-mat.mtrl-sci↗

Sub-nanometre resolution of atomic motion during electronic excitation in phase-change materials

Phase-change materials based on Ge-Sb-Te alloys are widely used in industrial applications such as nonvolatile memories, but reaction pathways for crystalline-to-amorphous phase-change on picosecond timescales remain unknown. Femtosecond laser excitation and an ultrashort x-ray probe is used to show the temporal separation of electronic and thermal effects in a long-lived ($>$100 ps) transient metastable state of Ge$_{2}$Sb$_{2}$Te$_{5}$ with muted interatomic interaction induced by a weakening of resonant bonding. Due to a specific electronic state, the lattice undergoes a reversible nondestructive modification over a nanoscale region, remaining cold for 4 ps. An independent time-resolved x-ray absorption fine structure experiment confirms the existence of an intermediate state with disordered bonds. This newly unveiled effect allows the utilization of non-thermal ultra-fast pathways enabling artificial manipulation of the switching process, ultimately leading to a redefined speed limit, and improved energy efficiency and reliability of phase-change memory technologies.

cond-mat.mtrl-sci↗

Interband characterization and electronic transport control of nanoscaled GeTe/Sb$_2$Te$_3$ superlattices

The extraordinary electronic and optical properties of the crystal-to-amorphous transition in phase-change materials led to important developments in memory applications. A promising outlook is offered by nanoscaling such phase-change structures. Following this research line, we study the interband optical transmission spectra of nanoscaled GeTe/Sb$_2$Te$_3$ chalcogenide superlattice films. We determine, for films with varying stacking sequence and growth methods, the density and scattering time of the free electrons, and the characteristics of the valence-to-conduction transition. It is found that the free electron density decreases with increasing GeTe content, for sub-layer thickness below $\sim$3 nm. A simple band model analysis suggests that GeTe and Sb$_2$Te$_3$ layers mix, forming a standard GeSbTe alloy buffer layer. We show that it is possible to control the electronic transport properties of the films by properly choosing the deposition layer thickness and we derive a model for arbitrary film stacks.

cond-mat.mes-hall↗