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Vijay Gopal Thirupakuzi Vangipuram

Publications and source records attributed to Vijay Gopal Thirupakuzi Vangipuram.

8 recordsLinked to original sources

Interface Doping Mechanism of p-Type Conductivity in Mist-CVD-Grown LiGa5O8 Thin Films

LiGa5O8 is an ultrawide-bandgap oxide semiconductor that has recently been experimentally demonstrated to exhibit p-type conductivity; however, the origin of the observed p-type transport remains poorly understood. In this work, we investigate the origin of p-type conductivity by systematically comparing the electrical, compositional, and structural properties of mist chemical vapor deposition (mist-CVD) grown LiGa5O8 thin films exhibiting either p-type conductivity or insulating behavior under different growth conditions. The p-conductive films exhibit room-temperature hole concentrations on the order of 10^18 cm^-3. The emergence of p-type conductivity is found to be strongly correlated with the elemental composition of the films, with X-ray photoelectron spectroscopy (XPS) revealing a reduced Li/Ga ratio in the p-conductive films, indicative of a Li-deficient composition. Raman spectroscopy and X-ray diffraction (XRD) further reveal signatures of \b{eta}-Ga2O3 in the p-conductive films that are absent in the insulating films, demonstrating the formation of a secondary \b{eta}-Ga2O3 phase. Considering the reported type-II band alignment between LiGa5O8 and \b{eta}-Ga2O3, together with theoretically predicted acceptor levels associated Li vacancies (V_Li) in LiGa5O8, the formation of mixed LiGa5O8/\b{eta}-Ga2O3 phases is proposed to facilitate electron transfer from the \b{eta}-Ga2O3 valence band to acceptor states in LiGa5O8, thereby promoting hole accumulation and p-type conductivity.

cond-mat.mtrl-sci↗

Microwave Performance of all MOCVD-grown AlScN/GaN MIS-HEMTs on Semi-Insulating GaN Substrates

We report on the design, fabrication, and characterization of all MOCVD-grown long-gate AlScN/GaN metal-insulator-semiconductor high electron mobility transistors (MIS-HEMTs) on semi-insulating GaN substrates. Devices with a gate length of $1~μ$m and gate-drain spacing of $0.9~μ$ m exhibit a maximum drain current density of 1 A/mm, an on/off current ratio of $2\times 10^5$, and a three-terminal breakdown voltage of 63 V. The device has near-ideal subthreshold characteristics with a subthreshold swing of 63 mV/dec and a current dispersion as low as 7.8$\%$ at 10 V due to the excellent interfacial quality with a trap density ($D_\mathrm{it}$) of $2.11\times{10}^{11}~\mathrm{cm}^{-2}eV^{-1}$ and the semi-insulating GaN substrate with a low threading dislocation density. Small-signal RF measurements reveal an $f_\mathrm{T}/f_\mathrm{max}$ of 25.8/51.1 GHz, while large-signal load-pull characterization at 10 GHz demonstrates an output power density of 4.04 W/mm with a power-added efficiency of 22.7$\%$. In addition, a minimum noise figure below 2.5 dB was measured over a wide drain current range from 100 mA/mm to 700 mA/mm below 6 GHz. These results extend previous demonstrations of short-gate MOCVD-grown AlScN/GaN HEMTs to the long-gate, high-voltage regime, confirming the robustness of this material system for both high-frequency and high-power device applications with favorable microwave noise performance.

physics.app-ph↗

Metalorganic Chemical Vapor Deposition of AlScN Thin Films and AlScN/AlN/GaN Heterostructures

AlScN thin films were grown via metalorganic chemical vapor deposition (MOCVD), showing controllable incorporation of scandium (Sc) into the AlN lattices. Systematic variation of growth parameters demonstrated an obvious influence on Sc incorporation, with X-ray photoelectron spectroscopy (XPS) analysis indicating Sc composition up to $\sim$13\% when (MCp)$_2$ScCl was used as the precursor. AlScN/AlN/GaN heterostructures grown on GaN templates exhibited the formation of a two-dimensional electron gas (2DEG) channel at the AlScN/AlN--GaN interface, confirming their potential use in high electron mobility transistor (HEMT) device technologies. Variation in AlScN/AlN barrier thickness within the heterostructures showed that thicker barriers yield higher sheet charge densities from both Hall and capacitance-voltage (C--V) measurements. With an AlScN/AlN barrier thickness of $\sim$30~nm, a sheet charge density of $5.22\times10^{12}$~cm$^{-2}$ was extracted from C--V. High-resolution scanning transmission electron microscopy (S/TEM) further confirmed Sc incorporation and revealed the wurtzite crystalline structure of the films and heterostructures. These results establish MOCVD growth of AlScN as a promising and compatible material for advancing III-nitride heterostructures in high-performance electronics and potentially ferroelectrics.

cond-mat.mtrl-sci↗

Electrical and Structural Properties of In-Situ MOCVD Grown Al$_2$O$_3$/$β$-Ga$_2$O$_3$ and Al$_2$O$_3$/$β$-(Al$_x$Ga$_{1-x}$)$_2$O$_3$ MOSCAPs

This study investigates the electrical and structural properties of MOSCAPs with in-situ MOCVD-grown Al$_2$O$_3$ dielectrics on (010) $β$-Ga$_2$O$_3$ and $β$-(Al$_x$Ga$_{1-x}$)$_2$O$_3$ films. The Al$_2$O$_3$/$β$-Ga$_2$O$_3$ MOSCAPs showed a strong dependence on Al$_2$O$_3$ deposition temperature. At 900$^\circ$C, reduced voltage hysteresis ($\sim$0.3 V) and improved reverse breakdown voltage (74.5 V) were observed, with breakdown fields of 5.01 MV/cm in Al$_2$O$_3$ and 4.11 MV/cm in $β$-Ga$_2$O$_3$. At 650$^\circ$C, higher hysteresis ($\sim$3.44 V) and lower reverse breakdown voltage (38.8 V) were observed, with breakdown fields of 3.69 MV/cm in Al$_2$O$_3$ and 2.87 MV/cm in $β$-Ga$_2$O$_3$. However, forward breakdown fields improved from 5.62 MV/cm (900$^\circ$C) to 7.25 MV/cm (650$^\circ$C). STEM revealed improved crystallinity and sharper interfaces at 900$^\circ$C, enhancing reverse breakdown performance. For Al$_2$O$_3$/$β$-(Al$_x$Ga$_{1-x}$)$_2$O$_3$ MOSCAPs, increasing Al composition ($x$ = 5.5\% to 9.2\%) reduced carrier concentration and improved reverse breakdown fields from 2.55 to 2.90 MV/cm in $β$-(Al$_x$Ga$_{1-x}$)$_2$O$_3$ and 2.41 to 3.13 MV/cm in Al$_2$O$_3$. Forward breakdown fields in Al$_2$O$_3$ improved from 5.0 to 5.4 MV/cm as Al composition increased. STEM confirmed compositional homogeneity and excellent stoichiometry of Al$_2$O$_3$ and $β$-(Al$_x$Ga$_{1-x}$)$_2$O$_3$ layers. These findings highlight the robust electrical performance, high breakdown fields, and structural quality of Al$_2$O$_3$/$β$-Ga$_2$O$_3$ and Al$_2$O$_3$/$β$-(Al$_x$Ga$_{1-x}$)$_2$O$_3$ MOSCAPs for high-power applications.

physics.app-ph↗

Optimizing Metal-Organic Chemical Vapor Deposition for Ultrawide Band-Gap MgSiN2 Thin Films

Orthorhombic II-IV nitride semiconductors offer an expanded and more tunable material set with unique properties, while maintaining close compatibility with the wurtzite crystal structure of the III-nitrides. In particular, MgSiN2, a II-IV nitride closely lattice matched to GaN and AlN has a band gap suitable for photonic applications in the UV-C wavelength region. MgSiN2 is also a promising candidate to exhibit ferroelectricity, which has only been observed in very few nitride materials. This study builds on our previous work on the metal-organic chemical vapor deposition (MOCVD) of MgSiN2 thin films grown on GaN-on-sapphire and c-plane sapphire substrates by exploring higher growth temperature windows, resulting in higher crystalline quality and improved interfaces. Correlations between the growth conditions (Mg:Si precursor molar flow rate ratio, reactor pressure, and growth temperatures from 900C to 960C) and the resultant film quality are investigated for films grown on GaN-on-sapphire. High-resolution transmission electron microscopy (HR-TEM) reveals high-quality orthorhombic single-crystal MgSiN2, confirming successful epitaxial growth on GaN. Optical transmittance measurements indicate the direct band gap is 6.34-6.36 eV and indirect band gap is 5.77-5.81 eV, affirming the realization of an ultrawide-band gap II-IV nitride semiconductor that is structurally compatible with existing III-nitride device platforms.

cond-mat.mtrl-sci↗

Metal-organic chemical vapor deposition of MgGeN2 films on GaN and sapphire

MgGeN2 films were synthesized using metal-organic chemical vapor deposition on GaN/c-sapphire templates and c-plane sapphire substrates. Energy-dispersive X-ray spectroscopy was used to estimate the cation composition ratios. To mitigate magnesium evaporation, the films were grown at pyrometer temperature 745 °C with a wafer rotation speed of 1000 rpm. Growth rates were determined by fitting energy-dispersive X-ray spectroscopy spectra to film thicknesses using NIST DTSA-II software. The thickness estimates determined by this method were consistent with scanning transmission electron microscopy measurements done for selected samples. Scanning electron microscopy images revealed faceted surfaces indicative of a tendency toward three-dimensional growth. X-ray diffraction spectra confirmed that the films were highly crystalline and exhibited preferential orientation in alignment with the substrate. Atomic force microscopy measurements show that film thicknesses are consistent across samples grown on both GaN templates and sapphire substrates, with typical roughnesses around 10 nm. Transmittance spectra of films grown on double-side-polished sapphire substrates yielded band gaps of 4.28 +- 0.06 eV for samples exhibiting close-to-ideal stoichiometry. Comparison of the measured spectra with ab initio calculations are in good agreement both near the band gap and at higher energies where excitation is into higher-lying bands. These findings provide insight into the growth and characterization of MgGeN2, contributing to the development of this material for potential applications in optoelectronics and power electronics.

cond-mat.mtrl-sci↗

Metal-organic chemical vapor deposition of MgSiN$_{2}$ thin films

Orthorhombic-structured II-IV nitrides provide a promising opportunity to expand the material platform while maintaining compatibility with the wurtzite crystal structure of the traditional III-nitride material system. Among them, MgSiN$_{2}$ stands out due to its close compatibility with GaN and AlN and its theoretically predicted ultrawide direct band gap of 6.28 eV. In this work, the growth of MgSiN$_{2}$ thin films on GaN-on-sapphire and c-plane sapphire substrates was investigated using metal-organic chemical vapor deposition (MOCVD). MOCVD growth conditions were correlated with film quality and crystallinity for samples grown on GaN-on-sapphire substrates. The effects of Mg:Si precursor molar flow rate ratios and growth pressure at two different temperatures, 745$^{\circ}$C and 850$^{\circ}$C, were studied comprehensively. High-resolution scanning transmission electron microscopy (STEM) imaging confirmed the formation of high-quality, single-crystal MgSiN$_{2}$ films. Optical band gap extraction from transmittance measurements yielded direct band gap values ranging from 6.13 eV to 6.27 eV for samples grown under various conditions, confirming the realization of an ultrawide-band gap, III-nitride-compatible, II-IV-nitride material.

cond-mat.mtrl-sci↗

7.86 kV GaN-on-GaN PN Power Diode with BaTiO3 for Electrical Field Management

Device based on GaN have great potential for high power switching applications due to its high breakdown field and high electron mobility. In this work, we present the device design of a vertical GaN-on-GaN PN power diode using high dielectric constant (high-k) dielectrics for electrical field management and high breakdown voltages, in together with guard-rings and a field plate. The fabricated diodes with a 57 um thick drift layer demonstrated a breakdown voltage of 7.86 kV on a bulk GaN substrate. The device has an on-resistance of 2.8 mohm.cm2 and a Baliga figure of merit of 22 GW/cm2.

physics.app-ph↗