arXiv subjects

Yinxuan Zhu

Publications and source records attributed to Yinxuan Zhu.

8 recordsLinked to original sources

arXiv2026

AlN Gate Interlayer for UWBG AlGaN Transistors with Breakdown Field >6.9 MV/cm and PFOM >1.8 GW/cm2

We report the demonstration of regrown epitaxial AlN gate interlayers with ultra-wide bandgap (UWBG) AlGaN polarization-graded field effect transistors (PolFETs). The introduction of the epitaxial AlN gate interlayer enables significant improvement in breakdown strength, with average breakdown field exceeding 6.94 MV/cm, which represents state-of-the-art for lateral field effect transistors, while maintaining excellent on-state current density exceeding 1 A/mm. The integration of epitaxial AlN enables state-of-the-art power-switching figure of merit exceeding 1.87 GW/cm2 at a breakdown voltage exceeding 1.45 kV. This work shows the potential of UWBG AlGaN for next-generation high-power switching and RF applications with enhanced device performance established by a high-quality epitaxially regrown AlN gate interlayer.

physics.app-ph↗

arXiv2026

High Breakdown Field Multi-kV UWBG AlGaN Transistors

We demonstrate high-performance UWBG AlGaN PolFETs exhibiting a state-of-the-art combination of nearly 1 A/mm on-state current (~ 960 mA/mm) and large breakdown field (> 4.8 MV/cm) in high carrier density (1.15 x 1013 cm-2). Multi-kV robustness is successfully demonstrated exhibiting 1.28 and 2.17 kV by utilizing a gate-connected field plate structures in 3.9 and 6.8 μm LGD, corresponding to the extremely low specific on-resistance of 1.25 and 2.86 mΩcm2, respectively. High RF performance is also achieved, providing fT and fMAX, of 8.5 and 15 GHz, respectively, for 3.9 μm LGD. These results highlight UWBG AlGaN as a platform for both high-voltage RF and power applications.

physics.app-ph↗

arXiv2025

Ultra-Wide Bandgap AlGaN Heterostructure Field Effect Transistors with Current Gain Cutoff Frequency Above 85 GHz

We report the design and demonstration of ultra-wide-bandgap (UWBG) AlGaN polarization-graded field-effect transistors (PolFETs) that achieve a current-gain cutoff frequency above 85 GHz and a current density exceeding 1.3 A/mm. Ultra-thin channel and buffer layers were grown epitaxially on AlN substrates, and a reverse-graded AlGaN contact layer was incorporated to reduce the contact resistance to below 1 ohm.mm. With aggressively scaled device dimensions, the AlGaN PolFETs exhibit state-of-the-art high-frequency performance for UWBG transistors. Small-signal modeling reveals both parasitic and transit delays, confirming the benefits of reduced access resistance and enhanced intrinsic transconductance. These results establish a new performance benchmark for UWBG AlGaN devices and demonstrate their strong potential for next-generation millimeter-wave electronics.

physics.app-ph↗

arXiv2025

Scaled Ultra-Wide Bandgap AlGaN Polarization-Graded FET with Ultra-thin Buffer Layer

We report on the design and demonstration of ultra-wide bandgap AlGaN polarization-graded field effect transistors with ultra-thin channels to enable excellent current density and high-frequency performance while significantly reducing thermal resistance. We use polarization-graded AlGaN layers and ultra-thin pseudomorphic AlGaN buffer layers to enable low thermal resistance and excellent structural quality. The polarization-graded field effect transistors (PolFETs) demonstrated here show Imax over 800mA/mm and current/power gain cutoff frequency (fT/fmax) of 26/28 GHz. Small signal modeling and analysis were used to determine parasitic/transit delays, and gate-resistance thermometry was implemented to thermally characterize AlGaN PolFET and benchmark against state-of-the-art AlGaN HEMTs. The ultra-thin AlGaN PolFET showed thermal resistance of 12 K.mm/W, representing a significant reduction from typical AlGaN transistors. These results show state-of-art combination of high current density, excellent fT-LG product for ultra-wide bandgap AlGaN transistors, and superior thermal performance, and highlight the promise of AlGaN transistors for future RF and mm-wave applications.

physics.app-ph↗

arXiv2025

Barrier Electrostatics and Contact Engineering for Ultra-Wide Bandgap AlGaN HFETs

We report ultra-wide bandgap (UWBG) AlGaN heterostructure field-effect transistors (HFETs) exhibiting a high breakdown field (> 5.3 MV/cm) and a low contact resistance (~1.55 Ωmm), tailored for high-power radiofrequency applications. A split-doped barrier architecture, employing two distinct doping concentrations, is shown to enhance both the breakdown field and contact resistance. This design enables a state-of-the-art combination of maximum drain current (487 mA/mm) and breakdown field, along with a high cutoff frequency of 7.2 GHz. These results demonstrate a viable pathway to push device performance toward the material limits while minimizing contact resistance in UWBG AlGaN HFETs, paving the way for next-generation high-power, high-frequency applications.

cond-mat.mtrl-sci↗

arXiv2025

High Breakdown Electric Field (> 5 MV/cm) in UWBG AlGaN Transistors

We report on the design and demonstration of ultra-wide bandgap (UWBG) AlGaN-channel metal-insulator heterostructure field effect transistors (HEFTs) for high-power, high-frequency applications. We find that the integration of gate dielectrics and field plates greatly improves the breakdown field in these devices, with state-of-art average breakdown field of 5.3 MV/cm (breakdown voltage > 260 V) with an associated maximum current density of 342 mA/mm, and cut-off frequency of 9.1 GHz. Furthermore, low trap-related impact was observed from minimal gate and drain lag estimated from pulsed I-V characteristics. The reported results provide the potential of UWBG AlGaN HEFTs for the next generation high-power radio frequency applications.

cond-mat.mtrl-sci↗

arXiv2025

Energy Bands and Breakdown Characteristics in Al2O3/UWBG AlGaN Heterostructures

We report on energy bands and breakdown characteristics of Al2O3 dielectrics on ultra-wide bandgap (UWBG) AlGaN heterostructures. Metal-dielectric-semiconductor structures are important to sustain high fields needed for future high-performance UWBG transistors. Using systematic experiments, we determined the fixed charge density (> 1013 cm-2), the dielectric/interface, and electric fields in the oxide of under flat-band conditions in the semiconductor. Low gate-to-drain leakage current of up to 5 x 10-7 A/cm2 were obtained in the metal-oxide-semiconductor structures. In lateral metal-semiconductor-insulator test structures, breakdown voltage exceeding 1 kV was obtained with a channel sheet charge density of 1.27 x 1013 cm-2. The effective peak electric field and average breakdown field were estimated to be > 4.27 MV/cm and 1.99 MV/cm, respectively. These findings demonstrate the potential of Al2O2 integration for enhancing the breakdown performance of UWBG AlGaN HEMTs.

cond-mat.mtrl-sci↗

arXiv2024

Heterostructure and Interfacial Engineering for Low-Resistance Contacts to Ultra-Wide Bandgap AlGaN

We report on the heterostructure and interfacial engineering of metalorganic chemical vapor deposition (MOCVD) grown reverse-graded contacts to ultra-wide bandgap AlGaN. A record low contact resistivity of 1.4 x 10-6 Ohm.cm2 was reported on an Al0.82Ga0.18N metal semiconductor field effect transistor (MESFET) by compositionally grading the contact layer from Al0.85Ga0.15N to Al0.14Ga0.86N with degenerate doping and proper interfacial engineering considering bandgap-narrowing-induced band offset between channel and contact layer. This represents orders-of-magnitude of lower contact resistivity than that obtained in similar MOCVD-grown structures. A detailed, layer-by-layer analysis of the reverse graded contact and TCAD simulation of the bandgap narrowing effect highlighted that the reverse graded contact layer itself is extremely conductive and interfacial resistance due to bandgap-narrowing-induced barrier between contact and channel dominates the contact resistance.

cond-mat.mtrl-sci↗