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arXiv · 0807.0283

Electronic cooling of a submicron-sized metallic beam

J. T. Muhonen·A. O. Niskanen·M. Meschke·Yu. A. Pashkin·J. S. Tsai·L. Sainiemi·S. Franssila·J. P. Pekola
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Abstract

We demonstrate electronic cooling of a suspended AuPd island using superconductor-insulator-normal metal tunnel junctions. This was achieved by developing a simple fabrication method for reliably releasing narrow submicron sized metal beams. The process is based on reactive ion etching and uses a conducting substrate to avoid charge-up damage and is compatible with e.g. conventional e-beam lithography, shadow-angle metal deposition and oxide tunnel junctions. The devices function well and exhibit clear cooling; up to factor of two at sub-kelvin temperatures.

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J. T. Muhonen, A. O. Niskanen, M. Meschke, Yu. A. Pashkin, J. S. Tsai, L. Sainiemi, S. Franssila, J. P. Pekola. 2008-09-26. Electronic cooling of a submicron-sized metallic beam. https://doi.org/10.1063/1.3080668

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