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arXiv · 1608.08279

Thermal and Tensile Strength Testing of Thermally-Conductive Adhesives and Carbon Foam

Maxwell Chertok·Minmin Fu·Michael Irving·Christian Neher·Mengyao Shi·Kirk Tolfa·Mani Tripathi·Yasmeen Vinson·Ruby Wang·Gayle Zheng
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Abstract

Future collider detectors, including silicon tracking detectors planned for the High Luminosity LHC, will require components and mechanical structures providing unprecedented strength-to-mass ratios, thermal conductivity, and radiation tolerance. This paper studies carbon foam used in conjunction with thermally conductive epoxy and thermally conductive tape for such applications. Thermal performance and tensile strength measurements of aluminum-carbon foam-adhesive stacks are reported, along with initial radiation damage test results.

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Maxwell Chertok, Minmin Fu, Michael Irving, Christian Neher, Mengyao Shi, Kirk Tolfa, Mani Tripathi, Yasmeen Vinson, Ruby Wang, Gayle Zheng. 2016-08-29. Thermal and Tensile Strength Testing of Thermally-Conductive Adhesives and Carbon Foam. https://doi.org/10.1088/1748-0221/12/01/p01010

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