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arXiv · 2201.08585

Readout system and testbeam results of the RD50-MPW2 HV-CMOS pixel chip

Patrick Sieberer·Thomas Bergauer·Klemens Floeckner·Christian Irmler·Helmut Steininger
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Abstract

The RD50-CMOS group aims to design and study High Voltage CMOS (HVCMOS) chips for use in a high radiation environment. Currently, measurements are performed on RD50-MPW2 chip, the second prototype developed by this group. The active matrix of the prototype consists of 8x8 pixels with analog front end. Details of the analog front end and simulations have been already published earlier. This contribution focuses on the Caribou based readout system of the active matrix. Each pixel of the active matrix can be readout one after the other. Relevant aspects of hardware, firmware and software are introduced. As a first stage, firmware for a standalone setup is introduced and details on data flow are given. Afterwards, a second stage of the firmware capable of synchronizing with other detectors and accepting triggers is presented, focusing on operation of the chip in combination with a tracking telescope to measure efficiency and residuals.

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Patrick Sieberer, Thomas Bergauer, Klemens Floeckner, Christian Irmler, Helmut Steininger. 2022-01-21. Readout system and testbeam results of the RD50-MPW2 HV-CMOS pixel chip. https://doi.org/10.1088/1742-6596%2F2374%2F1%2F012096

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