Effect of oxygen content on optical, structural, and dielectric properties of Al$_x$Ta$_y$O$_z$$ thin films

Abstract

This study reports on the optical, structural, and dielectric properties of aluminum tantalum oxide (Al$_x$Ta$_y$O$_z$) thin films deposited at low temperature on silicon and steel substrates by pulsed direct current reactive magnetron sputtering of a target containing 80 at.% aluminum and 20 at.% tantalum in Ar/O$_2$ atmosphere. Oxygen flow rates ranging from 5.0 to 20 sccm corresponded to O content changes from 57.7 to 69.6 at.% and resulted in large differences in dielectric behavior, from films with no measurable dielectric strength to a dielectric strength of 231 V$\mu$m$^{-1}$, respectively. Ab initio calculations were employed to explain the large property changes, and we show that a decrease in the dielectric strength can be linked to the formation of metal-metal bonds in the material, when the O content is less than what would correspond to a stoichiometric Ta$_2$O$_5$ and Al$_2$O$_3$ mixture. The electronic states corresponding to the metal--metal bonds are located in the band gap close to the top of the valence band, leading to an effective band gap reduction, which is directly supported by X-ray photoelectron spectroscopy valence band measurements and by a broad optical absorption in the visible region.