Bending-like stress induced by solder joint under uniaxial tensile testing in 2G-HTS tapes: Impact and optimization approach

Abstract

The reversible stress limit (\mathit{R}_{rev}) of second-generation high-temperature superconducting (2G-HTS) tapes is a critical performance indicator, typically characterized through uniaxial tensile testing. In practice, the accuracy of the measured Rrev value is often compromised by stress concentration induced by the voltage tap solder joint. The present study investigates the underlying interference mechanism using integrated experimental and numerical methods. Mechanistic analysis reveals that under uniaxial tensile loading, the local geometric inhomogeneity introduced by the solder joint induces an external, bending-like stress in the vicinity of the solder joint, transitioning from additional tensile stress in the zone adjacent to the joint to additional compressive stress in the zone remote from it. When the solder joint is attached to the front surface of the tape (the side closer to the superconducting layer), the superconducting layer experiences localized additional tensile stress, triggering premature damage and early \mathit{I}_{c} degradation. Consequently, an optimized back-surface soldering approach is proposed, which positions the superconducting layer in a localized compressive zone. Experimental validation demonstrates that the proposed approach effectively mitigates testing errors for various tape configurations. Notably, for the tape with a copper layer thickness of 5 {\mu}m, the measured \mathit{R}_{rev} increased from 546 MPa to 734 MPa, corresponding to a 42% increase, and moved closer to the actual value. The findings provide essential insights for the precision characterization of the electromechanical performances (EMPs) of 2G-HTS tapes.