Ultra-high Q-factor superconducting tantalum resonators on 300 mm Si wafers

Abstract

Superconducting resonators are central to superconducting quantum information technologies and essential for bosonic qubit architectures, where long-lived storage modes enable hardware-efficient error correction. Achieving ultra-high quality factors in scalable planar circuits is challenging because multiple dissipation channels contribute to the total loss. Here we report planar $\alpha$-Ta resonators fabricated on 300 mm ultra-high-resistivity ($>10$ k$\Omega$ cm) intrinsic silicon using industrial processes, achieving median internal Q factors exceeding 40 million and maxima above 60 million. Energy-participation-ratio analysis identifies a dominant participation-controlled interface loss mechanism and places conservative upper bounds on substrate-associated dissipation. For the best-performing substrate, the inferred substrate loss tangent is below $1.0 \times 10^{-8}$, establishing industrial MCZ silicon among the lowest-loss substrate platforms reported for superconducting resonators. At the same time, the exceptionally low losses show no clear correlation with commonly cited silicon substrate metrics such as room-temperature resistivity or impurity concentrations. More broadly, these studies establish industrial 300 mm processing, careful interface engineering, and 300 mm MCZ silicon substrates as a promising platform for resonator-heavy superconducting quantum architectures with ultra-high quality factors.