Single Photon Counting X-ray Imaging with Si and CdTe Single Chip Pixel Detectors and Multichip Pixel Modules

Peter Fischer; Sven Krimmel; Hans Krueger; Markus Lindner; Mario Loecker; Kazuhiro Nakazawa; Tadayuki Takahashi; Norbert Wermes

doi:10.1109/tns.2004.832610

arXiv · physics/0312070

Single Photon Counting X-ray Imaging with Si and CdTe Single Chip Pixel Detectors and Multichip Pixel Modules

Peter Fischer·Sven Krimmel·Hans Krueger·Markus Lindner·Mario Loecker·Kazuhiro Nakazawa·Tadayuki Takahashi·Norbert Wermes

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Abstract

Multichip modules (MCM) with 4 single photon counting MPEC 2.3 chips bump bonded to 1.3 cm x 1.3 cm large CdTe and Si semiconductor sensors as well as to single chip pixel detectors have been successfully built and operated. The MPEC 2.3 chip provides a pixel count rate up to 1 MHz with a large dynamic range of 18 bit, 2 counters and energy windowing with continuously adjustable thresholds. Each MPEC has 32 x 32 pixels of 200 um x 200 um pixel size. For a MCM the 4 chips are arranged in a 2 x 2 array which leads to a 64 x 64 sensor pixel geometry. The MCM construction is described, and the imaging performance of the different detectors is shown. As readout system a newly developed USB system has been used.

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Peter Fischer, Sven Krimmel, Hans Krueger, Markus Lindner, Mario Loecker, Kazuhiro Nakazawa, Tadayuki Takahashi, Norbert Wermes. 2003-12-11. Single Photon Counting X-ray Imaging with Si and CdTe Single Chip Pixel Detectors and Multichip Pixel Modules. https://doi.org/10.1109/tns.2004.832610

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