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Maurizio Boscardin

Publications and source records attributed to Maurizio Boscardin.

At least 19 recordsLinked to original sources

Timing resolution from beam tests on thin LGADs down to 16.6 ps

The paper reports on the timing resolution achieved with Low-Gain Avalanche Diodes (LGADs), optimised for extreme-fluence conditions, at the DESY Test Beam Facility using 4~GeV/c electrons. The LGADs adopt an $n$-in-$p$ technology with a $p^{+}$-type boron gain implant, co-implanted with carbon to mitigate acceptor deactivation due to irradiation. The substrate thickness of the sensors varies from 20 to 45~\micron, with an active area spanning from 0.75~$\times$~0.75 to 1.28~$\times$~1.28~mm$^{2}$. The experimental setup consisted of a 45~\micron-thick trigger sensor with an active area of 3.6~$\times$~3.6~mm$^{2}$, two device-under-test (DUT) planes, and a Photonis micro-channel plate photomultiplier tube (MCP) as a time reference. Data taking was performed at the ambient temperature of the facility, at 18$^{\circ}$C. The gain was measured between 7 and 40 across all non-irradiated sensors in the study. The timing resolution was calculated from a Gaussian fitting of the difference in times of arrival of a particle at the DUT and the MCP, using the constant fraction discriminator technique. A timing resolution of 26.4~\ps was achieved in 45~\micron-thick sensors, down to 16.6~\ps in 20~\micron-thick sensors, in the non-irradiation study. The combination of two 20~\micron-thick LGADs reached a timing resolution of 12.2~\ps. A set of 30~\micron-thick sensors irradiated with neutrons at fluences between 0.4~$\times$~10$^{15}$ and 2.5~$\times$~10$^{15}$~\mevneut were tested in the beam. These irradiated sensors achieved a gain between 7 and 30 using a similar apparatus but cooled with solidified CO$_{2}$ to -42$^{\circ}$C. A timing resolution of 20~\ps was obtained in these irradiated sensors.

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Single-photon counting pixel detector for soft X-rays

Soft X-ray experiments at synchrotron light sources are essential for a wide range of research fields. However, commercially available detectors for this energy range often cannot deliver the necessary combination of quantum efficiency, signal-to-noise ratio, dynamic range, speed, and radiation hardness within a single system. While hybrid detectors have addressed these challenges effectively in the hard X-ray regime, specifically with single photon counting pixel detectors extensively used in high-performance synchrotron applications, similar solutions are desired for energies below 2 keV. In this work, we introduce the first single-photon-counting hybrid pixel detector capable of detecting X-ray energies as low as 550 eV, utilizing the internal amplification of Low-Gain Avalanche Diode (LGAD) sensors. This detector is thoroughly characterized in terms of Signal-to-Noise Ratio and Detective Quantum Efficiency. We demonstrate its capabilities through ptychographic imaging at MAX IV 4th generation synchrotron light source at the Fe L$_3$-edge (707 eV), showcasing the enhanced detection performance of the system. This development sets a new benchmark for soft X-ray applications at synchrotrons, paving the way for significant advancements in imaging and analysis at lower photon energies.

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Compensated LGAD optimisation through van der Pauw test structures

A new gain implant design has recently been introduced to enhance the radiation resistance of low-gain avalanche diodes (LGADs) to the extreme fluences anticipated in future hadron colliders like FCC-hh. This design utilises an engineered compensation of two opposing types of doping implants, requiring a thorough analysis of their evolution due to irradiation. To this end, the experimental measurements of their initial test structures have been compared with Technology CAD simulations both before and after irradiation. From the measurement-simulation comparison regarding C-V characteristics, the donor removal at high initial donor concentrations ($>10^{16}$ at/cm$^3$) used in Compensated LGADs has been studied, along with how donor co-implantation influences the beneficial effect of carbon to slow acceptor removal. Furthermore, an innovative application of van der Pauw test structures, typically employed by foundries to monitor process quality, has been implemented. The doping removal of the single implants used in Compensated LGADs has been estimated by examining the variation in sheet resistance with irradiation through these structures.

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Design and optimisation of radiation resistant AC- and DC-coupled resistive LGADs

Future high-energy physics experiments require a paradigm shift in radiation detector design. In response to this challenge, resistive LGADs that combine Low Gain Avalanche Diode technology with resistive readout have been developed. The prototypes created so far, employing AC-coupled contacts, have demonstrated impressive performance, achieving a temporal resolution of 38 ps and a spatial resolution of 15 $μ$m with a pixel pitch of 450 $μ$m. To tackle some of the issues encountered up to this point, particularly the non-uniform response across the entire surface of the detector, a new version with DC-coupled contacts has recently been developed. The Synopsys Sentaurus TCAD simulations that have guided the design of their first production, released by the Fondazione Bruno Kessler in November 2024, will be presented below along with a concise summary of the history of the prototypes with AC-coupled contacts.

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New developments in 3D-trench electrode sensors

Future high-luminosity hadron collider experiments feature unprecedented levels of event pile-up and extreme radiation environments, calling for sensors capable of 4D tracking, even after significant radiation damage. To this purpose, 3D sensors represent a viable solution, since they provide excellent radiation tolerance and very good temporal resolution. In particular, owing to the uniform electric field and weighting field distributions, 3D-trench electrode sensors from the INFN TIMESPOT project have shown a temporal resolution of $\sim$10 ps after irradiation fluences up to 1$\times$10$^{17}$ 1-Mev n$_{eq}$/cm$^2$. In spite of the excellent performance of these sensors, 3D-trench pixel technology is not yet fully established and the fabrication yield is not yet adequate for the production of large size pixel sensors. To improve the potential of the 3D-trench concept for large-area sensors, a new batch of sensors was designed at the University of Trento and fabricated at FBK, as part of the AIDA Innova project. Besides introducing some process improvements, this batch includes two different sensor variants: the standard one with continuous ohmic trenches, and a modified one with dashed ohmic trenches. On-wafer electrical test results show that most of the sensors have low leakage current and high breakdown voltage. Moreover, the fabrication yield for the new design variant is higher than that of the standard design.

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Evidence of Charge Multiplication in Thin $25 \mathrm{μm} \times 25 \mathrm{μm}$ Pitch 3D Silicon Sensors

Characterization measurements of $25~\mathrm{μm} \times 25~\mathrm{μm}$ pitch 3D silicon sensors are performed, for devices with active thickness of $150~μ$m. Evidence of charge multiplication caused by impact ionization below the breakdown voltage is observed in sensors operated at $-45~^\circ\mathrm{C}$. Small-pitch 3D silicon sensors have potential as high precision 4D tracking detectors that are also able to withstand radiation fluences beyond $10^{16}$~n$_{\rm eq}/$cm$^2$. This is applicable for use at future facilities such as the High-Luminosity Large Hadron Collider and the Future Circular Collider. Characteristics of these devices are compared to those of similar sensors of pitch $50~\mathrm{μm}\times 50~\mathrm{μm}$, showing comparable charge collection at low voltage, and acceptable leakage current, depletion voltage, breakdown voltage, and capacitance despite the extremely small cell size. The unirradiated $25~\mathrm{μm} \times 25~\mathrm{μm}$ sensors exhibit charge multiplication above about 90 V reverse bias, while, as predicted, no multiplication is observed in the $50~\mathrm{μm} \times 50~\mathrm{μm}$ sensors below their breakdown voltage. The maximum gain observed below breakdown is 1.33.

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Characterization of iLGADs using soft X-rays

Experiments at synchrotron radiation sources and X-ray Free-Electron Lasers in the soft X-ray energy range ($250$eV--$2$keV) stand to benefit from the adaptation of the hybrid silicon detector technology for low energy photons. Inverse Low Gain Avalanche Diode (iLGAD) sensors provide an internal gain, enhancing the signal-to-noise ratio and allowing single photon detection below $1$keV using hybrid detectors. In addition, an optimization of the entrance window of these sensors enhances their quantum efficiency (QE). In this work, the QE and the gain of a batch of different iLGAD diodes with optimized entrance windows were characterized using soft X-rays at the Surface/Interface:Microscopy beamline of the Swiss Light Source synchrotron. Above $250$eV, the QE is larger than $55\%$ for all sensor variations, while the charge collection efficiency is close to $100\%$. The average gain depends on the gain layer design of the iLGADs and increases with photon energy. A fitting procedure is introduced to extract the multiplication factor as a function of the absorption depth of X-ray photons inside the sensors. In particular, the multiplication factors for electron- and hole-triggered avalanches are estimated, corresponding to photon absorption beyond or before the gain layer, respectively.

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Development of LGAD sensors with a thin entrance window for soft X-ray detection

We show the developments carried out to improve the silicon sensor technology for the detection of soft X-rays with hybrid X-ray detectors. An optimization of the entrance window technology is required to improve the quantum efficiency. The LGAD technology can be used to amplify the signal generated by the X-rays and to increase the signal-to-noise ratio, making single photon resolution in the soft X-ray energy range possible. In this paper, we report first results obtained from an LGAD sensor production with an optimized thin entrance window. Single photon detection of soft X-rays down to 452~eV has been demonstrated from measurements, with a signal-to-noise ratio better than 20.

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A Compensated Design of the LGAD Gain Layer

In this contribution, we present an innovative design of the Low-Gain Avalanche Diode (LGAD) gain layer, the p$^+$ implant responsible for the local and controlled signal multiplication. In the standard LGAD design, the gain layer is obtained by implanting $\sim$ 5E16/cm$^3$ atoms of an acceptor material, typically Boron or Gallium, in the region below the n$^{++}$ electrode. In our design, we aim at designing a gain layer resulting from the overlap of a p$^+$ and an n$^+$ implants: the difference between acceptor and donor doping will result in an effective concentration of about 5E16/cm$^3$, similar to standard LGADs. At present, the gain mechanism of LGAD sensors under irradiation is maintained up to a fluence of $\sim$ 1-2E15/cm$^2$, and then it is lost due to the acceptor removal mechanism. The new design will be more resilient to radiation, as both acceptor and donor atoms will undergo removal with irradiation, but their difference will maintain constant. The compensated design will empower the 4D tracking ability typical of the LGAD sensors well above 1E16/cm$^2$.

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Characterization of timing and spacial resolution of novel TI-LGAD structures before and after irradiation

The characterization of spacial and timing resolution of the novel Trench Isolated LGAD (TI-LGAD) technology is presented. This technology has been developed at FBK with the goal of achieving 4D pixels, where an accurate position resolution is combined in a single device with the precise timing determination for Minimum Ionizing Particles (MIPs). In the TI-LGAD technology, the pixelated LGAD pads are separated by physical trenches etched in the silicon. This technology can reduce the interpixel dead area, mitigating the fill factor problem. The TI-RD50 production studied in this work is the first one of pixelated TI-LGADs. The characterization was performed using a scanning TCT setup with an infrared laser and a $^{90}$Sr source setup.

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Optimization of the Gain Layer Design of Ultra-Fast Silicon Detectors

In the past few years, the need of measuring accurately the spatial and temporal coordinates of the particles generated in high-energy physics experiments has spurred a strong R\&D in the field of silicon sensors. Within these research activities, the so-called Ultra-Fast Silicon Detectors (UFSDs), silicon sensors optimized for timing based on the Low-Gain Avalanche Diode (LGAD) design, have been proposed and adopted by the CMS and ATLAS collaborations for their respective timing layers. The defining feature of the Ultra-Fast Silicon Detectors (UFSDs) is the internal multiplication mechanism, determined by the gain layer design. In this paper, the performances of several types of gain layers, measured with a telescope instrumented with a $^{90}$Sr $β$-source, are reported and compared. The measured sensors are produced by Fondazione Bruno Kessler (FBK) and Hamamatsu Photonics (HPK). The sensor yielding the best performance, both when new and irradiated, is an FBK 45\mum-thick sensor with a carbonated deep gain implant, where the carbon and the boron implants are annealed concurrently with a low thermal load. This sensor is able to achieve a time resolution of 40~ps up to a radiation fluence of~\fluence{2.5}{15}, delivering at least 5~fC of charge.

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Intrinsic time resolution of 3D-trench silicon pixels for charged particle detection

In the last years, high-resolution time tagging has emerged as the tool to tackle the problem of high-track density in the detectors of the next generation of experiments at particle colliders. Time resolutions below 50ps and event average repetition rates of tens of MHz on sensor pixels having a pitch of 50$μ$m are typical minimum requirements. This poses an important scientific and technological challenge on the development of particle sensors and processing electronics. The TIMESPOT initiative (which stands for TIME and SPace real-time Operating Tracker) aims at the development of a full prototype detection system suitable for the particle trackers of the next-to-come particle physics experiments. This paper describes the results obtained on the first batch of TIMESPOT silicon sensors, based on a novel 3D MEMS (micro electro-mechanical systems) design. Following this approach, the performance of other ongoing silicon sensor developments has been matched and overcome, while using a technology which is known to be robust against radiation degradation. A time resolution of the order of 20ps has been measured at room temperature suggesting also possible improvements after further optimisations of the front-end electronics processing stage.

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Hydrogenated amorphous silicon detectors for particle detection, beam flux monitoring and dosimetry in high-dose radiation environment

Hydrogenated amorphous silicon (a-Si:H) has remarkable radiation resistance properties and can be deposited on a lot of different substrates. A-Si:H based particle detectors have been built since mid 1980s as planar p-i-n or Schottky diode structures; the thickness of these detectors ranged from 1 to 50 micron. However MIP detection using planar structures has always been problematic due to the poor S/N ratio related to the high leakage current at high depletion voltage and the low charge collection efficiency. The usage of 3D detector architecture can be beneficial for the possibility to reduce inter-electrode distance and increase the thickness of the detector for larger charge generation compared to planar structures. Such a detector can be used for future hadron colliders for its radiation resistance and also for X-ray imaging. Furthermore the possibility of a-Si:H deposition on flexible materials (like kapton) can be exploited to build flexible and thin beam flux measurement detectors and x-ray dosimeters.

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Results on Proton-Irradiated 3D Pixel Sensors Interconnected to RD53A Readout ASIC

Test beam results obtained with 3D pixel sensors bump-bonded to the RD53A prototype readout ASIC are reported. Sensors from FBK (Italy) and IMB-CNM (Spain) have been tested before and after proton-irradiation to an equivalent fluence of about $1$ $\times$ $10^{16}$ $\text{n}_{\text{eq}}$ cm$^{-2}$ (1 MeV equivalent neutrons). This is the first time that one single collecting electrode fine pitch 3D sensors are irradiated up to such fluence bump-bonded to a fine pitch ASIC. The preliminary analysis of the collected data shows no degradation on the hit detection efficiencies of the tested sensors after high energy proton irradiation, demonstrating the excellent radiation tolerance of the 3D pixel sensors. Thus, they will be excellent candidates for the extreme radiation environment at the innermost layers of the HL-LHC experiments.

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Characterization of FBK small-pitch 3D diodes after neutron irradiation up to 3.5x10**16 neq cm**-2

We report on the characterization by a position resolved laser system of small-pitch 3D diodes irradiated with neutrons up to an extremely high fluence of 3.5x10**16 neq cm**-2. We show that very high values of signal efficiency are obtained, in good agreement with the geometrical expectation based on the small values of the inter-electrode spacings, and also boosted by charge multiplication effects at high voltage. These results confirm the very high radiation tolerance of small-pitch 3D sensors well beyond the maximum fluences expected at the High Luminosity LHC.

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Thin and edgeless sensors for ATLAS pixel detector upgrade

To cope with the harsh environment foreseen at the high luminosity conditions of HL- LHC, the ATLAS pixel detector has to be upgraded to be fully efficient with a good granularity, a maximized geometrical acceptance and an high read out rate. LPNHE, FBK and INFN are involved in the development of thin and edgeless planar pixel sensors in which the insensitive area at the border of the sensor is minimized thanks to the active edge technology. In this paper we report on two productions, a first one consisting of 200 μm thick n-on-p sensors with active edge, a second one composed of 100 and 130 μm thick n-on-p sensors. Those sensors have been tested on beam, both at CERN-SPS and at DESY and their performance before and after irradiation will be presented.

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Performance of active edge pixel sensors

To cope with the High Luminosity LHC harsh conditions, the ATLAS inner tracker has to be upgraded to meet requirements in terms of radiation hardness, pile up and geometrical acceptance. The active edge technology allows to reduce the insensitive area at the border of the sensor thanks to an ion etched trench which avoids the crystal damage produced by the standard mechanical dicing process. Thin planar n-on-p pixel sensors with active edge have been designed and produced by LPNHE and FBK foundry. Two detector module prototypes, consisting of pixel sensors connected to FE-I4B readout chips, have been tested with beams at CERN and DESY. In this paper the performance of these modules are reported. In particular the lateral extension of the detection volume, beyond the pixel region, is investigated and the results show high hit-efficiency also at the detector edge, even in presence of guard rings.

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Development of New 3D Pixel Sensors for Phase 2 Upgrades at LHC

We report on the development of new 3D pixel sensors for the Phase 2 Upgrades at the High-Luminosity LHC (HL-LHC). To cope with the requirements of increased pixel granularity (e.g., 50x50 or 25x100 um2 pixel size) and extreme radiation hardness (up to a fluence of 2e16 neq cm-2), thinner 3D sensors (~100 um) with electrodes having narrower size (~ 5 um) and reduced spacing (~ 30 um) are considered. The paper covers TCAD simulations, as well as technological and design aspects relevant to the first batch of these 3D sensors, that is currently being fabricated at FBK on 6-inch wafers.

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