First Demonstration of HZO/beta-Ga2O3 Ferroelectric FinFET with Improved Memory Window

Seohyeon Park; Jaewook Yoo; Hyeojun Song; Hongseung Lee; Seongbin Lim; Soyeon Kim; Minah Park; Bongjoong Kim; Keun Heo; Peide D. Ye; Hagyoul Bae

arXiv · 2407.18187

First Demonstration of HZO/beta-Ga2O3 Ferroelectric FinFET with Improved Memory Window

Seohyeon Park·Jaewook Yoo·Hyeojun Song·Hongseung Lee·Seongbin Lim·Soyeon Kim·Minah Park·Bongjoong Kim·Keun Heo·Peide D. Ye·Hagyoul Bae

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Abstract

We have experimentally demonstrated the effectiveness of beta-gallium oxide (beta-Ga2O3) ferroelectric fin field-effect transistors (Fe-FinFETs) for the first time. Atomic layer deposited (ALD) hafnium zirconium oxide (HZO) is used as the ferroelectric layer. The HZO/beta-Ga2O3 Fe-FinFETs have wider counterclockwise hysteresis loops in the transfer characteristics than that of conventional planar FET, achieving record-high memory window (MW) of 13.9 V in a single HZO layer. When normalized to the actual channel width, FinFETs show an improved ION/IOFF ratio of 2.3x10^7 and a subthreshold swing value of 110 mV/dec. The enhanced characteristics are attributed to the low-interface state density (Dit), showing good interface properties between the beta-Ga2O3 and HZO layer. The enhanced polarization due to larger electric fields across the entire ferroelectric layer in FinFETs is validated using Sentaurus TCAD. After 5x10^6 program/erase (PGM/ERS) cycles, the MW was maintained at 9.2 V, and the retention time was measured up to 3x10^4 s with low degradation. Therefore, the ultrawide bandgap (UWBG) Fe-FinFET was shown to be one of the promising candidates for high-density non-volatile memory devices.

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Seohyeon Park, Jaewook Yoo, Hyeojun Song, Hongseung Lee, Seongbin Lim, Soyeon Kim, Minah Park, Bongjoong Kim, Keun Heo, Peide D. Ye, Hagyoul Bae. 2024-07-25. First Demonstration of HZO/beta-Ga2O3 Ferroelectric FinFET with Improved Memory Window. https://arxiv.org/abs/2407.18187

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