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arXiv · 2605.13281

Development of Small-pitch, Ultra-thin 3D Silicon Sensors at USTC

Kuo Ma·De Zhang·Shengjia He·Tian-ao Wang·Han Li·Yu Nie·Xiuxia Wang·Jinlan Peng·Zheng Liang·Xiang Li·Wenhua Shi·Manwen Liu·Chuan Liao·Zheng Li·Zebo Tang·Yanwen Liu
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Abstract

We report on the development of 3D silicon sensors at the University of Science and Technology of China (USTC). The sensor involves columnar electrodes (5 um in diameter) of both doping types, etched from the same wafer side. The p+ electrodes pass through the epitaxial wafer, whereas the n+ electrodes stop at a short distance from the opposite side of the epitaxial wafer. With respect to previous generations of 3D sensors, they feature an ultra-thin active substrate (50 um) and a small pixel size of 50 um x 50 um or 25 um x 25 um. This R&D project aims to establish a sensor technology to simultaneously measure position and time information at the single-pixel level. The first run with one merged wafer layout has been completed. The design, fabrication, and characterization of the sensors are reported in this paper.

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Kuo Ma, De Zhang, Shengjia He, Tian-ao Wang, Han Li, Yu Nie, Xiuxia Wang, Jinlan Peng, Zheng Liang, Xiang Li, Wenhua Shi, Manwen Liu, Chuan Liao, Zheng Li, Zebo Tang, Yanwen Liu. 2026-05-13. Development of Small-pitch, Ultra-thin 3D Silicon Sensors at USTC. https://arxiv.org/abs/2605.13281

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